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Microcontrollers
Total Products: 76,657
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
 | MCF5307AI66B | NXP Semiconductors | IC MCU 32BIT ROMLESS 208FQFP | Microcontrollers | 208-FQFP (28x28) | N/A | 0°C ~ 70°C (TA) | Core Processor: Coldfire V3 Core Size: 32-Bit Single-Core Speed: 66MHz Connectivity: EBI/EMI, I2C, UART/USART Peripherals: DMA, POR, WDT Number of I/O: 16 Program Memory Type: ROMless RAM Size: 4K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Oscillator Type: External Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-FQFP (28×28) Package / Case: 208-BFQFP | 850 | ||
 | MCF5307AI90B | NXP Semiconductors | IC MCU 32BIT ROMLESS 208FQFP | Microcontrollers | 208-FQFP (28x28) | N/A | 0°C ~ 70°C (TA) | Core Processor: Coldfire V3 Core Size: 32-Bit Single-Core Speed: 90MHz Connectivity: EBI/EMI, I2C, UART/USART Peripherals: DMA, POR, WDT Number of I/O: 16 Program Memory Type: ROMless RAM Size: 4K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Oscillator Type: External Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-FQFP (28×28) Package / Case: 208-BFQFP | 963 | ||
 | MCF5307CAI66B | NXP Semiconductors | IC MCU 32BIT ROMLESS 208FQFP | Microcontrollers | 208-FQFP (28x28) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V3 Core Size: 32-Bit Single-Core Speed: 66MHz Connectivity: EBI/EMI, I2C, UART/USART Peripherals: DMA, POR, WDT Number of I/O: 16 Program Memory Type: ROMless RAM Size: 4K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-FQFP (28×28) Package / Case: 208-BFQFP | 276 | ||
 | MCF5307CAI90B | NXP Semiconductors | IC MCU 32BIT ROMLESS 208FQFP | Microcontrollers | 208-FQFP (28x28) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V3 Core Size: 32-Bit Single-Core Speed: 90MHz Connectivity: EBI/EMI, I2C, UART/USART Peripherals: DMA, POR, WDT Number of I/O: 16 Program Memory Type: ROMless RAM Size: 4K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-FQFP (28×28) Package / Case: 208-BFQFP | 1,108 | ||
 | MCF5307CFT66B | NXP Semiconductors | IC MCU 32BIT ROMLESS 208FQFP | Microcontrollers | 208-FQFP (28x28) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V3 Core Size: 32-Bit Single-Core Speed: 66MHz Connectivity: EBI/EMI, I2C, UART/USART Peripherals: DMA, POR, WDT Number of I/O: 16 Program Memory Type: ROMless RAM Size: 4K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-FQFP (28×28) Package / Case: 208-BFQFP | 744 | ||
 | MCF5307FT66B | NXP Semiconductors | IC MCU 32BIT ROMLESS 208FQFP | Microcontrollers | 208-FQFP (28x28) | N/A | 0°C ~ 70°C (TA) | Core Processor: Coldfire V3 Core Size: 32-Bit Single-Core Speed: 66MHz Connectivity: EBI/EMI, I2C, UART/USART Peripherals: DMA, POR, WDT Number of I/O: 16 Program Memory Type: ROMless RAM Size: 4K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Oscillator Type: External Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-FQFP (28×28) Package / Case: 208-BFQFP | 123 | ||
 | MCF5307FT90B | NXP Semiconductors | IC MCU 32BIT ROMLESS 208FQFP | Microcontrollers | 208-FQFP (28x28) | N/A | 0°C ~ 70°C (TA) | Core Processor: Coldfire V3 Core Size: 32-Bit Single-Core Speed: 90MHz Connectivity: EBI/EMI, I2C, UART/USART Peripherals: DMA, POR, WDT Number of I/O: 16 Program Memory Type: ROMless RAM Size: 4K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Oscillator Type: External Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-FQFP (28×28) Package / Case: 208-BFQFP | 730 | ||
