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Microcontrollers

Suntsu Electronics: Your premier supplier of microcontrollers. Our advanced part search tool streamlines the process of finding the ideal microcontroller for your application. Search by part number, manufacturer, or specifications and discover a comprehensive selection of high-performance microcontrollers designed to power your embedded applications.

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Total Products: 76,307
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Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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UPD70F3740GC-UEU-AX
UPD70F3740GC-UEU-AXRenesasIC MCU 32BIT 512KB FLASH 100LQFPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit Single-Core
Speed:
32MHz
Connectivity:
CSI, EBI/EMI, I2C, UART/USART
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
84
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
40K x 8
Voltage – Supply (Vcc/Vdd):
2.85V ~ 3.6V
Data Converters:
A/D 12x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
100-LQFP
1,230
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UPD70F3741GC-UEU-AX
UPD70F3741GC-UEU-AXRenesasIC MCU 32BIT 768KB FLASH 100LQFPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit Single-Core
Speed:
32MHz
Connectivity:
CSI, EBI/EMI, I2C, UART/USART
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
84
Program Memory Size:
768KB (768K x 8)
Program Memory Type:
FLASH
RAM Size:
60K x 8
Voltage – Supply (Vcc/Vdd):
2.85V ~ 3.6V
Data Converters:
A/D 12x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
100-LQFP
83
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UPD70F3742GC-UEU-AX
UPD70F3742GC-UEU-AXRenesasIC MCU 32BIT 1MB FLASH 100LQFPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit Single-Core
Speed:
32MHz
Connectivity:
CSI, EBI/EMI, I2C, UART/USART
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
84
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
60K x 8
Voltage – Supply (Vcc/Vdd):
2.85V ~ 3.6V
Data Converters:
A/D 12x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
100-LQFP
1,161
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UPD70F3743GJ-GAE-AX
UPD70F3743GJ-GAE-AXRenesasIC MCU 32BIT 384KB FLASH 144LQFPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit Single-Core
Speed:
32MHz
Connectivity:
CSI, EBI/EMI, I2C, UART/USART
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
128
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
2.85V ~ 3.6V
Data Converters:
A/D 16x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
144-LQFP
232
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UPD70F3744GJ-GAE-AX
UPD70F3744GJ-GAE-AXRenesasIC MCU 32BIT 512KB FLASH 144LQFPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit Single-Core
Speed:
32MHz
Connectivity:
CSI, EBI/EMI, I2C, UART/USART
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
128
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
40K x 8
Voltage – Supply (Vcc/Vdd):
2.85V ~ 3.6V
Data Converters:
A/D 16x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
144-LQFP
425
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UPD70F3745GJ-GAE-AX
UPD70F3745GJ-GAE-AXRenesasIC MCU 32BIT 768KB FLASH 144LQFPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit Single-Core
Speed:
32MHz
Connectivity:
CSI, EBI/EMI, I2C, UART/USART
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
128
Program Memory Size:
768KB (768K x 8)
Program Memory Type:
FLASH
RAM Size:
60K x 8
Voltage – Supply (Vcc/Vdd):
2.85V ~ 3.6V
Data Converters:
A/D 16x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
144-LQFP
668
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UPD70F3746GJ-GAE-AX
UPD70F3746GJ-GAE-AXRenesasIC MCU 32BIT 1MB FLASH 144LQFPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit Single-Core
Speed:
32MHz
Connectivity:
CSI, EBI/EMI, I2C, UART/USART
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
128
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
60K x 8
Voltage – Supply (Vcc/Vdd):
2.85V ~ 3.6V
Data Converters:
A/D 16x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
144-LQFP
1,226
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UPD70F3746GJ-GAE-M1-AX
UPD70F3746GJ-GAE-M1-AXRenesas32BIT MCU V850ES/JJ3Microcontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit
Speed:
32MHz
Connectivity:
CSI, EBI/EMI, I2C, UART/USART
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
128
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
60K x 8
Voltage – Supply (Vcc/Vdd):
2.85V ~ 3.6V
Data Converters:
A/D 16x10b SAR; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
23
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UPD70F3746GJ(R)-GAE-AX
UPD70F3746GJ(R)-GAE-AXRenesasMICRO 32BIT MID-RANGE FLASH V850Microcontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit
Speed:
32MHz
Connectivity:
CSI, EBI/EMI, I2C, UART/USART
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
128
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
60K x 8
Voltage – Supply (Vcc/Vdd):
2.85V ~ 3.6V
Data Converters:
A/D 16x10b SAR; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
1,176
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UPD70F3747GB-GAH-AX
UPD70F3747GB-GAH-AXRenesasIC MCU 32BIT 128KB FLASH 64LQFPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit Single-Core
Speed:
