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Microcontrollers
Total Products: 76,657
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
 | MC9S08QG4CFKE | NXP Semiconductors | IC MCU 8BIT 4KB FLASH 24QFN | Microcontrollers | 24-QFN-EP (4x4) | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 12 Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH RAM Size: 256 x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 24-QFN-EP (4×4) Package / Case: 24-VFQFN Exposed Pad | 25 | ||
 | MC9S08QG4CFQE | NXP Semiconductors | IC MCU 8BIT 4KB FLASH 8DFN | Microcontrollers | 8-DFN-EP (4x4) | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 4 Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH RAM Size: 256 x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 4x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 8-DFN-EP (4×4) Package / Case: 8-VDFN Exposed Pad | 1,360 | ||
 | MC9S08QG4CPAE | NXP Semiconductors | IC MCU 8BIT 4KB FLASH 8DIP | Microcontrollers | 8-PDIP | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 4 Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH RAM Size: 256 x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 4x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Through Hole Supplier Device Package: 8-PDIP Package / Case: 8-DIP (0.300″”, 7.62mm) | 709 | ||
 | MC9S08QG4CPBE | NXP Semiconductors | IC MCU 8BIT 4KB FLASH 16DIP | Microcontrollers | 16-PDIP | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 12 Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH RAM Size: 256 x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Through Hole Supplier Device Package: 16-PDIP Package / Case: 16-DIP (0.300″”, 7.62mm) | 950 | ||
 | MC9S08QG4MDTE | NXP Semiconductors | IC MCU 8BIT 4KB FLASH 16TSSOP | Microcontrollers | 16-TSSOP | N/A | -40°C ~ 125°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 12 Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH RAM Size: 256 x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 16-TSSOP Package / Case: 16-TSSOP (0.173″”, 4.40mm Width) | 894 | ||
 | MC9S08QG4MPAE | NXP Semiconductors | IC MCU 8BIT 4KB FLASH 8DIP | Microcontrollers | 8-PDIP | N/A | -40°C ~ 125°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 4 Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH RAM Size: 256 x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 4x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Through Hole Supplier Device Package: 8-PDIP Package / Case: 8-DIP (0.300″”, 7.62mm) | 473 | ||
 | MC9S08QG84CDTE | NXP Semiconductors | IC MCU 8BIT 8KB FLASH 16TSSOP | Microcontrollers | 16-TSSOP | N/A | -40°C ~ 85°C | Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 12 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH RAM Size: 512 x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Supplier Device Package: 16-TSSOP Package / Case: 16-TSSOP (0.173″”, 4.40mm Width) | 508 | ||
 | N/A | MC9S08QG84CDTER | NXP Semiconductors | IC MCU 8BIT 8KB FLASH 16TSSOP | Microcontrollers | 16-TSSOP | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 12 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH RAM Size: 512 x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 16-TSSOP Package / Case: 16-TSSOP (0.173″”, 4.40mm Width) | 531 | |
 | MC9S08QG84CFFE | NXP Semiconductors | IC MCU 8BIT 8KB FLASH 16QFN | Microcontrollers | 16-QFN-EP (5x5) | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 12 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH RAM Size: 512 x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 16-QFN-EP (5×5) Package / Case: 16-VQFN Exposed Pad | 851 | ||
 | MC9S08QG84CFQE | NXP Semiconductors | IC MCU 8BIT 8KB FLASH 8DFN | Microcontrollers | 8-DFN-EP (4x4) | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 4 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH RAM Size: 512 x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 4x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 8-DFN-EP (4×4) Package / Case: 8-VDFN Exposed Pad | 939 | ||
 | MC9S08QG8CDNE | NXP Semiconductors | IC MCU 8BIT 8KB FLASH 8SOIC | Microcontrollers | 8-SOIC | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 4 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH RAM Size: 512 x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 4x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 8-SOIC Package / Case: 8-SOIC (0.154″”, 3.90mm Width) | 928 | ||
 | MC9S08QG8CDNER | NXP Semiconductors | IC MCU 8BIT 8KB FLASH 8SOIC | Microcontrollers | 8-SOIC | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 4 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH RAM Size: 512 x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 4x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 8-SOIC Package / Case: 8-SOIC (0.154″”, 3.90mm Width) | 520 | ||
 | MC9S08QG8CDTE | NXP Semiconductors | IC MCU 8BIT 8KB FLASH 16TSSOP | Microcontrollers | 16-TSSOP | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 12 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH RAM Size: 512 x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 16-TSSOP Package / Case: 16-TSSOP (0.173″”, 4.40mm Width) | 552 | ||
 | MC9S08QG8CDTER | NXP Semiconductors | IC MCU 8BIT 8KB FLASH 16TSSOP | Microcontrollers | 16-TSSOP | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 12 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH RAM Size: 512 x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 16-TSSOP Package / Case: 16-TSSOP (0.173″”, 4.40mm Width) | 700 | ||
 | MC9S08QG8CFFE | NXP Semiconductors | IC MCU 8BIT 8KB FLASH 16QFN | Microcontrollers | 16-QFN-EP (5x5) | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 12 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH RAM Size: 512 x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 16-QFN-EP (5×5) Package / Case: 16-VQFN Exposed Pad | 428 | ||
 | MC9S08QG8CFFER | NXP Semiconductors | IC MCU 8BIT 8KB FLASH 16QFN | Microcontrollers | 16-QFN-EP (5x5) | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 12 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH RAM Size: 512 x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 16-QFN-EP (5×5) Package / Case: 16-VQFN Exposed Pad | 973 | ||
 | MC9S08QG8CFKE | NXP Semiconductors | IC MCU 8BIT 8KB FLASH 24QFN | Microcontrollers | 24-QFN-EP (4x4) | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 12 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH RAM Size: 512 x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 24-QFN-EP (4×4) Package / Case: 24-VFQFN Exposed Pad | 719 | ||
 | MC9S08QG8CFQE | NXP Semiconductors | IC MCU 8BIT 8KB FLASH 8DFN | Microcontrollers | 8-DFN-EP (4x4) | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 4 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH RAM Size: 512 x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 4x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 8-DFN-EP (4×4) Package / Case: 8-VDFN Exposed Pad | 1,396 | ||
 | MC9S08QG8CPBE | NXP Semiconductors | IC MCU 8BIT 8KB FLASH 16DIP | Microcontrollers | 16-PDIP | N/A | -40°C ~ 85°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 12 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH RAM Size: 512 x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Through Hole Supplier Device Package: 16-PDIP Package / Case: 16-DIP (0.300″”, 7.62mm) | 236 | ||
 | MC9S08QG8MDNE | NXP Semiconductors | IC MCU 8BIT 8KB FLASH 8SOIC | Microcontrollers | 8-SOIC | N/A | -40°C ~ 125°C (TA) | Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 4 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH RAM Size: 512 x 8 Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 4x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 8-SOIC Package / Case: 8-SOIC (0.154″”, 3.90mm Width) | 387 |
About Microcontrollers
Microcontroller products are sophisticated digital logic devices that can be programmed by the user. Microcontrollers traditionally include working memory, frequently incorporate mixed-signal peripherals, and are generally used with simpler software paradigms focused on repeating a predefined series of tasks. For applications requiring higher performance or parallel processing, designers may instead use field programmable gate arrays.
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