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Microcontrollers
Total Products: 76,657
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | MC68LK332ACEH16 | NXP Semiconductors | IC MCU 32BIT ROMLESS 132PQFP | Microcontrollers | 132-PQFP (24.13x24.13) | N/A | -40°C ~ 85°C (TA) | Core Processor: CPU32 Core Size: 32-Bit Single-Core Speed: 16.78MHz Connectivity: EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 15 Program Memory Type: ROMless RAM Size: 2K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 132-PQFP (24.13×24.13) Package / Case: 132-BQFP Bumpered | 478 | ||
![]() | MC68LK332ACPV16 | NXP Semiconductors | IC MCU 32BIT ROMLESS 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Processor: CPU32 Core Size: 32-Bit Single-Core Speed: 16.78MHz Connectivity: EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 15 Program Memory Type: ROMless RAM Size: 2K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) Package / Case: 144-LQFP | 641 | ||
![]() | MC68LK332GCAG16 | NXP Semiconductors | IC MCU 32BIT ROMLESS 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Processor: CPU32 Core Size: 32-Bit Single-Core Speed: 16MHz Connectivity: EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 16 Program Memory Type: ROMless RAM Size: 2K x 8 Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) Package / Case: 144-LQFP | 750 | ||
![]() | MC68LK332GCEH16 | NXP Semiconductors | IC MCU 32BIT ROMLESS 132PQFP | Microcontrollers | 132-PQFP (24.13x24.13) | N/A | -40°C ~ 85°C (TA) | Core Processor: CPU32 Core Size: 32-Bit Single-Core Speed: 16.78MHz Connectivity: EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 15 Program Memory Type: ROMless RAM Size: 2K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 132-PQFP (24.13×24.13) Package / Case: 132-BQFP Bumpered | 1,376 | ||
![]() | MC68LK332GCPV16 | NXP Semiconductors | IC MCU 32BIT ROMLESS 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Processor: CPU32 Core Size: 32-Bit Single-Core Speed: 16.78MHz Connectivity: EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 15 Program Memory Type: ROMless RAM Size: 2K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) Package / Case: 144-LQFP | 236 | ||
![]() | MC68S711E9CFN2 | NXP Semiconductors | IC MCU 8BIT 12KB OTP 52PLCC | Microcontrollers | 52-PLCC (19.1x19.1) | N/A | -40°C ~ 85°C (TA) | Core Processor: HC11 Core Size: 8-Bit Speed: 2MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 38 Program Memory Size: 12KB (12K x 8) Program Memory Type: OTP EEPROM Size: 512 x 8 RAM Size: 512 x 8 Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 8x8b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 52-PLCC (19.1×19.1) Package / Case: 52-LCC (J-Lead) | 943 | ||
![]() | MC68S711E9CFNE2 | NXP Semiconductors | IC MCU 8BIT 12KB OTP 52PLCC | Microcontrollers | 52-PLCC (19.1x19.1) | N/A | -40°C ~ 85°C (TA) | Core Processor: HC11 Core Size: 8-Bit Speed: 2MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 38 Program Memory Size: 12KB (12K x 8) Program Memory Type: OTP EEPROM Size: 512 x 8 RAM Size: 512 x 8 Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 8x8b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 52-PLCC (19.1×19.1) Package / Case: 52-LCC (J-Lead) | 714 | ||
![]() | MC705B16NBE | NXP Semiconductors | IC MCU 8BIT 15KB OTP 56PSDIP | Microcontrollers | 56-PSDIP | N/A | 0°C ~ 70°C (TA) | Core Processor: HC05 Core Size: 8-Bit Speed: 2.1MHz Connectivity: SCI Peripherals: POR, WDT Number of I/O: 32 Program Memory Size: 15KB (15K x 8) Program Memory Type: OTP EEPROM Size: 256 x 8 RAM Size: 352 x 8 Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Through Hole Supplier Device Package: 56-PSDIP Package / Case: 56-SDIP (0.600″”, 15.24mm) | 843 | ||
![]() | MC705B16NCBE | NXP Semiconductors | IC MCU 8BIT 15KB OTP 56PSDIP | Microcontrollers | 56-PSDIP | N/A | -40°C ~ 85°C (TA) | Core Processor: HC05 Core Size: 8-Bit Speed: 2.1MHz Connectivity: SCI Peripherals: POR, WDT Number of I/O: 32 Program Memory Size: 15KB (15K x 8) Program Memory Type: OTP EEPROM Size: 256 x 8 RAM Size: 352 x 8 Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Through Hole Supplier Device Package: 56-PSDIP Package / Case: 56-SDIP (0.600″”, 15.24mm) | 565 | ||
![]() | MC705B16NCFNER | NXP Semiconductors | IC MCU 8BIT 15KB OTP 52PLCC | Microcontrollers | 52-PLCC (19.1x19.1) | N/A | -40°C ~ 85°C (TA) | Core Processor: HC05 Core Size: 8-Bit Speed: 2.1MHz Connectivity: SCI Peripherals: POR, WDT Number of I/O: 32 Program Memory Size: 15KB (15K x 8) Program Memory Type: OTP EEPROM Size: 256 x 8 RAM Size: 352 x 8 Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 52-PLCC (19.1×19.1) Package / Case: 52-LCC (J-Lead) | 46 | ||
