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Microcontrollers
Total Products: 76,657
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
 | MC705L16CFUE | NXP Semiconductors | IC MCU 8BIT 16KB OTP 80QFP | Microcontrollers | 80-QFP (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: HC05 Core Size: 8-Bit Speed: 2.1MHz Connectivity: SPI Peripherals: LCD, POR, WDT Number of I/O: 16 Program Memory Size: 16KB (16K x 8) Program Memory Type: OTP RAM Size: 512 x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 80-QFP (14×14) Package / Case: 80-QFP | 1,981 | ||
 | MC705P6ACDWE | NXP Semiconductors | IC MCU 8BIT 4.5KB OTP 28SOIC | Microcontrollers | 28-SOIC | N/A | -40°C ~ 85°C (TA) | Core Processor: HC05 Core Size: 8-Bit Speed: 2.1MHz Connectivity: SIO Peripherals: POR, WDT Number of I/O: 21 Program Memory Size: 4.5KB (4.5K x 8) Program Memory Type: OTP RAM Size: 176 x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 4x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 28-SOIC Package / Case: 28-SOIC (0.295″”, 7.50mm Width) | 265 | ||
 | MC705P6ACDWER | NXP Semiconductors | IC MCU 8BIT 4.5KB OTP 28SOIC | Microcontrollers | 28-SOIC | N/A | -40°C ~ 85°C (TA) | Core Processor: HC05 Core Size: 8-Bit Speed: 2.1MHz Connectivity: SIO Peripherals: POR, WDT Number of I/O: 21 Program Memory Size: 4.5KB (4.5K x 8) Program Memory Type: OTP RAM Size: 176 x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 4x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 28-SOIC Package / Case: 28-SOIC (0.295″”, 7.50mm Width) | 1,109 | ||
 | MC705P6ACPE | NXP Semiconductors | IC MCU 8BIT 4.5KB OTP 28DIP | Microcontrollers | 28-PDIP | N/A | -40°C ~ 85°C (TA) | Core Processor: HC05 Core Size: 8-Bit Speed: 2.1MHz Connectivity: SIO Peripherals: POR, WDT Number of I/O: 21 Program Memory Size: 4.5KB (4.5K x 8) Program Memory Type: OTP RAM Size: 176 x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 4x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Through Hole Supplier Device Package: 28-PDIP Package / Case: 28-DIP (0.600″”, 15.24mm) | 1,391 | ||
 | MC705P6AMDWE | NXP Semiconductors | IC MCU 8BIT 4.5KB OTP 28SOIC | Microcontrollers | 28-SOIC | N/A | -40°C ~ 125°C (TA) | Core Processor: HC05 Core Size: 8-Bit Speed: 2.1MHz Connectivity: SIO Peripherals: POR, WDT Number of I/O: 21 Program Memory Size: 4.5KB (4.5K x 8) Program Memory Type: OTP RAM Size: 176 x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 4x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 28-SOIC Package / Case: 28-SOIC (0.295″”, 7.50mm Width) | 1,273 | ||
 | N/A | MC705P6AMDWER | NXP Semiconductors | IC MCU 8BIT 4.5KB OTP 28SOIC | Microcontrollers | 28-SOIC | N/A | -40°C ~ 125°C (TA) | Core Processor: HC05 Core Size: 8-Bit Speed: 2.1MHz Connectivity: SIO Peripherals: POR, WDT Number of I/O: 21 Program Memory Size: 4.5KB (4.5K x 8) Program Memory Type: OTP RAM Size: 176 x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 4x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 28-SOIC Package / Case: 28-SOIC (0.295″”, 7.50mm Width) | 1,296 | |
