Suntsu’s eMMC memory catalog includes reliable embedded multimedia card solutions designed for durable, compact storage in various applications, including automotive, IoT, medical, and embedded computing. Our eMMC storage chips combine integrated flash memory and an on-board controller in a single package, simplifying PCB design and enhancing data management efficiency. Use our advanced part search tool to filter by storage capacity, performance specifications, or manufacturer to find the perfect embedded storage solution for your project.
eMMC Memory
Total Products: 251
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
 | FEMC128GCG-E530 | Flexxon | AXO 5.1 100ball eMMC (3D TLC/3D pSLC) | eMMC Memory | 100-FBGA | VCCQ: 1.8V/3.3V VCC: 3.3V | -25°C - 85°C | Memory Size: 1.024 Tbit Clock Frequency: 200 MHz Memory Type: Non-Volatile Memory Format: FLASH Technology: 3D pSLC Memory Organization: 128G x 8 Memory Interface: eMMC 5.1 Grade: Industrial Packaging: 100-FBGA Qualification: N/A | 159 | ||
 | FEMC128GCG-E540 | Flexxon | AXO 5.1 153ball eMMC (3D TLC/3D pSLC) | eMMC Memory | 153-FBGA | VCCQ: 1.8V/3.3V VCC: 3.3V | -25°C - 85°C | Memory Size: 1.024 Tbit Clock Frequency: 200 MHz Memory Type: Non-Volatile Memory Format: FLASH Technology: 3D pSLC Memory Organization: 128G x 8 Memory Interface: eMMC 5.1 Grade: Industrial Packaging: 153-FBGA Qualification: N/A | 503 | ||
| FEMC256GBA-E530 | Flexxon | AXO 5.1 100ball eMMC (3D TLC/3D pSLC) | eMMC Memory | 100-FBGA | VCCQ: 1.8V/3.3V VCC: 3.3V | -25°C - 85°C | Memory Size: 2.048 Tbit Clock Frequency: 200 MHz Memory Type: Non-Volatile Memory Format: FLASH Technology: 3D TLC Memory Organization: 256G x 8 Memory Interface: eMMC 5.1 Grade: Automotive grade 3 Packaging: 100-FBGA Qualification: AEC-Q100 Grade 3 | 1,235 | ||
| FEMC256GBA-E540 | Flexxon | AXO 5.1 153ball eMMC (3D TLC/3D pSLC) | eMMC Memory | 153-FBGA | VCCQ: 1.8V/3.3V VCC: 3.3V | -25°C - 85°C | Memory Size: 2.048 Tbit Clock Frequency: 200 MHz Memory Type: Non-Volatile Memory Format: FLASH Technology: 3D TLC Memory Organization: 256G x 8 Memory Interface: eMMC 5.1 Grade: Automotive grade 3 Packaging: 153-FBGA Qualification: AEC-Q100 Grade 3 | 1,510 | ||
 | FEMC256GBA-T740 | Flexxon | XTRA VIII 5.1 153ball eMMC (3D TLC/3D pSLC) | eMMC Memory | 153-FBGA | VCCQ: 1.8V/3.3V VCC: 3.3V | -40°C - 85°C | Memory Size: 2.048 Tbit Clock Frequency: 200 MHz Memory Type: Non-Volatile Memory Format: FLASH Technology: 3D TLC Memory Organization: 256G x 8 Memory Interface: eMMC 5.1 Grade: Automotive grade 3 Packaging: 153-FBGA Qualification: AEC-Q100 Grade 3 | 859 | ||
| FEMC256GBB-E530 | Flexxon | AXO 5.1 100ball eMMC (3D TLC/3D pSLC) | eMMC Memory | 100-FBGA | VCCQ: 1.8V/3.3V VCC: 3.3V | -25°C - 85°C | Memory Size: 2.048 Tbit Clock Frequency: 200 MHz Memory Type: Non-Volatile Memory Format: FLASH Technology: 3D TLC Memory Organization: 256G x 8 Memory Interface: eMMC 5.1 Grade: Automotive grade 2 Packaging: 100-FBGA Qualification: AEC-Q100 Grade 2 | 924 | ||
| FEMC256GBB-E540 | Flexxon | AXO 5.1 153ball eMMC (3D TLC/3D pSLC) | eMMC Memory | 153-FBGA | VCCQ: 1.8V/3.3V VCC: 3.3V | -25°C - 85°C | Memory Size: 2.048 Tbit Clock Frequency: 200 MHz Memory Type: Non-Volatile Memory Format: FLASH Technology: 3D TLC Memory Organization: 256G x 8 Memory Interface: eMMC 5.1 Grade: Automotive grade 2 Packaging: 153-FBGA Qualification: AEC-Q100 Grade 2 | 1,522 | ||