 | MCF5327CVM240 | NXP Semiconductors | IC MCU 32BIT ROMLESS 196MAPBGA | Microcontrollers | 196-LBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V3 Core Size: 32-Bit Single-Core Speed: 240MHz Connectivity: EBI/EMI, I2C, SPI, SSI, UART/USART, USB, USB OTG Peripherals: DMA, LCD, PWM, WDT Number of I/O: 94 Program Memory Type: ROMless RAM Size: 32K x 8 Voltage – Supply (Vcc/Vdd): 1.4V ~ 3.6V Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 196-LBGA (15×15) Package / Case: 196-LBGA | 1,023 | ||
 | MCF53281CVM240 | NXP Semiconductors | IC MCU 32BIT ROMLESS 256MAPBGA | Microcontrollers | 256-MAPBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V3 Core Size: 32-Bit Single-Core Speed: 240MHz Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG Peripherals: DMA, LCD, PWM, WDT Number of I/O: 94 Program Memory Type: ROMless RAM Size: 32K x 8 Voltage – Supply (Vcc/Vdd): 1.4V ~ 3.6V Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPBGA (17×17) Package / Case: 256-LBGA | 564 | ||
 | MCF5328CVM240 | NXP Semiconductors | IC MCU 32BIT ROMLESS 256MAPBGA | Microcontrollers | 256-MAPBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V3 Core Size: 32-Bit Single-Core Speed: 240MHz Connectivity: EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG Peripherals: DMA, LCD, PWM, WDT Number of I/O: 94 Program Memory Type: ROMless RAM Size: 32K x 8 Voltage – Supply (Vcc/Vdd): 1.4V ~ 3.6V Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPBGA (17×17) Package / Case: 256-LBGA | 19 | ||
 | MCF5328CVM240J | NXP Semiconductors | IC MCU 32BIT ROMLESS 256MAPBGA | Microcontrollers | 256-MAPBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V3 Core Size: 32-Bit Single-Core Speed: 240MHz Connectivity: EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG Peripherals: DMA, LCD, PWM, WDT Number of I/O: 94 Program Memory Type: ROMless RAM Size: 32K x 8 Voltage – Supply (Vcc/Vdd): 1.4V ~ 3.6V Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPBGA (17×17) Package / Case: 256-LBGA | 314 | ||
 | MCF5329CVM240 | NXP Semiconductors | IC MCU 32BIT ROMLESS 256MAPBGA | Microcontrollers | 256-MAPBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V3 Core Size: 32-Bit Single-Core Speed: 240MHz Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG Peripherals: DMA, LCD, PWM, WDT Number of I/O: 94 Program Memory Type: ROMless RAM Size: 32K x 8 Voltage – Supply (Vcc/Vdd): 1.4V ~ 3.6V Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPBGA (17×17) Package / Case: 256-LBGA | 1,432 | ||
 | MCF5329CVM240J | NXP Semiconductors | IC MCU 32BIT ROMLESS 256MAPBGA | Microcontrollers | 256-MAPBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V3 Core Size: 32-Bit Single-Core Speed: 240MHz Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG Peripherals: DMA, LCD, PWM, WDT Number of I/O: 94 Program Memory Type: ROMless RAM Size: 32K x 8 Voltage – Supply (Vcc/Vdd): 1.4V ~ 3.6V Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPBGA (17×17) Package / Case: 256-LBGA | 2 | ||
 | MCF53721CVM240 | NXP Semiconductors | IC MCU 32BIT ROMLESS 196MAPBGA | Microcontrollers | 196-LBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V3 Core Size: 32-Bit Single-Core Speed: 240MHz Connectivity: EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG Peripherals: DMA, POR, PWM, WDT Number of I/O: 62 Program Memory Type: ROMless RAM Size: 32K x 8 Voltage – Supply (Vcc/Vdd): 1.4V ~ 3.6V Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 196-LBGA (15×15) Package / Case: 196-LBGA | 858 | ||
