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Microcontrollers
Total Products: 76,657
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
 | MCF54452VP266 | NXP Semiconductors | IC MCU 32BIT ROMLESS 360BGA | Microcontrollers | 360-BGA (23x23) | N/A | 0°C ~ 70°C (TA) | Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Speed: 266MHz Connectivity: I2C, SPI, SSI, UART/USART, USB OTG Peripherals: DMA, WDT Number of I/O: 132 Program Memory Type: ROMless RAM Size: 32K x 8 Voltage – Supply (Vcc/Vdd): 1.35V ~ 3.6V Oscillator Type: External, Internal Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 360-BGA (23×23) Package / Case: 360-BBGA | 812 | ||
 | MCF54452VP266R | NXP Semiconductors | IC MCU 32BIT ROMLESS 360BGA | Microcontrollers | 360-BGA (23x23) | N/A | 0°C ~ 70°C (TA) | Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Speed: 266MHz Connectivity: I2C, SPI, SSI, UART/USART, USB OTG Peripherals: DMA, WDT Number of I/O: 132 Program Memory Type: ROMless RAM Size: 32K x 8 Voltage – Supply (Vcc/Vdd): 1.35V ~ 3.6V Oscillator Type: External, Internal Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 360-BGA (23×23) Package / Case: 360-BBGA | 287 | ||
 | MCF54452VR266 | NXP Semiconductors | IC MCU 32BIT ROMLESS 360TEPBGA | Microcontrollers | 360-TEPBGA (23x23) | N/A | 0°C ~ 70°C (TA) | Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Speed: 266MHz Connectivity: I2C, SPI, SSI, UART/USART, USB OTG Peripherals: DMA, WDT Number of I/O: 132 Program Memory Type: ROMless RAM Size: 32K x 8 Voltage – Supply (Vcc/Vdd): 1.35V ~ 3.6V Oscillator Type: Internal Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 360-TEPBGA (23×23) Package / Case: 360-BBGA | 539 | ||
 | MCF54452VR266R | NXP Semiconductors | IC MCU 32BIT ROMLESS 360TEPBGA | Microcontrollers | 360-TEPBGA (23x23) | N/A | 0°C ~ 70°C (TA) | Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Speed: 266MHz Connectivity: I2C, SPI, SSI, UART/USART, USB OTG Peripherals: DMA, WDT Number of I/O: 132 Program Memory Type: ROMless RAM Size: 32K x 8 Voltage – Supply (Vcc/Vdd): 1.35V ~ 3.6V Oscillator Type: Internal Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 360-TEPBGA (23×23) Package / Case: 360-BBGA | 221 | ||
 | MCF54453CVP200 | NXP Semiconductors | IC MCU 32BIT ROMLESS 360BGA | Microcontrollers | 360-BGA (23x23) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Speed: 200MHz Connectivity: I2C, SPI, SSI, UART/USART, USB OTG Peripherals: DMA, WDT Number of I/O: 132 Program Memory Type: ROMless RAM Size: 32K x 8 Voltage – Supply (Vcc/Vdd): 1.35V ~ 3.6V Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 360-BGA (23×23) Package / Case: 360-BBGA | 511 | ||
 | MCF54453CVR200 | NXP Semiconductors | IC MCU 32BIT ROMLESS 360TEPBGA | Microcontrollers | 360-TEPBGA (23x23) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Speed: 200MHz Connectivity: I2C, SPI, SSI, UART/USART, USB OTG Peripherals: DMA, WDT Number of I/O: 132 Program Memory Type: ROMless RAM Size: 32K x 8 Voltage – Supply (Vcc/Vdd): 1.35V ~ 3.6V Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 360-TEPBGA (23×23) Package / Case: 360-BBGA | 367 | ||
 | MCF54453VP266 | NXP Semiconductors | IC MCU 32BIT ROMLESS 360BGA | Microcontrollers | 360-BGA (23x23) | N/A | 0°C ~ 70°C (TA) | Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Speed: 266MHz Connectivity: I2C, SPI, SSI, UART/USART, USB OTG Peripherals: DMA, WDT Number of I/O: 132 Program Memory Type: ROMless RAM Size: 32K x 8 Voltage – Supply (Vcc/Vdd): 1.35V ~ 3.6V Oscillator Type: External, Internal Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 360-BGA (23×23) Package / Case: 360-BBGA | 1,409 | ||