 | MC705P6ECPE | NXP Semiconductors | IC MCU 8BIT 4.5KB OTP 28DIP | Microcontrollers | 28-PDIP | N/A | -40°C ~ 85°C (TA) | Core Processor: HC05 Core Size: 8-Bit Speed: 2.1MHz Connectivity: SIO Peripherals: POR, WDT Number of I/O: 21 Program Memory Size: 4.5KB (4.5K x 8) Program Memory Type: OTP RAM Size: 176 x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 4x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Through Hole Supplier Device Package: 28-PDIP Package / Case: 28-DIP (0.600″”, 15.24mm) | 1,352 | ||
 | MC705X32CFUE4 | NXP Semiconductors | IC MCU 8BIT 32KB OTP 64QFP | Microcontrollers | 64-QFP (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: HC05 Core Size: 8-Bit Speed: 4MHz Connectivity: CANbus, SCI Peripherals: POR, WDT Number of I/O: 24 Program Memory Size: 32KB (32K x 8) Program Memory Type: OTP EEPROM Size: 256 x 8 RAM Size: 528 x 8 Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-QFP (14×14) Package / Case: 64-QFP | 379 | ||
 | MC705X32MFUE4 | NXP Semiconductors | IC MCU 8BIT 32KB OTP 64QFP | Microcontrollers | 64-QFP (14x14) | N/A | -40°C ~ 125°C (TA) | Core Processor: HC05 Core Size: 8-Bit Speed: 4MHz Connectivity: CANbus, SCI Peripherals: POR, WDT Number of I/O: 24 Program Memory Size: 32KB (32K x 8) Program Memory Type: OTP EEPROM Size: 256 x 8 RAM Size: 528 x 8 Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-QFP (14×14) Package / Case: 64-QFP | 1,201 | ||
 | MC705X32VFUE | NXP Semiconductors | IC MCU 8BIT 32KB OTP 64QFP | Microcontrollers | 64-QFP (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: HC05 Core Size: 8-Bit Speed: 4MHz Connectivity: CANbus, SCI Peripherals: POR, WDT Number of I/O: 24 Program Memory Size: 32KB (32K x 8) Program Memory Type: OTP EEPROM Size: 256 x 8 RAM Size: 528 x 8 Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-QFP (14×14) Package / Case: 64-QFP | 1,557 | ||
 | MC711E9CFNE2R | NXP Semiconductors | IC MCU 8BIT 12KB OTP 52PLCC | Microcontrollers | 52-PLCC (19.1x19.1) | N/A | -40°C ~ 85°C (TA) | Core Processor: HC11 Core Size: 8-Bit Speed: 2MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 38 Program Memory Size: 12KB (12K x 8) Program Memory Type: OTP EEPROM Size: 512 x 8 RAM Size: 512 x 8 Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 52-PLCC (19.1×19.1) Package / Case: 52-LCC (J-Lead) | 567 | ||
 | MC711K4CFNE3 | NXP Semiconductors | IC MCU 8BIT 24KB OTP 84PLCC | Microcontrollers | 84-PLCC (29.29x29.29) | N/A | -40°C ~ 85°C (TA) | Core Processor: HC11 Core Size: 8-Bit Speed: 3MHz Connectivity: SCI, SPI Peripherals: POR, PWM, WDT Number of I/O: 62 Program Memory Size: 24KB (24K x 8) Program Memory Type: OTP EEPROM Size: 640 x 8 RAM Size: 768 x 8 Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 84-PLCC (29.29×29.29) Package / Case: 84-LCC (J-Lead) | 777 | ||
 | MC711K4CFNE4 | NXP Semiconductors | IC MCU 8BIT 24KB OTP 84PLCC | Microcontrollers | 84-PLCC (29.29x29.29) | N/A | -40°C ~ 85°C (TA) | Core Processor: HC11 Core Size: 8-Bit Speed: 4MHz Connectivity: SCI, SPI Peripherals: POR, PWM, WDT Number of I/O: 62 Program Memory Size: 24KB (24K x 8) Program Memory Type: OTP EEPROM Size: 640 x 8 RAM Size: 768 x 8 Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 84-PLCC (29.29×29.29) Package / Case: 84-LCC (J-Lead) | 635 | ||
 | MC711K4CFUE4 | NXP Semiconductors | IC MCU 8BIT 24KB OTP 80QFP | Microcontrollers | 80-QFP (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: HC11 Core Size: 8-Bit Speed: 4MHz Connectivity: SCI, SPI Peripherals: POR, PWM, WDT Number of I/O: 62 Program Memory Size: 24KB (24K x 8) Program Memory Type: OTP EEPROM Size: 640 x 8 RAM Size: 768 x 8 Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 80-QFP (14×14) Package / Case: 80-QFP | 671 | ||