 | MCF5372LCVM240 | NXP Semiconductors | IC MCU 32BIT ROMLESS 196MAPBGA | Microcontrollers | 196-LBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V3 Core Size: 32-Bit Single-Core Speed: 240MHz Connectivity: EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG Peripherals: DMA, POR, PWM, WDT Number of I/O: 62 Program Memory Type: ROMless RAM Size: 32K x 8 Voltage – Supply (Vcc/Vdd): 1.4V ~ 3.6V Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 196-LBGA (15×15) Package / Case: 196-LBGA | 500 | ||
 | MCF5372LCVM240J | NXP Semiconductors | IC MCU 32BIT ROMLESS 196MAPBGA | Microcontrollers | 196-LBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V3 Core Size: 32-Bit Single-Core Speed: 240MHz Connectivity: EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG Peripherals: DMA, POR, PWM, WDT Number of I/O: 62 Program Memory Type: ROMless RAM Size: 32K x 8 Voltage – Supply (Vcc/Vdd): 1.4V ~ 3.6V Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 196-LBGA (15×15) Package / Case: 196-LBGA | 521 | ||
 | MCF5373LCVM240 | NXP Semiconductors | IC MCU 32BIT ROMLESS 196MAPBGA | Microcontrollers | 196-LBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V3 Core Size: 32-Bit Single-Core Speed: 240MHz Connectivity: EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG Peripherals: DMA, POR, PWM, WDT Number of I/O: 62 Program Memory Type: ROMless RAM Size: 32K x 8 Voltage – Supply (Vcc/Vdd): 1.4V ~ 3.6V Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 196-LBGA (15×15) Package / Case: 196-LBGA | 1,427 | ||
 | MCF5373LCVM240J | NXP Semiconductors | IC MCU 32BIT ROMLESS 196MAPBGA | Microcontrollers | 196-LBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V3 Core Size: 32-Bit Single-Core Speed: 240MHz Connectivity: EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG Peripherals: DMA, POR, PWM, WDT Number of I/O: 62 Program Memory Type: ROMless RAM Size: 32K x 8 Voltage – Supply (Vcc/Vdd): 1.4V ~ 3.6V Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 196-LBGA (15×15) Package / Case: 196-LBGA | 1,139 | ||
 | MCF5407AI162 | NXP Semiconductors | IC MCU 32BIT ROMLESS 208FQFP | Microcontrollers | 208-FQFP (28x28) | N/A | 0°C ~ 70°C (TA) | Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Speed: 162MHz Connectivity: EBI/EMI, I2C, UART/USART Peripherals: DMA, WDT Number of I/O: 16 Program Memory Type: ROMless RAM Size: 4K x 8 Voltage – Supply (Vcc/Vdd): 1.65V ~ 3.6V Oscillator Type: External Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-FQFP (28×28) Package / Case: 208-BFQFP | 448 | ||
 | MCF5407AI220 | NXP Semiconductors | IC MCU 32BIT ROMLESS 208FQFP | Microcontrollers | 208-FQFP (28x28) | N/A | 0°C ~ 70°C (TA) | Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Speed: 220MHz Connectivity: EBI/EMI, I2C, UART/USART Peripherals: DMA, WDT Number of I/O: 16 Program Memory Type: ROMless RAM Size: 4K x 8 Voltage – Supply (Vcc/Vdd): 1.65V ~ 3.6V Oscillator Type: External Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-FQFP (28×28) Package / Case: 208-BFQFP | 1,112 |
About Microcontrollers
Microcontroller products are sophisticated digital logic devices that can be programmed by the user. Microcontrollers traditionally include working memory, frequently incorporate mixed-signal peripherals, and are generally used with simpler software paradigms focused on repeating a predefined series of tasks. For applications requiring higher performance or parallel processing, designers may instead use field programmable gate arrays.
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