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Microcontrollers
Total Products: 76,657
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
 | LPC55S66JBD100K | NXP Semiconductors | IC MCU 32BIT 256KB FLSH 100HLQFP | Microcontrollers | 100-HLQFP (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Dual-Core Speed: 150MHz Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Number of I/O: 64 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH RAM Size: 144K x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x16b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-HLQFP (14×14) Package / Case: 100-LQFP Exposed Pad | 46 | ||
| N/A | LPC55S66JBD100Y | NXP Semiconductors | IC MCU 32BIT 256KB FLSH 100LQFP | Microcontrollers | 100-HLQFP (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Dual-Core Speed: 150MHz Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Number of I/O: 64 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH RAM Size: 144K x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x16b SAR Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-HLQFP (14×14) Package / Case: 100-LQFP Exposed Pad | 220 | ||
 | LPC55S66JBD64E | NXP Semiconductors | IC MCU 32BIT 256KB FLASH 64TQFP | Microcontrollers | 64-HTQFP (10x10) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Dual-Core Speed: 150MHz Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Number of I/O: 36 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH RAM Size: 144K x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x16b SAR Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-HTQFP (10×10) Package / Case: 64-TQFP Exposed Pad | 142 | ||
 | LPC55S66JBD64K | NXP Semiconductors | IC MCU 32BIT 256KB FLASH 64HTQFP | Microcontrollers | 64-HTQFP (10x10) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Dual-Core Speed: 150MHz Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Number of I/O: 36 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH RAM Size: 144K x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x16b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-HTQFP (10×10) Package / Case: 64-TQFP Exposed Pad | 1,120 | ||
| N/A | LPC55S66JBD64Y | NXP Semiconductors | IC MCU 32BIT 256KB FLASH 64TQFP | Microcontrollers | 64-HTQFP (10x10) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Dual-Core Speed: 150MHz Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Number of I/O: 36 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH RAM Size: 144K x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x16b SAR Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-HTQFP (10×10) Package / Case: 64-TQFP Exposed Pad | 482 | ||
| N/A | LPC55S66JEV98E | NXP Semiconductors | IC MCU 32BIT 256KB FLASH 98VFBGA | Microcontrollers | 98-VFBGA (7x7) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Dual-Core Speed: 150MHz Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Number of I/O: 64 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH RAM Size: 144K x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x16b SAR Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 98-VFBGA (7×7) Package / Case: 98-VFBGA | 1,066 | ||
 | LPC55S66JEV98K | NXP Semiconductors | IC MCU 32BIT 256KB FLASH 98VFBGA | Microcontrollers | 98-VFBGA (7x7) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Dual-Core Speed: 150MHz Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Number of I/O: 64 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH RAM Size: 144K x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x16b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 98-VFBGA (7×7) Package / Case: 98-VFBGA | 521 | ||
| N/A | LPC55S66JEV98Y | NXP Semiconductors | IC MCU 32BIT 256KB FLASH 98VFBGA | Microcontrollers | 98-VFBGA (7x7) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Dual-Core Speed: 150MHz Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Number of I/O: 64 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH RAM Size: 144K x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x16b SAR Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 98-VFBGA (7×7) Package / Case: 98-VFBGA | 733 | ||
| N/A | LPC55S69JBD100E | NXP Semiconductors | IC MCU 32BIT 640KB FLASH 100LQFP | Microcontrollers | 100-HLQFP (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Dual-Core Speed: 150MHz Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Number of I/O: 64 Program Memory Size: 640KB (640K x 8) Program Memory Type: FLASH RAM Size: 320K x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x16b SAR Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-HLQFP (14×14) Package / Case: 100-LQFP Exposed Pad | 446 | ||
| N/A | LPC55S69JBD100K | NXP Semiconductors | IC MCU 32BIT 640KB FLSH 100HLQFP | Microcontrollers | 100-HLQFP (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Dual-Core Speed: 150MHz Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Number of I/O: 64 Program Memory Size: 640KB (640K x 8) Program Memory Type: FLASH RAM Size: 320K x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x16b SAR Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-HLQFP (14×14) Package / Case: 100-LQFP | 413 | ||