| FEMC256GBB-T740 | Flexxon | XTRA VIII 5.1 153ball eMMC (3D TLC/3D pSLC) | eMMC Memory | 153-FBGA | VCCQ: 1.8V/3.3V VCC: 3.3V | -40°C - 105°C | Memory Size: 2.048 Tbit Clock Frequency: 200 MHz Memory Type: Non-Volatile Memory Format: FLASH Technology: 3D TLC Memory Organization: 256G x 8 Memory Interface: eMMC 5.1 Grade: Automotive grade 2 Packaging: 153-FBGA Qualification: AEC-Q100 Grade 2 | 723 | ||
| FEMC256GBE-E530 | Flexxon | AXO 5.1 100ball eMMC (3D TLC/3D pSLC) | eMMC Memory | 100-FBGA | VCCQ: 1.8V/3.3V VCC: 3.3V | -25°C - 85°C | Memory Size: 2.048 Tbit Clock Frequency: 200 MHz Memory Type: Non-Volatile Memory Format: FLASH Technology: 3D TLC Memory Organization: 256G x 8 Memory Interface: eMMC 5.1 Grade: Industrial Packaging: 100-FBGA Qualification: N/A | 859 | ||
| FEMC256GBE-E540 | Flexxon | AXO 5.1 153ball eMMC (3D TLC/3D pSLC) | eMMC Memory | 153-FBGA | VCCQ: 1.8V/3.3V VCC: 3.3V | -25°C - 85°C | Memory Size: 2.048 Tbit Clock Frequency: 200 MHz Memory Type: Non-Volatile Memory Format: FLASH Technology: 3D TLC Memory Organization: 256G x 8 Memory Interface: eMMC 5.1 Grade: Industrial Packaging: 153-FBGA Qualification: N/A | 192 | ||
| FEMC256GBE-T740 | Flexxon | XTRA VII 5.1 153ball eMMC (3D TLC/3D pSLC) | eMMC Memory | 153-FBGA | VCCQ: 1.8V/3.3V VCC: 3.3V | -25°C - 85°C | Memory Size: 2.048 Tbit Clock Frequency: 200 MHz Memory Type: Non-Volatile Memory Format: FLASH Technology: 3D TLC Memory Organization: 256G x 8 Memory Interface: eMMC 5.1 Grade: Industrial Packaging: 153-FBGA Qualification: N/A | 927 | ||
| FEMC256GBG-E530 | Flexxon | AXO 5.1 100ball eMMC (3D TLC/3D pSLC) | eMMC Memory | 100-FBGA | VCCQ: 1.8V/3.3V VCC: 3.3V | -25°C - 85°C | Memory Size: 2.048 Tbit Clock Frequency: 200 MHz Memory Type: Non-Volatile Memory Format: FLASH Technology: 3D TLC Memory Organization: 256G x 8 Memory Interface: eMMC 5.1 Grade: Industrial Packaging: 100-FBGA Qualification: N/A | 644 | ||
| FEMC256GBG-E540 | Flexxon | AXO 5.1 153ball eMMC (3D TLC/3D pSLC) | eMMC Memory | 153-FBGA | VCCQ: 1.8V/3.3V VCC: 3.3V | -25°C - 85°C | Memory Size: 2.048 Tbit Clock Frequency: 200 MHz Memory Type: Non-Volatile Memory Format: FLASH Technology: 3D TLC Memory Organization: 256G x 8 Memory Interface: eMMC 5.1 Grade: Industrial Packaging: 153-FBGA Qualification: N/A | 1,528 | ||
 | FEMC256GBG-T34N | Flexxon | XTRA V 5.1 153ball eMMC (3D TLC/3D pSLC) | eMMC Memory | 153-FBGA | VCCQ: 1.8V/3.3V VCC: 3.3V | -25°C - 85°C | Memory Size: 2.048 Tbit Clock Frequency: 200 MHz Memory Type: Non-Volatile Memory Format: FLASH Technology: 3D TLC Memory Organization: 256G x 8 Memory Interface: eMMC 5.1 / 4.x Grade: Industrial Packaging: 153-FBGA Qualification: N/A | 1 | ||
| FEMC512GBA-E530 | Flexxon | AXO 5.1 100ball eMMC (3D TLC/3D pSLC) | eMMC Memory | 100-FBGA | VCCQ: 1.8V/3.3V VCC: 3.3V | -25°C - 85°C | Memory Size: 4.096 Tbit Clock Frequency: 200 MHz Memory Type: Non-Volatile Memory Format: FLASH Technology: 3D TLC Memory Organization: 512G x 8 Memory Interface: eMMC 5.1 Grade: Automotive grade 3 Packaging: 100-FBGA Qualification: AEC-Q100 Grade 3 | 278 | ||
