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Microcontrollers

Suntsu Electronics: Your premier supplier of microcontrollers. Our advanced part search tool streamlines the process of finding the ideal microcontroller for your application. Search by part number, manufacturer, or specifications and discover a comprehensive selection of high-performance microcontrollers designed to power your embedded applications.

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Total Products: 76,308
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Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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UPD70F3796GC-UEU-AX
UPD70F3796GC-UEU-AXRenesasIC MCU 32BIT 512KB FLASH 100LQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit Single-Core
Speed:
20MHz
Connectivity:
CSI, EBI/EMI, I2C, UART/USART, USB
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
80
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
40K x 8
Voltage – Supply (Vcc/Vdd):
2V ~ 3.6V
Data Converters:
A/D 12x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
1,014
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UPD70F3802GA-GAM-AX
UPD70F3802GA-GAM-AXRenesasIC MCU 32BIT 32KB FLASH 48QFNMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit Single-Core
Speed:
20MHz
Connectivity:
CSI, EBI/EMI, I2C, UART/USART
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
34
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 6x10b; D/A 1x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
48-WFQFN Exposed Pad
1,070
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UPD70F3804GA-GAM-AX
UPD70F3804GA-GAM-AXRenesasIC MCU 32BIT 128KB FLASH 48LQFPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit Single-Core
Speed:
20MHz
Connectivity:
CSI, EBI/EMI, I2C, UART/USART
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
34
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 6x10b; D/A 1x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
48-LQFP
865
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UPD70F3806GB(R)-GAH-AX
UPD70F3806GB(R)-GAH-AXRenesasIC MCU 32BIT 32KB FLASH 64LQFPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit Single-Core
Speed:
20MHz
Connectivity:
CSI, EBI/EMI, I2C, UART/USART
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
50
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 10x10b; D/A 1x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
64-LQFP
1,431
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UPD70F3815GA-GAM-AX
UPD70F3815GA-GAM-AXRenesasIC MCU 32BIT 32KB FLASH 48LQFPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
CANbus, CSI, EBI/EMI, I2C, UART/USART, USB
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
32
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
2.85V ~ 3.6V
Data Converters:
A/D 6x10b; D/A 1x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
48-LQFP
840
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UPD70F3816GA-GAM-AX
UPD70F3816GA-GAM-AXRenesasIC MCU 32BIT 64KB FLASH 48LQFPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
CANbus, CSI, EBI/EMI, I2C, UART/USART, USB
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
32
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
2.85V ~ 3.6V
Data Converters:
A/D 6x10b; D/A 1x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
48-LQFP
407
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UPD70F3817GA-GAM-AX
UPD70F3817GA-GAM-AXRenesasIC MCU 32BIT 128KB FLASH 48LQFPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
CANbus, CSI, EBI/EMI, I2C, UART/USART, USB
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
32
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
2.85V ~ 3.6V
Data Converters:
A/D 6x10b; D/A 1x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
48-LQFP
180
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UPD70F3818GA-GAM-AX
UPD70F3818GA-GAM-AXRenesasIC MCU 32BIT 256KB FLASH 48LQFPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
CANbus, CSI, EBI/EMI, I2C, UART/USART, USB
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
32
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
2.85V ~ 3.6V
Data Converters:
A/D 6x10b; D/A 1x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
48-LQFP
939
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UPD70F3820GB-GAH-AX
UPD70F3820GB-GAH-AXRenesasIC MCU 32BIT 16KB FLASH 48QFNMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
CANbus, CSI, EBI/EMI, I2C, UART/USART, USB
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
45
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2.85V ~ 3.6V
Data Converters:
A/D 10x10b; D/A 1x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
48-WFQFN Exposed Pad
523
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UPD70F3822GB-GAH-AX
UPD70F3822GB-GAH-AXRenesasIC MCU 32BIT 64KB FLASH 64LQFPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
CANbus, CSI, EBI/EMI, I2C, UART/USART, USB
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
45
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
2.85V ~ 3.6V
Data Converters:
A/D 10x10b; D/A 1x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
