Microcontrollers

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Total Products: 76,658
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Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
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DSPIC33EP128GM310-H/BGDSPIC33EP128GM310-H/BGMicrochip TechnologyIC MCU 16BIT 128KB FLSH 121TFBGAMicrocontrollers121-TFBGA (10x10)N/A-40°C ~ 150°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Connectivity:
I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
85
Program Memory Size:
128KB (43K x 24)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Data Converters:
A/D 49x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
121-TFBGA (10×10)
Package / Case:
121-TFBGA
1,105
DSPIC33EP128GM310-H/PFDSPIC33EP128GM310-H/PFMicrochip TechnologyIC MCU 16BIT 128KB FLASH 100TQFPMicrocontrollers100-TQFP (14x14)N/A-40°C ~ 150°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Connectivity:
I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
85
Program Memory Size:
128KB (43K x 24)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Data Converters:
A/D 49x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14×14)
Package / Case:
100-TQFP
158
DSPIC33EP128GM310-H/PTDSPIC33EP128GM310-H/PTMicrochip TechnologyIC MCU 16BIT 128KB FLASH 100TQFPMicrocontrollers100-TQFP (12x12)N/A-40°C ~ 150°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Connectivity:
I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
85
Program Memory Size:
128KB (43K x 24)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Data Converters:
A/D 49x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (12×12)
Package / Case:
100-TQFP
769
DSPIC33EP128GM310-I/BGDSPIC33EP128GM310-I/BGMicrochip TechnologyIC MCU 16BIT 128KB FLSH 121TFBGAMicrocontrollers121-TFBGA (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
85
Program Memory Size:
128KB (43K x 24)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 49x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
121-TFBGA (10×10)
Package / Case:
121-TFBGA
144
DSPIC33EP128GM310-I/PFDSPIC33EP128GM310-I/PFMicrochip TechnologyIC MCU 16BIT 128KB FLASH 100TQFPMicrocontrollers100-TQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
85
Program Memory Size:
128KB (43K x 24)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 49x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14×14)
Package / Case:
100-TQFP
1,328
DSPIC33EP128GM310-I/PTDSPIC33EP128GM310-I/PTMicrochip TechnologyIC MCU 16BIT 128KB FLASH 100TQFPMicrocontrollers100-TQFP (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
85
Program Memory Size:
128KB (43K x 24)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 49x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (12×12)
Package / Case:
100-TQFP
1,901
DSPIC33EP128GM310T-I/BGDSPIC33EP128GM310T-I/BGMicrochip TechnologyIC MCU 16BIT 128KB FLSH 121TFBGAMicrocontrollers121-TFBGA (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
85
Program Memory Size:
128KB (43K x 24)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 49x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
121-TFBGA (10×10)
Package / Case:
121-TFBGA
874
DSPIC33EP128GM310T-I/PFDSPIC33EP128GM310T-I/PFMicrochip TechnologyIC MCU 16BIT 128KB FLASH 100TQFPMicrocontrollers100-TQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
85
Program Memory Size:
128KB (43K x 24)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 49x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14×14)
Package / Case:
100-TQFP
473
DSPIC33EP128GM310T-I/PTDSPIC33EP128GM310T-I/PTMicrochip TechnologyIC MCU 16BIT 128KB FLASH 100TQFPMicrocontrollers100-TQFP (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
85
Program Memory Size:
128KB (43K x 24)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 49x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (12×12)
Package / Case:
100-TQFP
853
DSPIC33EP128GM604-E/MLDSPIC33EP128GM604-E/MLMicrochip TechnologyIC MCU 16BIT 128KB FLASH 44QFNMicrocontrollers44-QFN (8x8)N/A-40°C ~ 125°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
60 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
35
Program Memory Size:
128KB (43K x 24)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 18x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
44-QFN (8×8)
Package / Case:
44-VQFN Exposed Pad
397
DSPIC33EP128GM604-E/PTDSPIC33EP128GM604-E/PTMicrochip TechnologyIC MCU 16BIT 128KB FLASH 44TQFPMicrocontrollers44-TQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
