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Microcontrollers

Suntsu Electronics: Your premier supplier of microcontrollers. Our advanced part search tool streamlines the process of finding the ideal microcontroller for your application. Search by part number, manufacturer, or specifications and discover a comprehensive selection of high-performance microcontrollers designed to power your embedded applications.

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Total Products: 76,307
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Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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UPD70F3526GJA9-GAE-Q-H
UPD70F3526GJA9-GAE-Q-HRenesasIC MCU 32BIT 3MB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
V850E2M
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
105
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16×10/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
820
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UPD70F3526GJA9-GAE-X3-G
UPD70F3526GJA9-GAE-X3-GRenesasIC MCU 32BIT 3MB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
V850E2M
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
105
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16×10/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
831
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N/AN/AUPD70F3526GJA9-GBG-E2-Q-GRenesasIC MICROCONTROLLERMicrocontrollersN/AN/AN/A

N/A

848
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N/AN/AUPD70F3529GMA-GBK-GRenesasMCU1 V850E2/D V850E2/DX4-HMicrocontrollers176-HLQFP (24x24)N/A-40°C ~ 85°C (TA)
Core Processor:
V850E2M
Core Size:
32-Bit
Speed:
80MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
127
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 12x10b, 12x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-HLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
667
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UPD70F3529GMA9-GBK-GN/AUPD70F3529GMA9-GBK-GRenesasIC MCU 32BIT 2GB FLASH 176HLQFPMicrocontrollers176-HLQFP (24x24)N/A-40°C ~ 105°C (TA)
Core Processor:
V850E2M
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
127
Program Memory Size:
2GB (2G x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 12x10b, 12x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
176-HLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
896
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UPD70F3529GMA9-GBK-Q-GN/AUPD70F3529GMA9-GBK-Q-GRenesasIC MCU 32BIT 2GB FLASH 176HLQFPMicrocontrollers176-HLQFP (24x24)2.7V - 5.5V-40°C – 105°C
Core Processor:
V850E2M
Core Size:
32-Bit Single-Core
Speed:
80MHz
Program Memory Size:
2GB (2G x 8)
Mounting Type:
Surface Mount
1,462
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N/AN/AUPD70F3532F1A9-KN7-ARenesasMCU 32BIT HIGH-END FLASH V850E2/Microcontrollers352-BGA (23x23)N/A-40°C ~ 105°C (TA)
Core Processor:
V850E2M
Core Size:
32-Bit
Speed:
160MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
165
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x10b, 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
352-BGA (23×23)
Package / Case:
352-BGA
1,496
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N/AN/AUPD70F3537F1A9-MNM-ARenesasIC MCU 32BIT 3MB FLASH 408BGAMicrocontrollers408-BGA (27x27)N/A-40°C ~ 105°C (TA)
Core Processor:
V850E2M
Core Size:
32-Bit Single-Core
Speed:
160MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
165
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 32×10/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
408-BGA (27×27)
Package / Case:
408-BGA
1,706
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N/A
UPD70F3548AM1GCA1-UEU-AXRenesasIC MICROCONTROLLERMicrocontrollersN/AN/AN/A

N/A

648
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UPD70F3548M1GCA1-UEU-E2-DE-AXN/AUPD70F3548M1GCA1-UEU-E2-DE-AXRenesasIC MCU 32BIT 512KB FLSH 100LFQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 110°C (TA)
Core Processor:
V850E2/FG4
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
72
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 20x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 110°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
1,283
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UPD70F3548M1GCA1-UEU-E3-QS-AXN/AUPD70F3548M1GCA1-UEU-E3-QS-AXRenesasIC MCU 32BIT 512KB FLSH 100LFQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 110°C (TA)
Core Processor:
V850E2/FG4
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
72
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 20x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 110°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
452
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N/AN/AUPD70F3551M1GJA-GBG-QS-AXRenesasIC MCU 32B 512KB FLASH 144HLFQFPMicrocontrollers144-HLFQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
V850E2
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
112
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-HLFQFP (20×20)
Package / Case:
144-LQFP Exposed Pad
903
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N/AN/AUPD70F3551M1GJA1-GBG-QS-AXRenesasIC MCU 32BT 512KB FLSH 144HLFQFPMicrocontrollers144-HLFQFP (20x20)N/A-40°C ~ 110°C (TA)
Core Processor:
V850E2M
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
112
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 110°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-HLFQFP (20×20)
Package / Case:
144-LQFP Exposed Pad
278
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N/AN/AUPD70F3554M1GJA-GBG-QS-AXRenesasIC MCU 32B 1.5MB FLASH 144HLFQFPMicrocontrollers144-HLFQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
V850E2
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
112
Program Memory Size:
1.5MB (1.5M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
112K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-HLFQFP (20×20)
Package / Case:
144-LQFP Exposed Pad
1,676
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N/AN/AUPD70F3557AM1GMA-GBK-E2-QS-AXRenesasIC MCU 32BIT 1.5MB FLSH 176HLQFPMicrocontrollers176-HLQFP (24x24)N/A-40°C ~ 85°C (TA)
Core Processor:
V850E2
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
136
Program Memory Size:
1.5MB (1.5M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
112K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 40x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-HLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
148
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N/A
UPD70F3558AM1GMA1-GBK-AXRenesasIC MCU 32BIT 2MB FLASH 176HLQFPMicrocontrollers176-HLQFP (24x24)N/A-40°C ~ 110°C (TA)
Core Processor:
V850E2
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
136
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
144K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 40x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 110°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-HLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
663
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N/AN/AUPD70F3558M1GM-GBK-AX#YGRenesasIC MCU 32BIT 2MB FLASH 176HLQFPMicrocontrollers176-HLQFP (24x24)N/A-40°C ~ 85°C (TA)
Core Processor:
V850E2
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
136
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
144K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 40x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-HLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
246
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N/A
UPD70F3558M1GMA-GBK-AXRenesas32BIT MCU V850E2/FX4 T176_2424Microcontrollers176-HLQFP (24x24)N/A-40°C ~ 85°C (TA)
Core Processor:
V850E2
Core Size:
32-Bit
Speed:
80MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
137
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
144K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 40x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-HLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
106
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N/AN/AUPD70F3558M1GMA-GBK-E3-AXRenesasIC MCU 32BIT 2MB FLASH 176HLQFPMicrocontrollers176-HLQFP (24x24)N/A-40°C ~ 85°C (TA)
Core Processor:
V850E2
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
136
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
144K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 40x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-HLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
679
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N/AN/AUPD70F3558M1GMA1-GBK-AXRenesasIC MCU 32BIT 2MB FLASH 176HLQFPMicrocontrollers176-HLQFP (24x24)N/A-40°C ~ 110°C (TA)
Core Processor:
V850E2
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
136
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
144K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 40x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 110°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-HLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
1,150
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About Microcontrollers

Microcontroller products are sophisticated digital logic devices that can be programmed by the user. Microcontrollers traditionally include working memory, frequently incorporate mixed-signal peripherals, and are generally used with simpler software paradigms focused on repeating a predefined series of tasks. For applications requiring higher performance or parallel processing, designers may instead use field programmable gate arrays.

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