 | MCF54453VR266 | NXP Semiconductors | IC MCU 32BIT ROMLESS 360TEPBGA | Microcontrollers | 360-TEPBGA (23x23) | N/A | 0°C ~ 70°C (TA) | Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Speed: 266MHz Connectivity: I2C, SPI, SSI, UART/USART, USB OTG Peripherals: DMA, WDT Number of I/O: 132 Program Memory Type: ROMless RAM Size: 32K x 8 Voltage – Supply (Vcc/Vdd): 1.35V ~ 3.6V Oscillator Type: Internal Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 360-TEPBGA (23×23) Package / Case: 360-BBGA | 762 | ||
 | MCF54454CVP200 | NXP Semiconductors | IC MCU 32BIT ROMLESS 360BGA | Microcontrollers | 360-BGA (23x23) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Speed: 200MHz Connectivity: I2C, SPI, SSI, UART/USART, USB OTG Peripherals: DMA, WDT Number of I/O: 132 Program Memory Type: ROMless RAM Size: 32K x 8 Voltage – Supply (Vcc/Vdd): 1.35V ~ 3.6V Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 360-BGA (23×23) Package / Case: 360-BBGA | 834 | ||
 | MCF54454CVR200 | NXP Semiconductors | IC MCU 32BIT ROMLESS 360TEPBGA | Microcontrollers | 360-TEPBGA (23x23) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Speed: 200MHz Connectivity: I2C, SPI, SSI, UART/USART, USB OTG Peripherals: DMA, WDT Number of I/O: 132 Program Memory Type: ROMless RAM Size: 32K x 8 Voltage – Supply (Vcc/Vdd): 1.35V ~ 3.6V Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 360-TEPBGA (23×23) Package / Case: 360-BBGA | 858 | ||
 | MCF54454VP266 | NXP Semiconductors | IC MCU 32BIT ROMLESS 360BGA | Microcontrollers | 360-BGA (23x23) | N/A | 0°C ~ 70°C (TA) | Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Speed: 266MHz Connectivity: I2C, SPI, SSI, UART/USART, USB OTG Peripherals: DMA, WDT Number of I/O: 132 Program Memory Type: ROMless RAM Size: 32K x 8 Voltage – Supply (Vcc/Vdd): 1.35V ~ 3.6V Oscillator Type: External, Internal Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 360-BGA (23×23) Package / Case: 360-BBGA | 1,519 | ||
 | MCF54454VR266 | NXP Semiconductors | IC MCU 32BIT ROMLESS 360TEPBGA | Microcontrollers | 360-TEPBGA (23x23) | N/A | 0°C ~ 70°C (TA) | Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Speed: 266MHz Connectivity: I2C, SPI, SSI, UART/USART, USB OTG Peripherals: DMA, WDT Number of I/O: 132 Program Memory Type: ROMless RAM Size: 32K x 8 Voltage – Supply (Vcc/Vdd): 1.35V ~ 3.6V Oscillator Type: Internal Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 360-TEPBGA (23×23) Package / Case: 360-BBGA | 1,886 | ||
 | MCF54455CVP200 | NXP Semiconductors | IC MCU 32BIT ROMLESS 360BGA | Microcontrollers | 360-BGA (23x23) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Speed: 200MHz Connectivity: I2C, SPI, SSI, UART/USART, USB OTG Peripherals: DMA, WDT Number of I/O: 132 Program Memory Type: ROMless RAM Size: 32K x 8 Voltage – Supply (Vcc/Vdd): 1.35V ~ 3.6V Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 360-BGA (23×23) Package / Case: 360-BBGA | 286 | ||
 | MCF54455CVR200 | NXP Semiconductors | IC MCU 32BIT ROMLESS 360TEPBGA | Microcontrollers | 360-TEPBGA (23x23) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Speed: 200MHz Connectivity: I2C, SPI, SSI, UART/USART, USB OTG Peripherals: DMA, WDT Number of I/O: 132 Program Memory Type: ROMless RAM Size: 32K x 8 Voltage – Supply (Vcc/Vdd): 1.35V ~ 3.6V Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 360-TEPBGA (23×23) Package / Case: 360-BBGA | 198 | ||
