Microcontrollers

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Total Products: 76,658
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Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
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DSPIC33EP128GM706-H/PTDSPIC33EP128GM706-H/PTMicrochip TechnologyIC MCU 16BIT 128KB FLASH 64TQFPMicrocontrollers64-TQFP (10x10)N/A-40°C ~ 150°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
128KB (43K x 24)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Data Converters:
A/D 30x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
64-TQFP (10×10)
Package / Case:
64-TQFP
697
DSPIC33EP128GM706-I/MRDSPIC33EP128GM706-I/MRMicrochip TechnologyIC MCU 16BIT 128KB FLASH 64VQFNMicrocontrollers64-VQFN (9x9)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
128KB (43K x 24)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 30x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-VQFN (9×9)
Package / Case:
64-VFQFN Exposed Pad
1,373
DSPIC33EP128GM706-I/PTDSPIC33EP128GM706-I/PTMicrochip TechnologyIC MCU 16BIT 128KB FLASH 64TQFPMicrocontrollers64-TQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
128KB (43K x 24)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 30x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-TQFP (10×10)
Package / Case:
64-TQFP
766
DSPIC33EP128GM706T-I/MRDSPIC33EP128GM706T-I/MRMicrochip TechnologyIC MCU 16BIT 128KB FLASH 64VQFNMicrocontrollers64-VQFN (9x9)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
128KB (43K x 24)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 30x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-VQFN (9×9)
Package / Case:
64-VFQFN Exposed Pad
1,113
DSPIC33EP128GM706T-I/PTDSPIC33EP128GM706T-I/PTMicrochip TechnologyIC MCU 16BIT 128KB FLASH 64TQFPMicrocontrollers64-TQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
128KB (43K x 24)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 30x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-TQFP (10×10)
Package / Case:
64-TQFP
1,126
DSPIC33EP128GM710-E/BGDSPIC33EP128GM710-E/BGMicrochip TechnologyIC MCU 16BIT 128KB FLSH 121TFBGAMicrocontrollers121-TFBGA (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
60 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
85
Program Memory Size:
128KB (43K x 24)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 49x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
121-TFBGA (10×10)
Package / Case:
121-TFBGA
459
DSPIC33EP128GM710-E/PFDSPIC33EP128GM710-E/PFMicrochip TechnologyIC MCU 16BIT 128KB FLASH 100TQFPMicrocontrollers100-TQFP (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
60 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
85
Program Memory Size:
128KB (43K x 24)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 49x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14×14)
Package / Case:
100-TQFP
1,567
DSPIC33EP128GM710-E/PTDSPIC33EP128GM710-E/PTMicrochip TechnologyIC MCU 16BIT 128KB FLASH 100TQFPMicrocontrollers100-TQFP (12x12)N/A-40°C ~ 125°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
60 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
85
Program Memory Size:
128KB (43K x 24)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 49x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (12×12)
Package / Case:
100-TQFP
1,445
DSPIC33EP128GM710-H/BGDSPIC33EP128GM710-H/BGMicrochip TechnologyIC MCU 16BIT 128KB FLSH 121TFBGAMicrocontrollers121-TFBGA (10x10)N/A-40°C ~ 150°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
85
Program Memory Size:
128KB (43K x 24)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Data Converters:
A/D 49x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
121-TFBGA (10×10)
Package / Case:
121-TFBGA
87
DSPIC33EP128GM710-H/PFDSPIC33EP128GM710-H/PFMicrochip TechnologyIC MCU 16BIT 128KB FLASH 100TQFPMicrocontrollers100-TQFP (14x14)N/A-40°C ~ 150°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
85
Program Memory Size:
128KB (43K x 24)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Data Converters:
A/D 49x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14×14)
Package / Case:
100-TQFP
914
DSPIC33EP128GM710-H/PTDSPIC33EP128GM710-H/PTMicrochip TechnologyIC MCU 16BIT 128KB FLASH 100TQFPMicrocontrollers100-TQFP (12x12)N/A-40°C ~ 150°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
85
Program Memory Size:
128KB (43K x 24)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Data Converters:
