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Drivers, Receivers, Transceivers
Total Products: 14,109
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
| N/A | USB3329C-GL-TR | Microchip Technology | IC TRANSCEIVER HALF 1/1 25WLCSP | Drivers, Receivers, Transceivers | 25-WLCSP (1.97x1.97) | - | -40°C ~ 85°C | Type: Transceiver Protocol: USB Number of Drivers/Receivers: 1/1 Duplex: Half Receiver Hysteresis: 150 mV Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 25-WLCSP Supplier Device Package: 25-WLCSP (1.97×1.97) | 189 | ||
 | USB3330E-GL-TR | Microchip Technology | IC TRANSCEIVER HALF 25WLCSP | Drivers, Receivers, Transceivers | 25-WLCSP | - | -40°C ~ 85°C | Type: Transceiver Protocol: USB 2.0 Duplex: Half Receiver Hysteresis: 150 mV Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 25-WLCSP Supplier Device Package: 25-WLCSP | 1,320 | ||
 | USB3331E-GL-TR | Microchip Technology | IC TRANSCEIVER HALF 25WLCSP | Drivers, Receivers, Transceivers | 25-WLCSP (1.99x1.99) | - | -40°C ~ 85°C | Type: Transceiver Protocol: USB 2.0 Duplex: Half Receiver Hysteresis: 150 mV Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 25-UFBGA Supplier Device Package: 25-WLCSP (1.99×1.99) | 1,111 | ||
 | USB3333E-GL-TR | Microchip Technology | IC TRANSCEIVER HALF 25WLCSP | Drivers, Receivers, Transceivers | 25-WLCSP (1.97x1.97) | - | -40°C ~ 85°C | Type: Transceiver Protocol: USB 2.0 Duplex: Half Receiver Hysteresis: 150 mV Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 25-WLCSP Supplier Device Package: 25-WLCSP (1.97×1.97) | 461 | ||
 | USB3336E-GL-TR | Microchip Technology | IC TRANSCEIVER HALF 25WLCSP | Drivers, Receivers, Transceivers | 25-WLCSP (1.97x1.97) | - | -40°C ~ 85°C | Type: Transceiver Protocol: USB 2.0 Duplex: Half Receiver Hysteresis: 150 mV Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 25-WLCSP Supplier Device Package: 25-WLCSP (1.97×1.97) | 1,453 | ||
 | USB3338E-GL-TR | Microchip Technology | IC TRANSCEIVER HALF 25WLCSP | Drivers, Receivers, Transceivers | 25-WLCSP (1.97x1.97) | - | -40°C ~ 85°C | Type: Transceiver Protocol: USB 2.0 Duplex: Half Receiver Hysteresis: 150 mV Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 25-WLCSP Supplier Device Package: 25-WLCSP (1.97×1.97) | 1,263 | ||
 | USB3340-EZK | Microchip Technology | IC TRANSCEIVER 1/1 32QFN | Drivers, Receivers, Transceivers | 32-QFN | - | -40°C ~ 85°C | Type: Transceiver Protocol: USB 2.0 Number of Drivers/Receivers: 1/1 Receiver Hysteresis: 150 mV Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-QFN | 1,148 | ||
 | USB3340-EZK-TR | Microchip Technology | IC TRANSCEIVER 1/1 32QFN | Drivers, Receivers, Transceivers | 32-QFN | - | -40°C ~ 85°C | Type: Transceiver Protocol: USB 2.0 Number of Drivers/Receivers: 1/1 Receiver Hysteresis: 150 mV Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-QFN | 958 | ||
 | USB3341-CP | Microchip Technology | IC TRANSCEIVER 1/1 24QFN | Drivers, Receivers, Transceivers | 24-QFN (4x4) | - | -40°C ~ 85°C | Type: Transceiver Protocol: USB 2.0 Number of Drivers/Receivers: 1/1 Receiver Hysteresis: 150 mV Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 24-VFQFN Exposed Pad Supplier Device Package: 24-QFN (4×4) | 733 | ||
 | USB3341-CP-TR | Microchip Technology | IC TRANSCEIVER 1/1 24QFN | Drivers, Receivers, Transceivers | 24-QFN (4x4) | - | -40°C ~ 85°C | Type: Transceiver Protocol: USB 2.0 Number of Drivers/Receivers: 1/1 Receiver Hysteresis: 150 mV Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 24-VFQFN Exposed Pad Supplier Device Package: 24-QFN (4×4) | 1,195 | ||
 | USB3343-CP | Microchip Technology | IC TRANSCEIVER 1/1 24QFN | Drivers, Receivers, Transceivers | 24-QFN (4x4) | - | -40°C ~ 85°C | Type: Transceiver Protocol: USB 2.0 Number of Drivers/Receivers: 1/1 Receiver Hysteresis: 150 mV Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 24-VFQFN Exposed Pad Supplier Device Package: 24-QFN (4×4) | 33 | ||