![]() | MC705C8ABE | NXP Semiconductors | IC MCU 8BIT 8KB OTP 42DIP | Microcontrollers | 42-PDIP | N/A | 0°C ~ 70°C (TA) | Core Processor: HC05 Core Size: 8-Bit Speed: 2.1MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 24 Program Memory Size: 8KB (8K x 8) Program Memory Type: OTP RAM Size: 304 x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Oscillator Type: Internal Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Through Hole Supplier Device Package: 42-PDIP Package / Case: 42-SDIP (0.600″”, 15.24mm) | 1,261 | ||
![]() | MC705C8ACBE | NXP Semiconductors | IC MCU 8BIT 8KB OTP 42DIP | Microcontrollers | 42-PDIP | N/A | -40°C ~ 85°C (TA) | Core Processor: HC05 Core Size: 8-Bit Speed: 2.1MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 24 Program Memory Size: 8KB (8K x 8) Program Memory Type: OTP RAM Size: 304 x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Through Hole Supplier Device Package: 42-PDIP Package / Case: 42-SDIP (0.600″”, 15.24mm) | 506 | ||
![]() | N/A | MC705C8ACFBE | NXP Semiconductors | IC MCU 8BIT 8KB OTP 44QFP | Microcontrollers | 44-QFP (10x10) | N/A | -40°C ~ 85°C (TA) | Core Processor: HC05 Core Size: 8-Bit Speed: 2.1MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 24 Program Memory Size: 8KB (8K x 8) Program Memory Type: OTP RAM Size: 304 x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 44-QFP (10×10) Package / Case: 44-QFP | 208 | |
![]() | N/A | MC705C8ACFNER | NXP Semiconductors | IC MCU 8BIT 8KB OTP 44PLCC | Microcontrollers | 44-PLCC (16.59x16.59) | N/A | -40°C ~ 85°C (TA) | Core Processor: HC05 Core Size: 8-Bit Speed: 2.1MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 24 Program Memory Size: 8KB (8K x 8) Program Memory Type: OTP RAM Size: 304 x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 44-PLCC (16.59×16.59) Package / Case: 44-LCC (J-Lead) | 1,048 | |
![]() | N/A | MC705C8ACPBE | NXP Semiconductors | IC MCU 8BIT 8KB OTP 44LQFP | Microcontrollers | 44-LQFP (10x10) | N/A | -40°C ~ 85°C (TA) | Core Processor: HC05 Core Size: 8-Bit Speed: 2.1MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 24 Program Memory Size: 8KB (8K x 8) Program Memory Type: OTP RAM Size: 304 x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 44-LQFP (10×10) Package / Case: 44-LQFP | 1,325 | |
![]() | MC705C8ACPE | NXP Semiconductors | IC MCU 8BIT 8KB OTP 40DIP | Microcontrollers | 40-PDIP | N/A | -40°C ~ 85°C (TA) | Core Processor: HC05 Core Size: 8-Bit Speed: 2.1MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 24 Program Memory Size: 8KB (8K x 8) Program Memory Type: OTP RAM Size: 304 x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Through Hole Supplier Device Package: 40-PDIP Package / Case: 40-DIP (0.600″”, 15.24mm) | 1,248 | ||
![]() | MC705C9ACPE | NXP Semiconductors | IC MCU 8BIT 16KB OTP 40DIP | Microcontrollers | 40-PDIP | N/A | -40°C ~ 85°C (TA) | Core Processor: HC05 Core Size: 8-Bit Speed: 2.1MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 24 Program Memory Size: 16KB (16K x 8) Program Memory Type: OTP RAM Size: 352 x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Through Hole Supplier Device Package: 40-PDIP Package / Case: 40-DIP (0.600″”, 15.24mm) | 547 | ||
![]() | MC705J1ACDWE | NXP Semiconductors | IC MCU 8BIT 1.2KB OTP 20SOIC | Microcontrollers | 20-SOIC | N/A | -40°C ~ 85°C (TA) | Core Processor: HC05 Core Size: 8-Bit Speed: 4MHz Peripherals: POR, WDT Number of I/O: 14 Program Memory Size: 1.2KB (1.2K x 8) Program Memory Type: OTP RAM Size: 64 x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 20-SOIC Package / Case: 20-SOIC (0.295″”, 7.50mm Width) | 603 | ||
![]() | MC705JJ7CDWE | NXP Semiconductors | IC MCU 8BIT 6KB OTP 20SOIC | Microcontrollers | 20-SOIC | N/A | -40°C ~ 85°C (TA) | Core Processor: HC05 Core Size: 8-Bit Speed: 2.1MHz Connectivity: SIO Peripherals: POR, Temp Sensor, WDT Number of I/O: 14 Program Memory Size: 6KB (6K x 8) Program Memory Type: OTP RAM Size: 224 x 8 Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 4x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 20-SOIC Package / Case: 20-SOIC (0.295″”, 7.50mm Width) | 1,211 | ||
![]() | MC705JP7CPE | NXP Semiconductors | IC MCU 8BIT 6KB OTP 28DIP | Microcontrollers | 28-PDIP | N/A | -40°C ~ 85°C (TA) | Core Processor: HC05 Core Size: 8-Bit Speed: 2.1MHz Connectivity: SIO Peripherals: POR, Temp Sensor, WDT Number of I/O: 22 Program Memory Size: 6KB (6K x 8) Program Memory Type: OTP RAM Size: 224 x 8 Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 4x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Through Hole Supplier Device Package: 28-PDIP Package / Case: 28-DIP (0.600″”, 15.24mm) | 1,588 |
About Microcontrollers
Microcontroller products are sophisticated digital logic devices that can be programmed by the user. Microcontrollers traditionally include working memory, frequently incorporate mixed-signal peripherals, and are generally used with simpler software paradigms focused on repeating a predefined series of tasks. For applications requiring higher performance or parallel processing, designers may instead use field programmable gate arrays.
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