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Microcontrollers

Suntsu Electronics: Your premier supplier of microcontrollers. Our advanced part search tool streamlines the process of finding the ideal microcontroller for your application. Search by part number, manufacturer, or specifications and discover a comprehensive selection of high-performance microcontrollers designed to power your embedded applications.

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Total Products: 76,657
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Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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MCF5272CVM66R2N/AMCF5272CVM66R2NXP SemiconductorsIC MCU 32BIT 16KB ROM 196PBGAMicrocontrollers196-LBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
66MHz
Connectivity:
EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, WDT
Number of I/O:
32
Program Memory Size:
16KB (4K x 32)
Program Memory Type:
ROM
RAM Size:
1K x 32
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
196-LBGA (15×15)
Package / Case:
196-LBGA
1,386
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MCF5272VF66
MCF5272VF66NXP SemiconductorsIC MCU 32BIT 16KB ROM 196MAPBGAMicrocontrollers196-LBGA (15x15)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
66MHz
Connectivity:
EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, WDT
Number of I/O:
32
Program Memory Size:
16KB (4K x 32)
Program Memory Type:
ROM
RAM Size:
1K x 32
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Oscillator Type:
External
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
196-LBGA (15×15)
Package / Case:
196-LBGA
47
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MCF5272VF66R2
MCF5272VF66R2NXP SemiconductorsIC MCU 32BIT 16KB ROM 196MAPBGAMicrocontrollers196-LBGA (15x15)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
66MHz
Connectivity:
EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, WDT
Number of I/O:
32
Program Memory Size:
16KB (4K x 32)
Program Memory Type:
ROM
RAM Size:
1K x 32
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Oscillator Type:
External
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
196-LBGA (15×15)
Package / Case:
196-LBGA
616
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MCF5272VF66R2J
MCF5272VF66R2JNXP SemiconductorsIC MCU 32BIT 16KB ROM 196MAPBGAMicrocontrollers196-LBGA (15x15)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
66MHz
Connectivity:
EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, WDT
Number of I/O:
32
Program Memory Size:
16KB (4K x 32)
Program Memory Type:
ROM
RAM Size:
1K x 32
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Oscillator Type:
External
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
196-LBGA (15×15)
Package / Case:
196-LBGA
49
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MCF5272VM66
MCF5272VM66NXP SemiconductorsIC MCU 32BIT 16KB ROM 196MAPBGAMicrocontrollers196-LBGA (15x15)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
66MHz
Connectivity:
EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, WDT
Number of I/O:
32
Program Memory Size:
16KB (4K x 32)
Program Memory Type:
ROM
RAM Size:
1K x 32
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Oscillator Type:
External
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
196-LBGA (15×15)
Package / Case:
196-LBGA
1,626
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MCF5272VM66R2
MCF5272VM66R2NXP SemiconductorsIC MCU 32BIT 16KB ROM 196MAPBGAMicrocontrollers196-LBGA (15x15)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
66MHz
Connectivity:
EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, WDT
Number of I/O:
32
Program Memory Size:
16KB (4K x 32)
Program Memory Type:
ROM
RAM Size:
1K x 32
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Oscillator Type:
External
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
196-LBGA (15×15)
Package / Case:
196-LBGA
1,070
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MCF5274CVM166
MCF5274CVM166NXP SemiconductorsIC MCU 32BIT ROMLESS 256MAPBGAMicrocontrollers256-MAPBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
166MHz
Connectivity:
EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, WDT
Number of I/O:
69
Program Memory Type:
ROMless
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 1.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPBGA (17×17)
Package / Case:
256-LBGA
168
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MCF5274LCVM166
MCF5274LCVM166NXP SemiconductorsIC MCU 32BIT ROMLESS 196MAPBGAMicrocontrollers196-LBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
166MHz
Connectivity:
EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, WDT
Number of I/O:
69
Program Memory Type:
ROMless
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 1.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
196-LBGA (15×15)
Package / Case:
196-LBGA
363
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MCF5274LVF166
MCF5274LVF166NXP SemiconductorsIC MCU 32BIT ROMLESS 196MAPBGAMicrocontrollers196-LBGA (15x15)N/A0°C ~ 70°C
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
166MHz
Connectivity:
EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, WDT
Number of I/O:
61
Program Memory Type:
ROMless
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 1.6V
Oscillator Type:
External
Operating Temperature:
0°C ~ 70°C
Mounting Type:
Surface Mount
Supplier Device Package:
196-LBGA (15×15)
Package / Case:
196-LBGA
581
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MCF5274LVM166
