Microcontrollers

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Total Products: 76,657
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Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
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N/ALPC55S14JBD100YNXP SemiconductorsIC MCU 32BIT 128KB FLSH 100HLQFPMicrocontrollers100-HLQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
64
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
80K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x16b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-HLQFP (14×14)
Package / Case:
100-LQFP Exposed Pad
234
LPC55S14JBD64ELPC55S14JBD64ENXP SemiconductorsIC MCU 32BIT 128KB FLASH 64HTQFPMicrocontrollers64-HTQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
36
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
80K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x16b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HTQFP (10×10)
Package / Case:
64-TQFP Exposed Pad
795
N/ALPC55S14JBD64KNXP SemiconductorsIC MCU 32BIT 128KB FLASH 64HTQFPMicrocontrollers64-HTQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
36
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
80K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x16b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HTQFP (10×10)
Package / Case:
64-TQFP Exposed Pad
873
N/ALPC55S14JBD64YNXP SemiconductorsIC MCU 32BIT 128KB FLASH 64HTQFPMicrocontrollers64-HTQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
36
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
80K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x16b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HTQFP (10×10)
Package / Case:
64-TQFP Exposed Pad
151
LPC55S16JBD100ELPC55S16JBD100ENXP SemiconductorsIC MCU 32BIT 256KB FLSH 100HLQFPMicrocontrollers100-HLQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
64
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x16b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-HLQFP (14×14)
Package / Case:
100-LQFP Exposed Pad
1,313
N/ALPC55S16JBD100KNXP SemiconductorsIC MCU 32BIT 256KB FLSH 100LQFPMicrocontrollers100-HLQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
64
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x16b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-HLQFP (14×14)
Package / Case:
100-LQFP Exposed Pad
604
N/ALPC55S16JBD100YNXP SemiconductorsIC MCU 32BIT 256KB FLSH 100LQFPMicrocontrollers100-HLQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
64
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x16b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-HLQFP (14×14)
Package / Case:
100-LQFP Exposed Pad
388
LPC55S16JBD64ELPC55S16JBD64ENXP SemiconductorsIC MCU 32BIT 256KB FLASH 64HTQFPMicrocontrollers64-HTQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
36
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x16b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HTQFP (10×10)
Package / Case:
64-TQFP Exposed Pad
542
N/ALPC55S16JBD64KNXP SemiconductorsIC MCU 32BIT 256KB FLASH 64TQFPMicrocontrollers64-HTQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
36
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x16b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HTQFP (10×10)
Package / Case:
64-TQFP Exposed Pad
744
N/ALPC55S16JBD64YNXP SemiconductorsIC MCU 32BIT 256KB FLASH 64TQFPMicrocontrollers64-HTQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
36
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x16b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HTQFP (10×10)
Package / Case:
64-TQFP Exposed Pad
1,638
N/ALPC55S16JEV59ENXP SemiconductorsIC MCU 32BIT 256KB FLASH 59BGAMicrocontrollers59-VFBGA (4x4)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
37
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x16b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
59-VFBGA (4×4)
Package / Case:
59-VFBGA
1,206
N/ALPC55S16JEV59YNXP SemiconductorsIC MCU 32BIT 256KB FLASH 59BGAMicrocontrollers59-VFBGA (4x4)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
37
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x16b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
59-VFBGA (4×4)
Package / Case:
59-VFBGA
144
LPC55S16JEV98ELPC55S16JEV98ENXP SemiconductorsIC MCU 32BIT 256KB FLASH 98VFBGAMicrocontrollers98-VFBGA (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
64
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x16b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
98-VFBGA (7×7)
Package / Case:
98-VFBGA
171
N/ALPC55S16JEV98KNXP SemiconductorsIC MCU 32BIT 256KB FLASH 98VFBGAMicrocontrollers98-VFBGA (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
64
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x16b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
98-VFBGA (7×7)
Package / Case:
98-VFBGA
1,789
N/ALPC55S16JEV98YNXP SemiconductorsIC MCU 32BIT 256KB FLASH 98VFBGAMicrocontrollers98-VFBGA (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
64
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x16b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
98-VFBGA (7×7)
Package / Case:
98-VFBGA
554
N/ALPC55S26JBD100ENXP SemiconductorsIC MCU 32BIT 256KB FLSH 100LQFPMicrocontrollers100-HLQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
64
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
144K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x16b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-HLQFP (14×14)
Package / Case:
100-LQFP Exposed Pad
1,214
LPC55S26JBD100KLPC55S26JBD100KNXP SemiconductorsIC MCU 32BIT 256KB FLSH 100HLQFPMicrocontrollers100-HLQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
64
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
144K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x16b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-HLQFP (14×14)
Package / Case:
100-LQFP Exposed Pad
575
N/ALPC55S26JBD100YNXP SemiconductorsIC MCU 32BIT 256KB FLSH 100LQFPMicrocontrollers100-HLQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
64
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
144K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x16b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-HLQFP (14×14)
Package / Case:
100-LQFP Exposed Pad
1,845
N/ALPC55S26JBD64ENXP SemiconductorsIC MCU 32BIT 256KB FLASH 64TQFPMicrocontrollers64-HTQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
36
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
144K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x16b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HTQFP (10×10)
Package / Case:
64-TQFP Exposed Pad
511
LPC55S26JBD64KLPC55S26JBD64KNXP SemiconductorsIC MCU 32BIT 256KB FLASH 64HTQFPMicrocontrollers64-HTQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
36
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
144K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x16b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HTQFP (10×10)
Package / Case:
64-TQFP Exposed Pad
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About Microcontrollers

Microcontroller products are sophisticated digital logic devices that can be programmed by the user. Microcontrollers traditionally include working memory, frequently incorporate mixed-signal peripherals, and are generally used with simpler software paradigms focused on repeating a predefined series of tasks. For applications requiring higher performance or parallel processing, designers may instead use field programmable gate arrays.

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