| FEMC512GBA-E540 | Flexxon | AXO 5.1 153ball eMMC (3D TLC/3D pSLC) | eMMC Memory | 153-FBGA | VCCQ: 1.8V/3.3V VCC: 3.3V | -25°C - 85°C | Memory Size: 4.096 Tbit Clock Frequency: 200 MHz Memory Type: Non-Volatile Memory Format: FLASH Technology: 3D TLC Memory Organization: 512G x 8 Memory Interface: eMMC 5.1 Grade: Automotive grade 3 Packaging: 153-FBGA Qualification: AEC-Q100 Grade 3 | 1,706 | ||
| FEMC512GBB-E530 | Flexxon | AXO 5.1 100ball eMMC (3D TLC/3D pSLC) | eMMC Memory | 100-FBGA | VCCQ: 1.8V/3.3V VCC: 3.3V | -25°C - 85°C | Memory Size: 4.096 Tbit Clock Frequency: 200 MHz Memory Type: Non-Volatile Memory Format: FLASH Technology: 3D TLC Memory Organization: 512G x 8 Memory Interface: eMMC 5.1 Grade: Automotive grade 2 Packaging: 100-FBGA Qualification: AEC-Q100 Grade 2 | 505 | ||
| FEMC512GBB-E540 | Flexxon | AXO 5.1 153ball eMMC (3D TLC/3D pSLC) | eMMC Memory | 153-FBGA | VCCQ: 1.8V/3.3V VCC: 3.3V | -25°C - 85°C | Memory Size: 4.096 Tbit Clock Frequency: 200 MHz Memory Type: Non-Volatile Memory Format: FLASH Technology: 3D TLC Memory Organization: 512G x 8 Memory Interface: eMMC 5.1 Grade: Automotive grade 2 Packaging: 153-FBGA Qualification: AEC-Q100 Grade 2 | 1,206 | ||
| FEMC512GBE-E530 | Flexxon | AXO 5.1 100ball eMMC (3D TLC/3D pSLC) | eMMC Memory | 100-FBGA | VCCQ: 1.8V/3.3V VCC: 3.3V | -25°C - 85°C | Memory Size: 4.096 Tbit Clock Frequency: 200 MHz Memory Type: Non-Volatile Memory Format: FLASH Technology: 3D TLC Memory Organization: 512G x 8 Memory Interface: eMMC 5.1 Grade: Industrial Packaging: 100-FBGA Qualification: N/A | 619 | ||
| FEMC512GBE-E540 | Flexxon | AXO 5.1 153ball eMMC (3D TLC/3D pSLC) | eMMC Memory | 153-FBGA | VCCQ: 1.8V/3.3V VCC: 3.3V | -25°C - 85°C | Memory Size: 4.096 Tbit Clock Frequency: 200 MHz Memory Type: Non-Volatile Memory Format: FLASH Technology: 3D TLC Memory Organization: 512G x 8 Memory Interface: eMMC 5.1 Grade: Industrial Packaging: 153-FBGA Qualification: N/A | 565 |
About eMMC Memory
Embedded MultiMediaCard (eMMC) memory is an advanced, non-volatile storage solution that combines NAND flash memory and an intelligent on-board controller within a compact Ball Grid Array (BGA) package. By handling essential flash operations internally—such as error correction code (ECC), wear leveling, and bad block management—eMMC chips reduce the processing load on the host microcontroller or microprocessor. This design offers hardware engineers a reliable, plug-and-play storage option that simplifies circuit design and speeds up the time-to-market compared to discrete flash components.
eMMC memory is optimized for high-density storage and reliable data retention during power cycles. It is commonly used in embedded systems, automotive infotainment, industrial automation, medical devices, and IoT hardware. When choosing an eMMC solution, engineers focus on factors such as storage capacity, interface speeds, and specialized features like operating temperature ranges suitable for harsh environments. Suntsu offers a versatile range of eMMC memory ICs designed to provide durable and cost-effective solutions for boot code and data storage, ensuring compatibility with modern digital logic devices.
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