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Microcontrollers

Suntsu Electronics: Your premier supplier of microcontrollers. Our advanced part search tool streamlines the process of finding the ideal microcontroller for your application. Search by part number, manufacturer, or specifications and discover a comprehensive selection of high-performance microcontrollers designed to power your embedded applications.

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Total Products: 76,657
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Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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MCF5407CAI162
MCF5407CAI162NXP SemiconductorsIC MCU 32BIT ROMLESS 208FQFPMicrocontrollers208-FQFP (28x28)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
162MHz
Connectivity:
EBI/EMI, I2C, UART/USART
Peripherals:
DMA, WDT
Number of I/O:
16
Program Memory Type:
ROMless
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
1.65V ~ 3.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-FQFP (28×28)
Package / Case:
208-BFQFP
521
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MCF5407CAI220
MCF5407CAI220NXP SemiconductorsIC MCU 32BIT ROMLESS 208FQFPMicrocontrollers208-FQFP (28x28)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
220MHz
Connectivity:
EBI/EMI, I2C, UART/USART
Peripherals:
DMA, WDT
Number of I/O:
16
Program Memory Type:
ROMless
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
1.65V ~ 3.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-FQFP (28×28)
Package / Case:
208-BFQFP
975
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MCF5407CFT162
MCF5407CFT162NXP SemiconductorsIC MCU 32BIT ROMLESS 208FQFPMicrocontrollers208-FQFP (28x28)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
162MHz
Connectivity:
EBI/EMI, I2C, UART/USART
Peripherals:
DMA, WDT
Number of I/O:
16
Program Memory Type:
ROMless
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
1.65V ~ 3.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-FQFP (28×28)
Package / Case:
208-BFQFP
927
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MCF5407FT162
MCF5407FT162NXP SemiconductorsIC MCU 32BIT ROMLESS 208FQFPMicrocontrollers208-FQFP (28x28)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
162MHz
Connectivity:
EBI/EMI, I2C, UART/USART
Peripherals:
DMA, WDT
Number of I/O:
16
Program Memory Type:
ROMless
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
1.65V ~ 3.6V
Oscillator Type:
External
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-FQFP (28×28)
Package / Case:
208-BFQFP
1,245
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MCF5407FT220
MCF5407FT220NXP SemiconductorsIC MCU 32BIT ROMLESS 208FQFPMicrocontrollers208-FQFP (28x28)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
220MHz
Connectivity:
EBI/EMI, I2C, UART/USART
Peripherals:
DMA, WDT
Number of I/O:
16
Program Memory Type:
ROMless
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
1.65V ~ 3.6V
Oscillator Type:
External
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-FQFP (28×28)
Package / Case:
208-BFQFP
464
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MCF54415CMJ250
MCF54415CMJ250NXP SemiconductorsIC MCU 32BIT ROMLESS 256MAPBGAMicrocontrollers256-MAPBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
250MHz
Connectivity:
1-Wire®, CANbus, EBI/EMI, Ethernet, I2C, SmartCard, SPI, SSI, UART/USART, USB, USB OTG
Peripherals:
DMA, PWM, WDT
Number of I/O:
87
Program Memory Type:
ROMless
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.32V
Data Converters:
A/D 8x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPBGA (17×17)
Package / Case:
256-LBGA
616
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MCF54416CMJ250
MCF54416CMJ250NXP SemiconductorsIC MCU 32BIT ROMLESS 256MAPBGAMicrocontrollers256-MAPBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
250MHz
Connectivity:
1-Wire®, CANbus, EBI/EMI, Ethernet, I2C, SmartCard, SPI, SSI, UART/USART, USB, USB OTG
Peripherals:
DMA, PWM, WDT
Number of I/O:
87
Program Memory Type:
ROMless
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.32V
Data Converters:
A/D 8x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPBGA (17×17)
Package / Case:
256-LBGA
1,614
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MCF54417CMJ250
MCF54417CMJ250NXP SemiconductorsIC MCU 32BIT ROMLESS 256MAPBGAMicrocontrollers256-MAPBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
250MHz
Connectivity:
1-Wire®, CANbus, EBI/EMI, Ethernet, I2C, SmartCard, SPI, SSI, UART/USART, USB, USB OTG
Peripherals:
DMA, PWM, WDT
Number of I/O:
87
Program Memory Type:
ROMless
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.32V
Data Converters:
A/D 8x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPBGA (17×17)
Package / Case:
256-LBGA
1,389
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MCF54418CMJ250
MCF54418CMJ250NXP SemiconductorsIC MCU 32BIT ROMLESS 256MAPBGAMicrocontrollers256-MAPBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
250MHz
Connectivity:
1-Wire®, CANbus, EBI/EMI, Ethernet, I2C, SmartCard, SPI, SSI, UART/USART, USB, USB OTG
Peripherals:
DMA, PWM, WDT
Number of I/O:
87
Program Memory Type:
ROMless
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.32V