 | LPC55S69JBD100Y | NXP Semiconductors | IC MCU 32BIT 640KB FLSH 100HLQFP | Microcontrollers | 100-HLQFP (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Dual-Core Speed: 150MHz Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Number of I/O: 64 Program Memory Size: 640KB (640K x 8) Program Memory Type: FLASH RAM Size: 320K x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x16b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-HLQFP (14×14) Package / Case: 100-LQFP Exposed Pad | 871 | ||
| N/A | LPC55S69JBD64E | NXP Semiconductors | IC MCU 32BIT 640KB FLASH 64HTQFP | Microcontrollers | 64-HTQFP (10x10) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Dual-Core Speed: 150MHz Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Number of I/O: 36 Program Memory Size: 640KB (640K x 8) Program Memory Type: FLASH RAM Size: 320K x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x16b SAR Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-HTQFP (10×10) Package / Case: 64-TQFP Exposed Pad | 497 | ||
 | LPC55S69JBD64K | NXP Semiconductors | IC MCU 32BIT 640KB FLASH 64HTQFP | Microcontrollers | 64-HTQFP (10x10) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Dual-Core Speed: 150MHz Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Number of I/O: 36 Program Memory Size: 640KB (640K x 8) Program Memory Type: FLASH RAM Size: 320K x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x16b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-HTQFP (10×10) Package / Case: 64-TQFP Exposed Pad | 23 | ||
| N/A | LPC55S69JBD64Y | NXP Semiconductors | IC MCU 32BIT 640KB FLASH 64HTQFP | Microcontrollers | 64-HTQFP (10x10) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Dual-Core Speed: 150MHz Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Number of I/O: 36 Program Memory Size: 640KB (640K x 8) Program Memory Type: FLASH RAM Size: 320K x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x16b SAR Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-HTQFP (10×10) Package / Case: 64-TQFP Exposed Pad | 456 | ||
| N/A | LPC55S69JEV98E | NXP Semiconductors | IC MCU 32BIT 640KB FLASH | Microcontrollers | 98-VFBGA (7x7) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Dual-Core Speed: 150MHz Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Number of I/O: 64 Program Memory Size: 640KB (640K x 8) Program Memory Type: FLASH RAM Size: 320K x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x16b SAR Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 98-VFBGA (7×7) Package / Case: 98-VFBGA | 1,039 | ||
 | LPC55S69JEV98K | NXP Semiconductors | IC MCU 32BIT 640KB FLASH 98VFBGA | Microcontrollers | 98-VFBGA (7x7) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Dual-Core Speed: 150MHz Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Number of I/O: 64 Program Memory Size: 640KB (640K x 8) Program Memory Type: FLASH RAM Size: 320K x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x16b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 98-VFBGA (7×7) Package / Case: 98-VFBGA | 484 | ||
| N/A | LPC55S69JEV98Y | NXP Semiconductors | IC MCU 32BIT 640KB FLASH | Microcontrollers | 98-VFBGA (7x7) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Dual-Core Speed: 150MHz Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Number of I/O: 64 Program Memory Size: 640KB (640K x 8) Program Memory Type: FLASH RAM Size: 320K x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x16b SAR Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 98-VFBGA (7×7) Package / Case: 98-VFBGA | 501 | ||
| N/A | N/A | LPC802M001JDH16 | NXP Semiconductors | IC MCU 32BIT FLASH | Microcontrollers | N/A | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Number of I/O: 13 Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 12x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount | 839 | |
 | LPC802M001JDH16FP | NXP Semiconductors | IC MCU 32BIT 16KB FLASH 16TSSOP | Microcontrollers | 16-TSSOP | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Speed: 15MHz Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Number of I/O: 13 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH RAM Size: 2K x 8 Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 12x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 16-TSSOP Package / Case: 16-TSSOP (0.173″”, 4.40mm Width) | 555 | ||
 | LPC802M001JDH16J | NXP Semiconductors | IC MCU 32BIT 16KB FLASH 16TSSOP | Microcontrollers | 16-TSSOP | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Speed: 15MHz Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Number of I/O: 13 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH RAM Size: 2K x 8 Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 12x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 16-TSSOP Package / Case: 16-TSSOP (0.173″”, 4.40mm Width) | 313 |
About Microcontrollers
Microcontroller products are sophisticated digital logic devices that can be programmed by the user. Microcontrollers traditionally include working memory, frequently incorporate mixed-signal peripherals, and are generally used with simpler software paradigms focused on repeating a predefined series of tasks. For applications requiring higher performance or parallel processing, designers may instead use field programmable gate arrays.
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