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Microcontrollers
Total Products: 76,657
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
 | MC9S08GT16ACFDE | NXP Semiconductors | IC MCU 8BIT 16KB FLASH 48QFN | Microcontrollers | 48-QFN-EP (7x7) | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 39 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH RAM Size: 2K x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 48-QFN-EP (7×7) Package / Case: 48-VFQFN Exposed Pad | 853 | ||
 | MC9S08GT16ACFDER | NXP Semiconductors | IC MCU 8BIT 16KB FLASH 48QFN | Microcontrollers | 48-QFN-EP (7x7) | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 39 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH RAM Size: 2K x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 48-QFN-EP (7×7) Package / Case: 48-VFQFN Exposed Pad | 255 | ||
 | MC9S08GT16AMFBE | NXP Semiconductors | IC MCU 8BIT 16KB FLASH 44QFP | Microcontrollers | 44-QFP (10x10) | N/A | -40°C ~ 125°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 36 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH RAM Size: 2K x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 44-QFP (10×10) Package / Case: 44-QFP | 877 | ||
 | MC9S08GT16AMFCE | NXP Semiconductors | IC MCU 8BIT 16KB FLASH 32QFN | Microcontrollers | 32-HVQFN (5x5) | N/A | -40°C ~ 125°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 24 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH RAM Size: 2K x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 4x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-HVQFN (5×5) Package / Case: 32-VFQFN Exposed Pad | 1,775 | ||
 | MC9S08GT16AMFDE | NXP Semiconductors | IC MCU 8BIT 16KB FLASH 48QFN | Microcontrollers | 48-QFN-EP (7x7) | N/A | -40°C ~ 125°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 39 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH RAM Size: 2K x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 48-QFN-EP (7×7) Package / Case: 48-VFQFN Exposed Pad | 1,523 | ||
 | MC9S08GT16CFBE | NXP Semiconductors | IC MCU 8BIT 16KB FLASH 44QFP | Microcontrollers | 44-QFP (10x10) | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 36 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH RAM Size: 1K x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 44-QFP (10×10) Package / Case: 44-QFP | 386 | ||
 | MC9S08GT16CFBER | NXP Semiconductors | IC MCU 8BIT 16KB FLASH 44QFP | Microcontrollers | 44-QFP (10x10) | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 36 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH RAM Size: 1K x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 44-QFP (10×10) Package / Case: 44-QFP | 1,401 | ||
 | MC9S08GT16CFDE | NXP Semiconductors | IC MCU 8BIT 16KB FLASH 48QFN | Microcontrollers | 48-QFN-EP (7x7) | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 39 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH RAM Size: 1K x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 48-QFN-EP (7×7) Package / Case: 48-VFQFN Exposed Pad | 590 | ||
 | MC9S08GT32ACBE | NXP Semiconductors | IC MCU 8BIT 32KB FLASH 42DIP | Microcontrollers | 42-PDIP | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 33 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH RAM Size: 2K x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Through Hole Supplier Device Package: 42-PDIP Package / Case: 42-SDIP (0.600″”, 15.24mm) | 700 | ||
 | MC9S08GT32ACFBE | NXP Semiconductors | IC MCU 8BIT 32KB FLASH 44QFP | Microcontrollers | 44-QFP (10x10) | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 36 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH RAM Size: 2K x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 44-QFP (10×10) Package / Case: 44-QFP | 1,039 | ||
 | MC9S08GT32ACFBER | NXP Semiconductors | IC MCU 8BIT 32KB FLASH 44QFP | Microcontrollers | 44-QFP (10x10) | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 36 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH RAM Size: 2K x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 44-QFP (10×10) Package / Case: 44-QFP | 242 | ||
 | MC9S08GT32ACFDE | NXP Semiconductors | IC MCU 8BIT 32KB FLASH 48QFN | Microcontrollers | 48-QFN-EP (7x7) | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 39 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH RAM Size: 2K x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 48-QFN-EP (7×7) Package / Case: 48-VFQFN Exposed Pad | 1,129 | ||
 | MC9S08GT32ACFDER | NXP Semiconductors | IC MCU 8BIT 32KB FLASH 48QFN | Microcontrollers | 48-QFN-EP (7x7) | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 39 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH RAM Size: 2K x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 48-QFN-EP (7×7) Package / Case: 48-VFQFN Exposed Pad | 736 | ||
 | MC9S08GT32CFB | NXP Semiconductors | IC MCU 8BIT 32KB FLASH 44QFP | Microcontrollers | 44-QFP (10x10) | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 36 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH RAM Size: 2K x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 44-QFP (10×10) Package / Case: 44-QFP | 304 | ||
 | MC9S08GT32CFBE | NXP Semiconductors | IC MCU 8BIT 32KB FLASH 44QFP | Microcontrollers | 44-QFP (10x10) | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 36 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH RAM Size: 2K x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 44-QFP (10×10) Package / Case: 44-QFP | 480 | ||
 | MC9S08GT32CFBER | NXP Semiconductors | IC MCU 8BIT 32KB FLASH 44QFP | Microcontrollers | 44-QFP (10x10) | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 36 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH RAM Size: 2K x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 44-QFP (10×10) Package / Case: 44-QFP | 471 | ||
 | MC9S08GT32CFD | NXP Semiconductors | IC MCU 8BIT 32KB FLASH 48QFN | Microcontrollers | 48-QFN-EP (7x7) | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 39 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH RAM Size: 2K x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 48-QFN-EP (7×7) Package / Case: 48-VFQFN Exposed Pad | 176 | ||
 | MC9S08GT60ACBE | NXP Semiconductors | IC MCU 8BIT 60KB FLASH 42DIP | Microcontrollers | 42-PDIP | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 33 Program Memory Size: 60KB (60K x 8) Program Memory Type: FLASH RAM Size: 4K x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Through Hole Supplier Device Package: 42-PDIP Package / Case: 42-SDIP (0.600″”, 15.24mm) | 1,663 | ||
 | MC9S08GT60ACFBE | NXP Semiconductors | IC MCU 8BIT 60KB FLASH 44QFP | Microcontrollers | 44-QFP (10x10) | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 36 Program Memory Size: 60KB (60K x 8) Program Memory Type: FLASH RAM Size: 4K x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 44-QFP (10×10) Package / Case: 44-QFP | 437 | ||
 | MC9S08GT60ACFBER | NXP Semiconductors | IC MCU 8BIT 60KB FLASH 44QFP | Microcontrollers | 44-QFP (10x10) | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 36 Program Memory Size: 60KB (60K x 8) Program Memory Type: FLASH RAM Size: 4K x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 44-QFP (10×10) Package / Case: 44-QFP | 1,839 |
About Microcontrollers
Microcontroller products are sophisticated digital logic devices that can be programmed by the user. Microcontrollers traditionally include working memory, frequently incorporate mixed-signal peripherals, and are generally used with simpler software paradigms focused on repeating a predefined series of tasks. For applications requiring higher performance or parallel processing, designers may instead use field programmable gate arrays.
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