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Microcontrollers
Total Products: 76,657
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
 | MC9S08EL32CTL | NXP Semiconductors | IC MCU 8BIT 32KB FLASH 28TSSOP | Microcontrollers | 28-TSSOP | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 22 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 1K x 8 Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 16x10b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 28-TSSOP Package / Case: 28-TSSOP (0.173″”, 4.40mm Width) | 961 | ||
 | MC9S08FL16CBM | NXP Semiconductors | IC MCU 8BIT 16KB FLASH 32SDIP | Microcontrollers | 32-SDIP | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: SCI Peripherals: LVD, PWM, WDT Number of I/O: 30 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH RAM Size: 1K x 8 Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 12x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Through Hole Supplier Device Package: 32-SDIP Package / Case: 32-SDIP (0.400″”, 10.16mm) | 453 | ||
 | MC9S08FL16CLC | NXP Semiconductors | IC MCU 8BIT 16KB FLASH 32LQFP | Microcontrollers | 32-LQFP (7x7) | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: SCI Peripherals: LVD, PWM, WDT Number of I/O: 30 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH RAM Size: 1K x 8 Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 12x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-LQFP (7×7) Package / Case: 32-LQFP | 24 | ||
 | MC9S08FL8CBM | NXP Semiconductors | IC MCU 8BIT 8KB FLASH 32SDIP | Microcontrollers | 32-SDIP | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: SCI Peripherals: LVD, PWM, WDT Number of I/O: 30 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH RAM Size: 768 x 8 Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 12x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Through Hole Supplier Device Package: 32-SDIP Package / Case: 32-SDIP (0.400″”, 10.16mm) | 784 | ||
 | MC9S08FL8CLC | NXP Semiconductors | IC MCU 8BIT 8KB FLASH 32LQFP | Microcontrollers | 32-LQFP (7x7) | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: SCI Peripherals: LVD, PWM, WDT Number of I/O: 30 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH RAM Size: 768 x 8 Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 12x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-LQFP (7×7) Package / Case: 32-LQFP | 830 | ||
 | MC9S08FL8CLCR | NXP Semiconductors | IC MCU 8BIT 8KB FLASH 32LQFP | Microcontrollers | 32-LQFP (7x7) | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: SCI Peripherals: LVD, PWM, WDT Number of I/O: 30 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH RAM Size: 768 x 8 Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 12x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-LQFP (7×7) Package / Case: 32-LQFP | 1,204 | ||
 | MC9S08GB32ACFUE | NXP Semiconductors | IC MCU 8BIT 32KB FLASH 64LQFP | Microcontrollers | 64-LQFP (10x10) | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 56 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH RAM Size: 2K x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-LQFP (10×10) Package / Case: 64-LQFP | 147 | ||
 | MC9S08GB32CFU | NXP Semiconductors | IC MCU 8BIT 32KB FLASH 64LQFP | Microcontrollers | 64-LQFP (10x10) | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 56 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH RAM Size: 2K x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-LQFP (10×10) Package / Case: 64-LQFP | 915 | ||
 | MC9S08GB32CFUE | NXP Semiconductors | IC MCU 8BIT 32KB FLASH 64LQFP | Microcontrollers | 64-LQFP (10x10) | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 56 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH RAM Size: 2K x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-LQFP (10×10) Package / Case: 64-LQFP | 1,039 | ||
 | MC9S08GB32CFUER | NXP Semiconductors | IC MCU 8BIT 32KB FLASH 64LQFP | Microcontrollers | 64-LQFP (10x10) | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 56 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH RAM Size: 2K x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-LQFP (10×10) Package / Case: 64-LQFP | 107 | ||
 | MC9S08GB60ACFUE | NXP Semiconductors | IC MCU 8BIT 60KB FLASH 64LQFP | Microcontrollers | 64-LQFP (10x10) | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 56 Program Memory Size: 60KB (60K x 8) Program Memory Type: FLASH RAM Size: 4K x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-LQFP (10×10) Package / Case: 64-LQFP | 780 | ||
 | MC9S08GB60ACFUER | NXP Semiconductors | IC MCU 8BIT 60KB FLASH 64LQFP | Microcontrollers | 64-LQFP (10x10) | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 56 Program Memory Size: 60KB (60K x 8) Program Memory Type: FLASH RAM Size: 4K x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-LQFP (10×10) Package / Case: 64-LQFP | 1,298 | ||
 | MC9S08GB60CFU | NXP Semiconductors | IC MCU 8BIT 60KB FLASH 64LQFP | Microcontrollers | 64-LQFP (10x10) | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 56 Program Memory Size: 60KB (60K x 8) Program Memory Type: FLASH RAM Size: 4K x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-LQFP (10×10) Package / Case: 64-LQFP | 1,838 | ||
 | MC9S08GB60CFUE | NXP Semiconductors | IC MCU 8BIT 60KB FLASH 64LQFP | Microcontrollers | 64-LQFP (10x10) | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 56 Program Memory Size: 60KB (60K x 8) Program Memory Type: FLASH RAM Size: 4K x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-LQFP (10×10) Package / Case: 64-LQFP | 1,043 | ||
 | MC9S08GB60CFUER | NXP Semiconductors | IC MCU 8BIT 60KB FLASH 64LQFP | Microcontrollers | 64-LQFP (10x10) | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 56 Program Memory Size: 60KB (60K x 8) Program Memory Type: FLASH RAM Size: 4K x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-LQFP (10×10) Package / Case: 64-LQFP | 365 | ||
 | MC9S08GT16ACBE | NXP Semiconductors | IC MCU 8BIT 16KB FLASH 42DIP | Microcontrollers | 42-PDIP | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 34 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH RAM Size: 2K x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Through Hole Supplier Device Package: 42-PDIP Package / Case: 42-SDIP (0.600″”, 15.24mm) | 906 | ||
 | MC9S08GT16ACFBE | NXP Semiconductors | IC MCU 8BIT 16KB FLASH 44QFP | Microcontrollers | 44-QFP (10x10) | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 36 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH RAM Size: 2K x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 44-QFP (10×10) Package / Case: 44-QFP | 475 | ||
 | MC9S08GT16ACFBER | NXP Semiconductors | IC MCU 8BIT 16KB FLASH 44QFP | Microcontrollers | 44-QFP (10x10) | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 36 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH RAM Size: 2K x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 44-QFP (10×10) Package / Case: 44-QFP | 901 | ||
 | MC9S08GT16ACFCE | NXP Semiconductors | IC MCU 8BIT 16KB FLASH 32QFN | Microcontrollers | 32-HVQFN (5x5) | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 24 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH RAM Size: 2K x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 4x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-HVQFN (5×5) Package / Case: 32-VFQFN Exposed Pad | 159 | ||
 | MC9S08GT16ACFCER | NXP Semiconductors | IC MCU 8BIT 16KB FLASH 32QFN | Microcontrollers | 32-HVQFN (5x5) | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 24 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH RAM Size: 2K x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 4x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-HVQFN (5×5) Package / Case: 32-VFQFN Exposed Pad | 294 |
About Microcontrollers
Microcontroller products are sophisticated digital logic devices that can be programmed by the user. Microcontrollers traditionally include working memory, frequently incorporate mixed-signal peripherals, and are generally used with simpler software paradigms focused on repeating a predefined series of tasks. For applications requiring higher performance or parallel processing, designers may instead use field programmable gate arrays.
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