32MHz
Connectivity:
CSI, I2C, UART/USART
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
51
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3.7V ~ 5.5V
Data Converters:
A/D 10x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
64-LQFP
236
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UPD70F3750GK-GAK-AX
UPD70F3750GK-GAK-AXRenesasIC MCU 32BIT 256KB FLASH 80LQFPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit Single-Core
Speed:
32MHz
Connectivity:
CSI, I2C, UART/USART
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
67
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3.7V ~ 5.5V
Data Converters:
A/D 12x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
80-LQFP
1,962
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UPD70F3752GC-UEU-AX
UPD70F3752GC-UEU-AXRenesasIC MCU 32BIT 256KB FLASH 100LQFPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit Single-Core
Speed:
32MHz
Connectivity:
CSI, I2C, UART/USART
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
84
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3.7V ~ 5.5V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
100-LQFP
1,574
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UPD70F3757GJ-GAE-AX
UPD70F3757GJ-GAE-AXRenesasIC MCU 32BIT 512KB FLASH 144LQFPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit Single-Core
Speed:
32MHz
Connectivity:
CSI, EBI/EMI, I2C, UART/USART
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
128
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
3.7V ~ 5.5V
Data Converters:
A/D 24x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
144-LQFP
1,033
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UPD70F3757GJ(R)-GAE-AX
UPD70F3757GJ(R)-GAE-AXRenesasV850ES/HJ3 512KB 144LQFP 5V -40/Microcontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit
Speed:
32MHz
Connectivity:
CSI, EBI/EMI, I2C, UART/USART
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
128
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
3.7V ~ 5.5V
Data Converters:
A/D 24x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
1,603
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UPD70F3761GC-UEU-AX
UPD70F3761GC-UEU-AXRenesasIC MCU 32BIT 384KB FLASH 100LQFPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
CSI, EBI/EMI, I2C, UART/USART, USB
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
77
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
2.85V ~ 3.6V
Data Converters:
A/D 12x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
100-LQFP
546
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UPD70F3762GC-UEU-AX
UPD70F3762GC-UEU-AXRenesasIC MCU 32BIT 512KB FLASH 100LQFPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
CSI, EBI/EMI, I2C, UART/USART, USB
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
77
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
56K x 8
Voltage – Supply (Vcc/Vdd):
2.85V ~ 3.6V
Data Converters:
A/D 12x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
100-LQFP
1,298
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UPD70F3763GC-UEU-AX
UPD70F3763GC-UEU-AXRenesasIC MCU 32BIT 384KB FLASH 100LQFPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
CSI, EBI/EMI, I2C, UART/USART, USB
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
75
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
2.85V ~ 3.6V
Data Converters:
A/D 12x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
100-LQFP
491
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UPD70F3764GC-UEU-AX
UPD70F3764GC-UEU-AXRenesasIC MCU 32BIT 512KB FLASH 100LQFPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
CSI, EBI/EMI, I2C, UART/USART, USB
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
75
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
56K x 8
Voltage – Supply (Vcc/Vdd):
2.85V ~ 3.6V
Data Converters:
A/D 12x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
100-LQFP
1,214
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UPD70F3765GF-GAT-AX
UPD70F3765GF-GAT-AXRenesasIC MCU 32BIT 256KB FLASH 128LQFPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
CSI, EBI/EMI, I2C, UART/USART, USB
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
96
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
40K x 8
Voltage – Supply (Vcc/Vdd):
2.85V ~ 3.6V
Data Converters:
A/D 12x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
128-LQFP
114
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UPD70F3766GF-GAT-AX
UPD70F3766GF-GAT-AXRenesasIC MCU 32BIT 384KB FLASH 128LQFPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
CSI, EBI/EMI, I2C, UART/USART, USB
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
96
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
2.85V ~ 3.6V
Data Converters:
A/D 12x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
128-LQFP
348
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About Microcontrollers

Microcontroller products are sophisticated digital logic devices that can be programmed by the user. Microcontrollers traditionally include working memory, frequently incorporate mixed-signal peripherals, and are generally used with simpler software paradigms focused on repeating a predefined series of tasks. For applications requiring higher performance or parallel processing, designers may instead use field programmable gate arrays.

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