64-LQFP
460
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UPD70F3823GB-GAH-AX
UPD70F3823GB-GAH-AXRenesasIC MCU 32BIT 128KB FLASH 64LQFPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
CANbus, CSI, EBI/EMI, I2C, UART/USART, USB
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
45
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
2.85V ~ 3.6V
Data Converters:
A/D 10x10b; D/A 1x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
64-LQFP
725
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UPD70F3824GB-GAH-AX
UPD70F3824GB-GAH-AXRenesasIC MCU 32BIT 256KB FLASH 64LQFPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
CANbus, CSI, EBI/EMI, I2C, UART/USART, USB
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
45
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
2.85V ~ 3.6V
Data Converters:
A/D 10x10b; D/A 1x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
64-LQFP
1,478
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UPD70F3824GB(S)-GAH-AX
UPD70F3824GB(S)-GAH-AXRenesas32BIT MCU V850ES/JX3-H A064_1010Microcontrollers64-LFQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
CSI, EBI/EMI, I2C, UART/USART, USB
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
45
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
2.85V ~ 3.6V
Data Converters:
A/D 10x10b SAR; D/A 1x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
1,017
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UPD70F3825GB-GAH-AX
UPD70F3825GB-GAH-AXRenesasIC MCU 32BIT 256KB FLASH 64LQFPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
CANbus, CSI, EBI/EMI, I2C, UART/USART, USB
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
45
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
2.85V ~ 3.6V
Data Converters:
A/D 10x10b; D/A 1x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
64-LQFP
1,144
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UPD70F3826GB(R)-GAH-AX
UPD70F3826GB(R)-GAH-AXRenesasIC MCU 32BIT 64KB FLASH 64LQFPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
CANbus, CSI, Ethernet, I2C, UART/USART, USB
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
26
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
2.85V ~ 3.6V
Data Converters:
A/D 10x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
64-LQFP
512
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UPD70F3827GB(R)-GAH-AX
UPD70F3827GB(R)-GAH-AXRenesasIC MCU 32BIT 128KB FLASH 64LQFPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
CANbus, CSI, Ethernet, I2C, UART/USART, USB
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
26
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
2.85V ~ 3.6V
Data Converters:
A/D 10x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
64-LQFP
459
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UPD70F3828GB(R)-GAH-AX
UPD70F3828GB(R)-GAH-AXRenesasIC MCU 32BIT 256KB FLASH 64LQFPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
CANbus, CSI, Ethernet, I2C, UART/USART, USB
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
26
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
2.85V ~ 3.6V
Data Converters:
A/D 10x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
64-LQFP
346
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UPD70F3829GB(R)-GAH-AX
UPD70F3829GB(R)-GAH-AXRenesasIC MCU 32BIT 256KB FLASH 64LQFPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
CANbus, CSI, Ethernet, I2C, UART/USART, USB
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
26
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
2.85V ~ 3.6V
Data Converters:
A/D 10x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
64-LQFP
198
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UPD70F3834GC(R)-UEU-AX
UPD70F3834GC(R)-UEU-AXRenesasIC MCU 32BIT 64KB FLASH 100LQFPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
CANbus, CSI, Ethernet, I2C, UART/USART, USB
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
62
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
2.85V ~ 3.6V
Data Converters:
A/D 10x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
100-LQFP
186
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UPD70F3835GC(R)-UEU-AX
UPD70F3835GC(R)-UEU-AXRenesasIC MCU 32BIT 128KB FLASH 100LQFPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
CANbus, CSI, Ethernet, I2C, UART/USART, USB
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
62
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
2.85V ~ 3.6V
Data Converters:
A/D 10x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
100-LQFP
454
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About Microcontrollers

Microcontroller products are sophisticated digital logic devices that can be programmed by the user. Microcontrollers traditionally include working memory, frequently incorporate mixed-signal peripherals, and are generally used with simpler software paradigms focused on repeating a predefined series of tasks. For applications requiring higher performance or parallel processing, designers may instead use field programmable gate arrays.

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