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MCP Memory

Suntsu’s MCP (Multi-Chip Package) memory catalog offers compact, high-density storage solutions by combining various memory technologies, such as NAND flash and DRAM, into a single, space-saving package. These integrated circuits are ideal for applications where space is limited, including IoT devices, medical electronics, wearables, and mobile computing. They optimize board space and power efficiency without compromising performance. Use our advanced part search tool to filter by memory combination, capacity, and technical specifications to find the right MCP solution for your needs.

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Total Products: 7
ImageData
Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
Quote
N/AN/AFM62D2G1GXA (2U)ESMT2Gb NAND+LPDDR2 MCPMCP Memory10.5x8 (mm),162ball2.5V0°C – 70°C
Memory Size:
2 Gbit
Clock Frequency:
533 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
N/A
Memory Type:
Volatile, Non-Volatile
Memory Format:
MCP
Technology:
MCP (NAND + DRAM)
Memory Organization:
64M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
N/A
Packaging:
10.5x8 (mm),162ball
1,212
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N/AN/AFM6BD1G12MB(2W)ESMT1Gb NAND+LPDDR2 MCP Ind.MCP Memory10.5x8 (mm),162ball2.5V-40°C – 85°C
Memory Size:
1 Gbit
Clock Frequency:
533 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
N/A
Memory Type:
Volatile, Non-Volatile
Memory Format:
MCP
Technology:
MCP (NAND + DRAM)
Memory Organization:
32M x 16
Memory Interface:
Parallel
Grade:
Industrial
Qualification:
N/A
Packaging:
10.5x8 (mm),162ball
1,116
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N/AN/AFM6BD2G2GKA (2Q)ESMT2Gb NAND+LPDDR2 MCPMCP Memory10.5x8 (mm),162ball2.5V0°C – 70°C
Memory Size:
2 Gbit
Clock Frequency:
533 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
N/A
Memory Type:
Volatile, Non-Volatile
Memory Format:
MCP
Technology:
MCP (NAND + DRAM)
Memory Organization:
64M x 32
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
N/A
Packaging:
10.5x8 (mm),162ball
711
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N/AN/AFM6BD4G2GKA (2J)ESMT4Gb NAND+LPDDR2 MCPMCP Memory10.5x8 (mm),162ball2.5V0°C – 70°C
Memory Size:
4 Gbit
Clock Frequency:
533 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
N/A
Memory Type:
Volatile, Non-Volatile
Memory Format:
MCP
Technology:
MCP (NAND + DRAM)
Memory Organization:
64M x 32
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
N/A
Packaging:
10.5x8 (mm),162ball
724
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N/AN/AFM6HZ4G4GKA (2R)ESMT4Gb NAND+LPDDR4x MCP Ind.MCP Memory9.5x8 (mm),149ball2.5V-40°C – 85°C
Memory Size:
4 Gbit
Clock Frequency:
2.133 GHz
Write Cycle Time Word Page:
15 ns
Access Time:
N/A
Memory Type:
Volatile, Non-Volatile
Memory Format:
MCP
Technology:
MCP (NAND + DRAM)
Memory Organization:
256M x 16
Memory Interface:
Parallel
Grade:
Industrial
Qualification:
N/A
Packaging:
9.5x8 (mm),149ball
552
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QUOTE
N/AN/AFM6HZ4G8GXDZB (2H)ESMT4Gb NAND+LPDDR4x MCP Ind.MCP Memory9.5x8 (mm),149ball2.5V-40°C – 85°C
Memory Size:
4 Gbit
Clock Frequency:
2.133 GHz
Write Cycle Time Word Page:
15 ns
Access Time:
N/A
Memory Type:
Volatile, Non-Volatile
Memory Format:
MCP
Technology:
MCP (NAND + DRAM)
Memory Organization:
256M x 16 x 2 die
Memory Interface:
Parallel
Grade:
Industrial
Qualification:
N/A
Packaging:
9.5x8 (mm),149ball
993
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QUOTE
N/AN/AFM6HZ8G8GXDZB(2H)ESMT8Gb NAND+LPDDR4x MCPMCP Memory9.5x8 (mm),149ball2.5V0°C – 70°C
Memory Size:
8 Gbit
Clock Frequency:
2.133 GHz
Write Cycle Time Word Page:
15 ns
Access Time:
N/A
Memory Type:
Volatile, Non-Volatile
Memory Format:
MCP
Technology:
MCP (NAND + DRAM)
Memory Organization:
256M x 16 x 2 die
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
N/A
Packaging:
9.5x8 (mm),149ball
584
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QUOTE

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About MCP Memory

Multi-Chip Package (MCP) memory is an advanced, space-saving storage solution that vertically stacks multiple memory chips, such as high-density NAND flash and low-power DRAM, into a single, compact semiconductor package. By combining volatile and non-volatile memory technologies onto a shared substrate, MCPs significantly reduce the physical footprint on the printed circuit board (PCB). This makes them ideal for high-performance applications where space is limited, as well as for situations where maximizing board space and minimizing trace lengths are crucial for system efficiency.

Engineers and hardware designers use MCP memory to streamline complex routing, reduce power consumption, and ensure high-speed data transfer between the processing unit and the memory subsystem. These highly integrated devices are commonly found in compact embedded systems, IoT gateways, rugged industrial telemetry, and automotive subassemblies. Suntsu’s range of MCP memory options offers a dependable and efficient architecture that provides both fast execution space and permanent data storage, making it an ideal match for modern microcontrollers and dense digital logic designs.

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If you can’t find the parts you’re looking for in our database, don’t worry! We’re here to help. Simply fill out the form below with the part number you need and your contact information, and we’ll locate it for you. If you prefer to speak to someone directly, our sales team is available at 949.783.7300.

























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