MCF5274LVM166NXP SemiconductorsIC MCU 32BIT ROMLESS 196MAPBGAMicrocontrollers196-LBGA (15x15)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
166MHz
Connectivity:
EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, WDT
Number of I/O:
61
Program Memory Type:
ROMless
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 1.6V
Oscillator Type:
External
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
196-LBGA (15×15)
Package / Case:
196-LBGA
535
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MCF5274VM166
MCF5274VM166NXP SemiconductorsIC MCU 32BIT ROMLESS 256MAPBGAMicrocontrollers256-MAPBGA (17x17)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
166MHz
Connectivity:
EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, WDT
Number of I/O:
69
Program Memory Type:
ROMless
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 1.6V
Oscillator Type:
External
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPBGA (17×17)
Package / Case:
256-LBGA
659
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MCF5275CVM166
MCF5275CVM166NXP SemiconductorsIC MCU 32BIT ROMLESS 256MAPBGAMicrocontrollers256-MAPBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
166MHz
Connectivity:
EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, WDT
Number of I/O:
69
Program Memory Type:
ROMless
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 1.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPBGA (17×17)
Package / Case:
256-LBGA
626
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MCF5275CVM166J
MCF5275CVM166JNXP SemiconductorsIC MCU 32BIT ROMLESS 256MAPBGAMicrocontrollers256-MAPBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
166MHz
Connectivity:
EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, WDT
Number of I/O:
69
Program Memory Type:
ROMless
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 1.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPBGA (17×17)
Package / Case:
256-LBGA
453
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MCF5275LCVM133
MCF5275LCVM133NXP SemiconductorsIC MCU 32BIT ROMLESS 196MAPBGAMicrocontrollers196-LBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
133MHz
Connectivity:
EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, WDT
Number of I/O:
61
Program Memory Type:
ROMless
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 1.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
196-LBGA (15×15)
Package / Case:
196-LBGA
1,706
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MCF5275LCVM166
MCF5275LCVM166NXP SemiconductorsIC MCU 32BIT ROMLESS 196MAPBGAMicrocontrollers196-LBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
166MHz
Connectivity:
EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, WDT
Number of I/O:
61
Program Memory Type:
ROMless
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 1.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
196-LBGA (15×15)
Package / Case:
196-LBGA
7
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MCF5275LCVM166J
MCF5275LCVM166JNXP SemiconductorsIC MCU 32BIT ROMLESS 196MAPBGAMicrocontrollers196-LBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
166MHz
Connectivity:
EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, WDT
Number of I/O:
61
Program Memory Type:
ROMless
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 1.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
196-LBGA (15×15)
Package / Case:
196-LBGA
77
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MCF5280CVF66
MCF5280CVF66NXP SemiconductorsIC MCU 32BIT ROMLESS 256MAPBGAMicrocontrollers256-MAPBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
66MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
142
Program Memory Type:
ROMless
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPBGA (17×17)
Package / Case:
256-LBGA
1,116
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MCF5280CVF66J
MCF5280CVF66JNXP SemiconductorsIC MCU 32BIT ROMLESS 256MAPBGAMicrocontrollers256-MAPBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
66MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
150
Program Memory Type:
ROMless
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPBGA (17×17)
Package / Case:
256-LBGA
452
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MCF5280CVF80
MCF5280CVF80NXP SemiconductorsIC MCU 32BIT ROMLESS 256MAPBGAMicrocontrollers256-MAPBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
142
Program Memory Type:
ROMless
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPBGA (17×17)
Package / Case:
256-LBGA
1,288
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MCF5280CVM66
MCF5280CVM66NXP SemiconductorsIC MCU 32BIT ROMLESS 256MAPBGAMicrocontrollers256-MAPBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
66MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
142
Program Memory Type:
ROMless
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPBGA (17×17)
Package / Case:
256-LBGA
690
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About Microcontrollers

Microcontroller products are sophisticated digital logic devices that can be programmed by the user. Microcontrollers traditionally include working memory, frequently incorporate mixed-signal peripherals, and are generally used with simpler software paradigms focused on repeating a predefined series of tasks. For applications requiring higher performance or parallel processing, designers may instead use field programmable gate arrays.

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