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Microcontrollers
Total Products: 76,657
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
 | MC9S08QE64CLD | NXP Semiconductors | IC MCU 8BIT 64KB FLASH 44LQFP | Microcontrollers | 44-LQFP (10x10) | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 50MHz Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, PWM, WDT Number of I/O: 34 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH RAM Size: 4K x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 44-LQFP (10×10) Package / Case: 44-LQFP | 1,108 | ||
 | MC9S08QE64CLH | NXP Semiconductors | IC MCU 8BIT 64KB FLASH 64LQFP | Microcontrollers | 64-LQFP (10x10) | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 50MHz Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, PWM, WDT Number of I/O: 54 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH RAM Size: 4K x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 22x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-LQFP (10×10) Package / Case: 64-LQFP | 165 | ||
 | MC9S08QE8CFM | NXP Semiconductors | IC MCU 8BIT 8KB FLASH 32QFN | Microcontrollers | 32-QFN (4x4) | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, PWM, WDT Number of I/O: 26 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH RAM Size: 512 x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-QFN (4×4) Package / Case: 32-VFQFN Exposed Pad | 964 | ||
 | MC9S08QE8CLC | NXP Semiconductors | IC MCU 8BIT 8KB FLASH 32LQFP | Microcontrollers | 32-LQFP (7x7) | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, PWM, WDT Number of I/O: 26 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH RAM Size: 512 x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-LQFP (7×7) Package / Case: 32-LQFP | 265 | ||
 | MC9S08QE8CPG | NXP Semiconductors | IC MCU 8BIT 8KB FLASH 16DIP | Microcontrollers | 16-PDIP | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, PWM, WDT Number of I/O: 12 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH RAM Size: 512 x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Through Hole Supplier Device Package: 16-PDIP Package / Case: 16-DIP (0.300″”, 7.62mm) | 571 | ||
 | MC9S08QE8CTG | NXP Semiconductors | IC MCU 8BIT 8KB FLASH 16TSSOP | Microcontrollers | 16-TSSOP | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, PWM, WDT Number of I/O: 12 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH RAM Size: 512 x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 16-TSSOP Package / Case: 16-TSSOP (0.173″”, 4.40mm Width) | 449 | ||
 | MC9S08QE8CTGR | NXP Semiconductors | IC MCU 8BIT 8KB FLASH 16TSSOP | Microcontrollers | 16-TSSOP | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, PWM, WDT Number of I/O: 12 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH RAM Size: 512 x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 16-TSSOP Package / Case: 16-TSSOP (0.173″”, 4.40mm Width) | 96 | ||
 | MC9S08QE8CWJ | NXP Semiconductors | IC MCU 8BIT 8KB FLASH 20SOIC | Microcontrollers | 20-SOIC | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, PWM, WDT Number of I/O: 16 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH RAM Size: 512 x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 20-SOIC Package / Case: 20-SOIC (0.295″”, 7.50mm Width) | 1,127 | ||
 | MC9S08QE8CWL | NXP Semiconductors | IC MCU 8BIT 8KB FLASH 28SOIC | Microcontrollers | 28-SOIC | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, PWM, WDT Number of I/O: 22 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH RAM Size: 512 x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 28-SOIC Package / Case: 28-SOIC (0.295″”, 7.50mm Width) | 644 | ||
 | MC9S08QE96CFT | NXP Semiconductors | IC MCU 8BIT 96KB FLASH 48QFN | Microcontrollers | 48-QFN-EP (7x7) | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 50MHz Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, PWM, WDT Number of I/O: 38 Program Memory Size: 96KB (96K x 8) Program Memory Type: FLASH RAM Size: 6K x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 48-QFN-EP (7×7) Package / Case: 48-VFQFN Exposed Pad | 1,439 | ||
 | N/A | MC9S08QE96CFTR | NXP Semiconductors | IC MCU 8BIT 96KB FLASH 48QFN | Microcontrollers | 48-QFN (7x7) | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 50MHz Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, PWM, WDT Number of I/O: 38 Program Memory Size: 96KB (96K x 8) Program Memory Type: FLASH RAM Size: 6K x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 48-QFN (7×7) Package / Case: 48-VFQFN Exposed Pad | 639 | |