 | MCF54455VP266 | NXP Semiconductors | IC MCU 32BIT ROMLESS 360BGA | Microcontrollers | 360-BGA (23x23) | N/A | 0°C ~ 70°C (TA) | Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Speed: 266MHz Connectivity: I2C, SPI, SSI, UART/USART, USB OTG Peripherals: DMA, WDT Number of I/O: 132 Program Memory Type: ROMless RAM Size: 32K x 8 Voltage – Supply (Vcc/Vdd): 1.35V ~ 3.6V Oscillator Type: External, Internal Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 360-BGA (23×23) Package / Case: 360-BBGA | 694 | ||
 | MCF54455VR266 | NXP Semiconductors | IC MCU 32BIT ROMLESS 360TEPBGA | Microcontrollers | 360-TEPBGA (23x23) | N/A | 0°C ~ 70°C (TA) | Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Speed: 266MHz Connectivity: I2C, SPI, SSI, UART/USART, USB OTG Peripherals: DMA, WDT Number of I/O: 132 Program Memory Type: ROMless RAM Size: 32K x 8 Voltage – Supply (Vcc/Vdd): 1.35V ~ 3.6V Oscillator Type: Internal Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 360-TEPBGA (23×23) Package / Case: 360-BBGA | 322 | ||
 | MCF5470VR200 | NXP Semiconductors | IC MCU 32BIT ROMLESS 388PBGA | Microcontrollers | 388-PBGA (27x27) | N/A | 0°C ~ 70°C (TA) | Core Processor: Coldfire V4E Core Size: 32-Bit Single-Core Speed: 200MHz Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, PWM, WDT Number of I/O: 99 Program Memory Type: ROMless RAM Size: 32K x 8 Voltage – Supply (Vcc/Vdd): 1.43V ~ 1.58V Oscillator Type: External Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 388-PBGA (27×27) Package / Case: 388-BBGA | 1,493 | ||
 | MCF5471VR200 | NXP Semiconductors | IC MCU 32BIT ROMLESS 388PBGA | Microcontrollers | 388-PBGA (27x27) | N/A | 0°C ~ 70°C (TA) | Core Processor: Coldfire V4E Core Size: 32-Bit Single-Core Speed: 200MHz Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, PWM, WDT Number of I/O: 99 Program Memory Type: ROMless RAM Size: 32K x 8 Voltage – Supply (Vcc/Vdd): 1.43V ~ 1.58V Oscillator Type: External Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 388-PBGA (27×27) Package / Case: 388-BBGA | 11 | ||
 | MCF5471ZP200 | NXP Semiconductors | IC MCU 32BIT ROMLESS 388PBGA | Microcontrollers | 388-PBGA (27x27) | N/A | 0°C ~ 70°C (TA) | Core Processor: Coldfire V4E Core Size: 32-Bit Single-Core Speed: 200MHz Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, PWM, WDT Number of I/O: 99 Program Memory Type: ROMless RAM Size: 32K x 8 Voltage – Supply (Vcc/Vdd): 1.43V ~ 1.58V Oscillator Type: External Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 388-PBGA (27×27) Package / Case: 388-BBGA | 611 | ||
 | MCF5472VR200 | NXP Semiconductors | IC MCU 32BIT ROMLESS 388PBGA | Microcontrollers | 388-PBGA (27x27) | N/A | 0°C ~ 70°C (TA) | Core Processor: Coldfire V4E Core Size: 32-Bit Single-Core Speed: 200MHz Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, PWM, WDT Number of I/O: 99 Program Memory Type: ROMless RAM Size: 32K x 8 Voltage – Supply (Vcc/Vdd): 1.43V ~ 1.58V Oscillator Type: External Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 388-PBGA (27×27) Package / Case: 388-BBGA | 409 |
About Microcontrollers
Microcontroller products are sophisticated digital logic devices that can be programmed by the user. Microcontrollers traditionally include working memory, frequently incorporate mixed-signal peripherals, and are generally used with simpler software paradigms focused on repeating a predefined series of tasks. For applications requiring higher performance or parallel processing, designers may instead use field programmable gate arrays.
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