A/D 49x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (12×12)
Package / Case:
100-TQFP
1,239
DSPIC33EP128GM710-I/BGDSPIC33EP128GM710-I/BGMicrochip TechnologyIC MCU 16BIT 128KB FLSH 121TFBGAMicrocontrollers121-TFBGA (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
85
Program Memory Size:
128KB (43K x 24)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 49x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
121-TFBGA (10×10)
Package / Case:
121-TFBGA
822
DSPIC33EP128GM710-I/PFDSPIC33EP128GM710-I/PFMicrochip TechnologyIC MCU 16BIT 128KB FLASH 100TQFPMicrocontrollers100-TQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
85
Program Memory Size:
128KB (43K x 24)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 49x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14×14)
Package / Case:
100-TQFP
599
DSPIC33EP128GM710-I/PTDSPIC33EP128GM710-I/PTMicrochip TechnologyIC MCU 16BIT 128KB FLASH 100TQFPMicrocontrollers100-TQFP (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
85
Program Memory Size:
128KB (43K x 24)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 49x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (12×12)
Package / Case:
100-TQFP
1,042
DSPIC33EP128GM710T-I/BGDSPIC33EP128GM710T-I/BGMicrochip TechnologyIC MCU 16BIT 128KB FLSH 121TFBGAMicrocontrollers121-TFBGA (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
85
Program Memory Size:
128KB (43K x 24)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 49x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
121-TFBGA (10×10)
Package / Case:
121-TFBGA
1,211
DSPIC33EP128GM710T-I/PFDSPIC33EP128GM710T-I/PFMicrochip TechnologyIC MCU 16BIT 128KB FLASH 100TQFPMicrocontrollers100-TQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
85
Program Memory Size:
128KB (43K x 24)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 49x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14×14)
Package / Case:
100-TQFP
391
DSPIC33EP128GM710T-I/PTDSPIC33EP128GM710T-I/PTMicrochip TechnologyIC MCU 16BIT 128KB FLASH 100TQFPMicrocontrollers100-TQFP (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
85
Program Memory Size:
128KB (43K x 24)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 49x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (12×12)
Package / Case:
100-TQFP
256
DSPIC33EP128GP502-E/MMDSPIC33EP128GP502-E/MMMicrochip TechnologyIC MCU 16BIT 128KB FLASH 28QFNMicrocontrollers28-QFN-S (6x6)N/A-40°C ~ 125°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
60 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
21
Program Memory Size:
128KB (43K x 24)
Program Memory Type:
FLASH
RAM Size:
8K x 16
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 6x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
28-QFN-S (6×6)
Package / Case:
28-VQFN Exposed Pad
766
DSPIC33EP128GP502-E/SODSPIC33EP128GP502-E/SOMicrochip TechnologyIC MCU 16BIT 128KB FLASH 28SOICMicrocontrollers28-SOICN/A-40°C ~ 125°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
60 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
21
Program Memory Size:
128KB (43K x 24)
Program Memory Type:
FLASH
RAM Size:
8K x 16
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 6x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
28-SOIC
Package / Case:
28-SOIC (0.295″”, 7.50mm Width)
886
DSPIC33EP128GP502-E/SPDSPIC33EP128GP502-E/SPMicrochip TechnologyIC MCU 16BIT 128KB FLASH 28SPDIPMicrocontrollers28-SPDIPN/A-40°C ~ 125°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
60 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
21
Program Memory Size:
128KB (43K x 24)
Program Memory Type:
FLASH
RAM Size:
8K x 16
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 6x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Through Hole
Supplier Device Package:
28-SPDIP
Package / Case:
28-DIP (0.300″”, 7.62mm)
228

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About Microcontrollers

Microcontroller products are sophisticated digital logic devices that can be programmed by the user. Microcontrollers traditionally include working memory, frequently incorporate mixed-signal peripherals, and are generally used with simpler software paradigms focused on repeating a predefined series of tasks. For applications requiring higher performance or parallel processing, designers may instead use field programmable gate arrays.

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