60 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
35
Program Memory Size:
128KB (43K x 24)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 18x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
44-TQFP (10×10)
Package / Case:
44-TQFP
736
DSPIC33EP128GM604-H/MLDSPIC33EP128GM604-H/MLMicrochip TechnologyIC MCU 16BIT 128KB FLASH 44QFNMicrocontrollers44-QFN (8x8)N/A-40°C ~ 150°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
35
Program Memory Size:
128KB (43K x 24)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Data Converters:
A/D 18x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
44-QFN (8×8)
Package / Case:
44-VQFN Exposed Pad
341
DSPIC33EP128GM604-H/PTDSPIC33EP128GM604-H/PTMicrochip TechnologyIC MCU 16BIT 128KB FLASH 44TQFPMicrocontrollers44-TQFP (10x10)N/A-40°C ~ 150°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
35
Program Memory Size:
128KB (43K x 24)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Data Converters:
A/D 18x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
44-TQFP (10×10)
Package / Case:
44-TQFP
1,757
DSPIC33EP128GM604-I/MLDSPIC33EP128GM604-I/MLMicrochip TechnologyIC MCU 16BIT 128KB FLASH 44QFNMicrocontrollers44-QFN (8x8)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
35
Program Memory Size:
128KB (43K x 24)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 18x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-QFN (8×8)
Package / Case:
44-VQFN Exposed Pad
763
DSPIC33EP128GM604-I/PTDSPIC33EP128GM604-I/PTMicrochip TechnologyIC MCU 16BIT 128KB FLASH 44TQFPMicrocontrollers44-TQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
35
Program Memory Size:
128KB (43K x 24)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 18x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-TQFP (10×10)
Package / Case:
44-TQFP
132
DSPIC33EP128GM604T-I/MLDSPIC33EP128GM604T-I/MLMicrochip TechnologyIC MCU 16BIT 128KB FLASH 44QFNMicrocontrollers44-QFN (8x8)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
35
Program Memory Size:
128KB (43K x 24)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 18x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-QFN (8×8)
Package / Case:
44-VQFN Exposed Pad
945
DSPIC33EP128GM604T-I/PTDSPIC33EP128GM604T-I/PTMicrochip TechnologyIC MCU 16BIT 128KB FLASH 44TQFPMicrocontrollers44-TQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
35
Program Memory Size:
128KB (43K x 24)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 18x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-TQFP (10×10)
Package / Case:
44-TQFP
778
DSPIC33EP128GM706-E/MRDSPIC33EP128GM706-E/MRMicrochip TechnologyIC MCU 16BIT 128KB FLASH 64VQFNMicrocontrollers64-VQFN (9x9)N/A-40°C ~ 125°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
60 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
128KB (43K x 24)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 30x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
64-VQFN (9×9)
Package / Case:
64-VFQFN Exposed Pad
541
DSPIC33EP128GM706-E/PTDSPIC33EP128GM706-E/PTMicrochip TechnologyIC MCU 16BIT 128KB FLASH 64TQFPMicrocontrollers64-TQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
60 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
128KB (43K x 24)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 30x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
64-TQFP (10×10)
Package / Case:
64-TQFP
1,654
DSPIC33EP128GM706-H/MRDSPIC33EP128GM706-H/MRMicrochip TechnologyIC MCU 16BIT 128KB FLASH 64VQFNMicrocontrollers64-VQFN (9x9)N/A-40°C ~ 150°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
128KB (43K x 24)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Data Converters:
A/D 30x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
64-VQFN (9×9)
Package / Case:
64-VFQFN Exposed Pad
1,191

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About Microcontrollers

Microcontroller products are sophisticated digital logic devices that can be programmed by the user. Microcontrollers traditionally include working memory, frequently incorporate mixed-signal peripherals, and are generally used with simpler software paradigms focused on repeating a predefined series of tasks. For applications requiring higher performance or parallel processing, designers may instead use field programmable gate arrays.

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