 | MC711K4VFNE4 | NXP Semiconductors | IC MCU 8BIT 24KB OTP 84PLCC | Microcontrollers | 84-PLCC (29.29x29.29) | N/A | -40°C ~ 105°C (TA) | Core Processor: HC11 Core Size: 8-Bit Speed: 4MHz Connectivity: SCI, SPI Peripherals: POR, PWM, WDT Number of I/O: 62 Program Memory Size: 24KB (24K x 8) Program Memory Type: OTP EEPROM Size: 640 x 8 RAM Size: 768 x 8 Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 84-PLCC (29.29×29.29) Package / Case: 84-LCC (J-Lead) | 1,147 | ||
 | MC711K4VFUE4 | NXP Semiconductors | IC MCU 8BIT 24KB OTP 80QFP | Microcontrollers | 80-QFP (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: HC11 Core Size: 8-Bit Speed: 4MHz Connectivity: SCI, SPI Peripherals: POR, PWM, WDT Number of I/O: 62 Program Memory Size: 24KB (24K x 8) Program Memory Type: OTP EEPROM Size: 640 x 8 RAM Size: 768 x 8 Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 80-QFP (14×14) Package / Case: 80-QFP | 893 | ||
 | N/A | MC711P2CFNE4 | NXP Semiconductors | IC MCU 8BIT 32KB OTP 84PLCC | Microcontrollers | 84-PLCC (29.29x29.29) | N/A | -40°C ~ 85°C (TA) | Core Processor: HC11 Core Size: 8-Bit Speed: 4MHz Connectivity: MI Bus, SCI, SPI Peripherals: POR, PWM, WDT Number of I/O: 50 Program Memory Size: 32KB (32K x 8) Program Memory Type: OTP EEPROM Size: 640 x 8 RAM Size: 1K x 8 Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 84-PLCC (29.29×29.29) Package / Case: 84-LCC (J-Lead) | 1,565 | |
 | MC812A4CPVE8 | NXP Semiconductors | IC MCU 16BIT 4KB EEPROM 112LQFP | Microcontrollers | 112-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Processor: CPU12 Core Size: 16-Bit Speed: 8MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 83 Program Memory Size: 4KB (4K x 8) Program Memory Type: EEPROM RAM Size: 1K x 8 Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 112-LQFP (20×20) Package / Case: 112-LQFP | 1,537 | ||
 | MC908AB32CFUE | NXP Semiconductors | IC MCU 8BIT 32KB FLASH 64QFP | Microcontrollers | 64-QFP (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: SCI, SPI Peripherals: POR, PWM Number of I/O: 51 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 1K x 8 Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-QFP (14×14) Package / Case: 64-QFP | 681 | ||
 | MC908AB32CFUER | NXP Semiconductors | IC MCU 8BIT 32KB FLASH 64QFP | Microcontrollers | 64-QFP (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: SCI, SPI Peripherals: POR, PWM Number of I/O: 51 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 1K x 8 Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-QFP (14×14) Package / Case: 64-QFP | 1,119 |
About Microcontrollers
Microcontroller products are sophisticated digital logic devices that can be programmed by the user. Microcontrollers traditionally include working memory, frequently incorporate mixed-signal peripherals, and are generally used with simpler software paradigms focused on repeating a predefined series of tasks. For applications requiring higher performance or parallel processing, designers may instead use field programmable gate arrays.
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