 | USB3343-CP-TR | Microchip Technology | IC TRANSCEIVER 1/1 24QFN | Drivers, Receivers, Transceivers | 24-QFN (4x4) | - | -40°C ~ 85°C | Type: Transceiver Protocol: USB 2.0 Number of Drivers/Receivers: 1/1 Receiver Hysteresis: 150 mV Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 24-VFQFN Exposed Pad Supplier Device Package: 24-QFN (4×4) | 222 | ||
| N/A | USB3346-CP | Microchip Technology | IC TRANSCEIVER 1/1 24QFN | Drivers, Receivers, Transceivers | 24-QFN (4x4) | - | -40°C ~ 85°C | Type: Transceiver Protocol: USB 2.0 Number of Drivers/Receivers: 1/1 Receiver Hysteresis: 150 mV Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 24-VFQFN Exposed Pad Supplier Device Package: 24-QFN (4×4) | 868 | ||
 | USB3346-CP-TR | Microchip Technology | IC TRANSCEIVER 1/1 24QFN | Drivers, Receivers, Transceivers | 24-QFN (4x4) | - | -40°C ~ 85°C | Type: Transceiver Protocol: USB 2.0 Number of Drivers/Receivers: 1/1 Receiver Hysteresis: 150 mV Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 24-VFQFN Exposed Pad Supplier Device Package: 24-QFN (4×4) | 682 | ||
 | USB3347-CP | Microchip Technology | IC TRANSCEIVER 1/1 24QFN | Drivers, Receivers, Transceivers | 24-QFN (4x4) | - | -40°C ~ 85°C | Type: Transceiver Protocol: USB 2.0 Number of Drivers/Receivers: 1/1 Receiver Hysteresis: 150 mV Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 24-VFQFN Exposed Pad Supplier Device Package: 24-QFN (4×4) | 129 | ||
 | USB3347-CP-TR | Microchip Technology | IC TRANSCEIVER 1/1 24QFN | Drivers, Receivers, Transceivers | 24-QFN (4x4) | - | -40°C ~ 85°C | Type: Transceiver Protocol: USB 2.0 Number of Drivers/Receivers: 1/1 Receiver Hysteresis: 150 mV Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 24-VFQFN Exposed Pad Supplier Device Package: 24-QFN (4×4) | 667 | ||
 | USB3370B-EZK-TR | Microchip Technology | IC TRANSCEIVER 32QFN | Drivers, Receivers, Transceivers | 32-QFN (5x5) | 3.3V | -40°C ~ 85°C | Type: Transceiver Protocol: USB Voltage – Supply: 3.3V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-QFN (5×5) | 638 | ||
| N/A | USB3450-FZG | Microchip Technology | IC TRANSCEIVER 40QFN | Drivers, Receivers, Transceivers | 40-QFN (6x6) | 3V ~ 3.6V | 0°C ~ 70°C | Type: Transceiver Protocol: USB Voltage – Supply: 3V ~ 3.6V Operating Temperature: 0°C ~ 70°C Mounting Type: Surface Mount Package / Case: 40-VFQFN Exposed Pad Supplier Device Package: 40-QFN (6×6) | 643 | ||
| N/A | V103AYLF | Renesas | IC DRIVER 10BIT 64TQFP | Drivers, Receivers, Transceivers | 64-TQFP (10x10) | 3V ~ 3.6V | -20°C ~ 85°C | Type: Driver Protocol: LVDS Voltage – Supply: 3V ~ 3.6V Operating Temperature: -20°C ~ 85°C Mounting Type: Surface Mount Package / Case: 64-TQFP Supplier Device Package: 64-TQFP (10×10) | 1,144 | ||
 | V104YLF | Renesas | IC RECEIVER 10BIT 64TQFP | Drivers, Receivers, Transceivers | 64-TQFP (10x10) | 3V ~ 3.6V | -20°C ~ 85°C | Type: Receiver Protocol: LVDS Voltage – Supply: 3V ~ 3.6V Operating Temperature: -20°C ~ 85°C Mounting Type: Surface Mount Package / Case: 64-TQFP Supplier Device Package: 64-TQFP (10×10) | 1,461 |
About Drivers, Receivers, & Transceivers
Drivers, receivers, and transceivers provide the necessary hardware infrastructure to facilitate long-distance communication. In industrial control systems, components such as foot switches often interface with these devices to trigger machine-level actions through simple on/off signal inputs. Their exact functionality varies based on the communication protocol employed, but they often include features like transient suppression to enhance signal integrity and reliability. While not strictly necessary for communication, these features are recommended for typical usage scenarios. In high-speed communication systems, these components are often used alongside field programmable gate arrays to process and manage large volumes of data.
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