 | MC9S08QE96CLD | NXP Semiconductors | IC MCU 8BIT 96KB FLASH 44LQFP | Microcontrollers | 44-LQFP (10x10) | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 50MHz Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, PWM, WDT Number of I/O: 34 Program Memory Size: 96KB (96K x 8) Program Memory Type: FLASH RAM Size: 6K x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 44-LQFP (10×10) Package / Case: 44-LQFP | 1,742 | ||
 | MC9S08QE96CLH | NXP Semiconductors | IC MCU 8BIT 96KB FLASH 64LQFP | Microcontrollers | 64-LQFP (10x10) | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 50MHz Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, PWM, WDT Number of I/O: 54 Program Memory Size: 96KB (96K x 8) Program Memory Type: FLASH RAM Size: 6K x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 22x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-LQFP (10×10) Package / Case: 64-LQFP | 156 | ||
 | MC9S08QE96CLK | NXP Semiconductors | IC MCU 8BIT 96KB FLASH 80LQFP | Microcontrollers | 80-LQFP (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 50MHz Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, PWM, WDT Number of I/O: 70 Program Memory Size: 96KB (96K x 8) Program Memory Type: FLASH RAM Size: 6K x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 24x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 80-LQFP (14×14) Package / Case: 80-LQFP | 915 | ||
 | MC9S08QG4CDNE | NXP Semiconductors | IC MCU 8BIT 4KB FLASH 8SOIC | Microcontrollers | 8-SOIC | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 4 Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH RAM Size: 256 x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 4x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 8-SOIC Package / Case: 8-SOIC (0.154″”, 3.90mm Width) | 774 | ||
 | N/A | MC9S08QG4CDNER | NXP Semiconductors | IC MCU 8BIT 4KB FLASH 8SOIC | Microcontrollers | 8-SOIC | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 4 Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH RAM Size: 256 x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 4x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 8-SOIC Package / Case: 8-SOIC (0.154″”, 3.90mm Width) | 1,208 | |
 | MC9S08QG4CDTE | NXP Semiconductors | IC MCU 8BIT 4KB FLASH 16TSSOP | Microcontrollers | 16-TSSOP | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 12 Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH RAM Size: 256 x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 16-TSSOP Package / Case: 16-TSSOP (0.173″”, 4.40mm Width) | 517 | ||
 | MC9S08QG4CDTER | NXP Semiconductors | IC MCU 8BIT 4KB FLASH 16TSSOP | Microcontrollers | 16-TSSOP | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 12 Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH RAM Size: 256 x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 16-TSSOP Package / Case: 16-TSSOP (0.173″”, 4.40mm Width) | 452 | ||
 | MC9S08QG4CFFE | NXP Semiconductors | IC MCU 8BIT 4KB FLASH 16QFN | Microcontrollers | 16-QFN-EP (5x5) | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 12 Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH RAM Size: 256 x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 16-QFN-EP (5×5) Package / Case: 16-VQFN Exposed Pad | 359 | ||
 | MC9S08QG4CFFER | NXP Semiconductors | IC MCU 8BIT 4KB FLASH 16QFN | Microcontrollers | 16-QFN-EP (5x5) | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 12 Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH RAM Size: 256 x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 16-QFN-EP (5×5) Package / Case: 16-VQFN Exposed Pad | 59 |
About Microcontrollers
Microcontroller products are sophisticated digital logic devices that can be programmed by the user. Microcontrollers traditionally include working memory, frequently incorporate mixed-signal peripherals, and are generally used with simpler software paradigms focused on repeating a predefined series of tasks. For applications requiring higher performance or parallel processing, designers may instead use field programmable gate arrays.
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