Data Converters:
A/D 8x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPBGA (17×17)
Package / Case:
256-LBGA
411
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MCF54418CMJ250R
MCF54418CMJ250RNXP SemiconductorsIC MCU 32BIT ROMLESS 256MAPBGAMicrocontrollers256-MAPBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
250MHz
Connectivity:
1-Wire®, CANbus, EBI/EMI, Ethernet, I2C, SmartCard, SPI, SSI, UART/USART, USB, USB OTG
Peripherals:
DMA, PWM, WDT
Number of I/O:
87
Program Memory Type:
ROMless
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.32V
Data Converters:
A/D 8x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPBGA (17×17)
Package / Case:
256-LBGA
698
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MCF54450ACVM180
MCF54450ACVM180NXP SemiconductorsMCF5445x - 32-bit MPU, ColdFireMicrocontrollers256-MAPBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
ColdFire V4
Core Size:
32-Bit
Speed:
180MHz
Connectivity:
I2C, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
93
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.65V
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPBGA (17×17)
Package / Case:
256-LBGA
1,511
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MCF54450AVM240
MCF54450AVM240NXP SemiconductorsIC MCU 32BIT ROMLESS 256MAPBGAMicrocontrollers256-MAPBGA (17x17)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
I2C, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
132
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPBGA (17×17)
Package / Case:
256-LBGA
1,028
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MCF54450CVM180
MCF54450CVM180NXP SemiconductorsIC MCU 32BIT ROMLESS 256MAPBGAMicrocontrollers256-MAPBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
180MHz
Connectivity:
I2C, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
132
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPBGA (17×17)
Package / Case:
256-LBGA
1,185
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MCF54450VM240
MCF54450VM240NXP SemiconductorsIC MCU 32BIT ROMLESS 256MAPBGAMicrocontrollers256-MAPBGA (17x17)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
I2C, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
132
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPBGA (17×17)
Package / Case:
256-LBGA
853
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MCF54450VM240J
MCF54450VM240JNXP SemiconductorsIC MCU 32BIT ROMLESS 256MAPBGAMicrocontrollers256-MAPBGA (17x17)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
I2C, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
132
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPBGA (17×17)
Package / Case:
256-LBGA
925
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MCF54451CVM180
MCF54451CVM180NXP SemiconductorsIC MCU 32BIT ROMLESS 256MAPBGAMicrocontrollers256-MAPBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
180MHz
Connectivity:
I2C, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
132
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPBGA (17×17)
Package / Case:
256-LBGA
350
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MCF54451VM240
MCF54451VM240NXP SemiconductorsIC MCU 32BIT ROMLESS 256MAPBGAMicrocontrollers256-MAPBGA (17x17)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
I2C, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
132
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPBGA (17×17)
Package / Case:
256-LBGA
661
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MCF54451VM240J
MCF54451VM240JNXP SemiconductorsIC MCU 32BIT ROMLESS 256MAPBGAMicrocontrollers256-MAPBGA (17x17)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
I2C, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
132
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPBGA (17×17)
Package / Case:
256-LBGA
1,360
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MCF54452CVP200
MCF54452CVP200NXP SemiconductorsIC MCU 32BIT ROMLESS 360BGAMicrocontrollers360-BGA (23x23)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
I2C, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
132
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 3.6V
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
360-BGA (23×23)
Package / Case:
360-BBGA
1,761
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MCF54452CVR200
MCF54452CVR200NXP SemiconductorsIC MCU 32BIT ROMLESS 360TEPBGAMicrocontrollers360-TEPBGA (23x23)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
I2C, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
132
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
360-TEPBGA (23×23)
Package / Case:
360-BBGA
545
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About Microcontrollers

Microcontroller products are sophisticated digital logic devices that can be programmed by the user. Microcontrollers traditionally include working memory, frequently incorporate mixed-signal peripherals, and are generally used with simpler software paradigms focused on repeating a predefined series of tasks. For applications requiring higher performance or parallel processing, designers may instead use field programmable gate arrays.

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