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Total Products: 5,357
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/A
FWIXP425ABCIntelIC MPU IXP425 400MHZ PBGA492Microprocessors492-PBGA (35x35)N/A0°C ~ 70°C (TA)
Core Processor:
Intel® IXP42X
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (2)
USB:
USB 1.1 (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Security Features:
3DES, AES, DES, MD5, SHA-1
Mounting Type:
Surface Mount
Package / Case:
492-BBGA
Supplier Device Package:
492-PBGA (35×35)
Additional Interfaces:
HDLC, HSS, PCI, UART, UTOPIA 2
482
FWIXP425BB
FWIXP425BBIntelIC MPU 266MHZ 492BGAMicroprocessors492-BGA (35x35)N/A0°C ~ 70°C
Core Processor:
Xscale
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Communications; Network Processor Engine, Math Engine; Multiply-Accumulate
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (2)
USB:
USB 1.1 (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 70°C
Security Features:
Cryptography
Mounting Type:
Surface Mount
Package / Case:
492-BBGA
Supplier Device Package:
492-BGA (35×35)
Additional Interfaces:
HSS, MII, PCI, UART, UTOPIA 2
1,004
FX053013N/AFX053013Texas InstrumentsIC MPU C6-INTEG 300MHZ 298NFBGAMicroprocessors298-NFBGA (13x13)N/A0°C ~ 90°C
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
300MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
DDR2, DDR3, DDR3L, LPDDR
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, Touchscreen
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 90°C
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
298-LFBGA
Supplier Device Package:
298-NFBGA (13×13)
Additional Interfaces:
CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART
196
N/AN/AG4860NSE7QUMDNXP SemiconductorsIC MPU QORIQ 1.6GHZ 1020FCPBGAMicroprocessors1020-FCPBGA (33x33)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e6500
Number of Cores/Bus Width:
4 Core, 64-Bit
Speed:
1.6GHz
Co-Processors/DSP:
Signal Processing; SC3900FP FVP – 6 Core
RAM Controllers:
DDR3, DDR3L
Graphics Acceleration:
No
Ethernet:
1/2.5Gbps (4), 1/2.5/10Gbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
Mounting Type:
Surface Mount
Package / Case:
1020-BBGA, FCBGA
Supplier Device Package:
1020-FCPBGA (33×33)
Additional Interfaces:
I2C, MMC/SD, RapidIO, SPI, UART
581
N/AN/AG4860NSN7QUMDNXP SemiconductorsIC MPU QORIQ 1.6GHZ 1020FCPBGAMicroprocessors1020-FCPBGA (33x33)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e6500
Number of Cores/Bus Width:
4 Core, 64-Bit
Speed:
1.6GHz
Co-Processors/DSP:
Signal Processing; SC3900FP FVP – 6 Core
RAM Controllers:
DDR3, DDR3L
Graphics Acceleration:
No
Ethernet:
1/2.5Gbps (4), 1/2.5/10Gbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
Mounting Type:
Surface Mount
Package / Case:
1020-BBGA, FCBGA
Supplier Device Package:
1020-FCPBGA (33×33)
Additional Interfaces:
I2C, MMC/SD, RapidIO, SPI, UART
552
N/AN/AG4860NXE7QUMDNXP SemiconductorsIC MPU QORIQ 1.6GHZ 1020FCPBGAMicroprocessors1020-FCPBGA (33x33)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e6500
Number of Cores/Bus Width:
4 Core, 64-Bit
Speed:
1.6GHz
Co-Processors/DSP:
Signal Processing; SC3900FP FVP – 6 Core
RAM Controllers:
DDR3, DDR3L
Graphics Acceleration:
No
Ethernet:
1/2.5Gbps (4), 1/2.5/10Gbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
Mounting Type:
Surface Mount
Package / Case:
1020-BBGA, FCBGA
Supplier Device Package:
1020-FCPBGA (33×33)
Additional Interfaces:
I2C, MMC/SD, RapidIO, SPI, UART
134
N/AN/AG4860NXN7QUMDNXP SemiconductorsIC MPU QORIQ 1.6GHZ 1020FCPBGAMicroprocessors1020-FCPBGA (33x33)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e6500
Number of Cores/Bus Width:
4 Core, 64-Bit
Speed:
1.6GHz
Co-Processors/DSP:
Signal Processing; SC3900FP FVP – 6 Core
RAM Controllers:
DDR3, DDR3L
Graphics Acceleration:
No
Ethernet:
1/2.5Gbps (4), 1/2.5/10Gbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
Mounting Type:
Surface Mount
Package / Case:
1020-BBGA, FCBGA
Supplier Device Package:
1020-FCPBGA (33×33)
Additional Interfaces:
I2C, MMC/SD, RapidIO, SPI, UART
824
GCIXP1200GA
GCIXP1200GAIntelIC MPU STRONGARM 166MHZ 432BGAMicroprocessors432-BGA (40x40)N/A0°C ~ 70°C (TA)
Core Processor:
StrongARM
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
166MHz
Co-Processors/DSP:
Data; Microengine
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
432-LBGA
Supplier Device Package:
432-BGA (40×40)
388
GCIXP1200GB
GCIXP1200GBIntelIC MPU 200MHZ 432BGAMicroprocessors432-BGA (40x40)N/A0°C ~ 70°C
Core Processor:
StrongARM
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
200MHz
Co-Processors/DSP:
Data; Microengine
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 70°C
Mounting Type:
Surface Mount
Package / Case:
432-LBGA
Supplier Device Package:
432-BGA (40×40)
518
N/A
GCIXP1200GCIntelINTEL IXP1200 NETWORK PROCESSORMicroprocessorsN/AN/AN/A

N/A

1,622
GCIXP1240AA
GCIXP1240AAIntelIC MPU STRONGARM 166MHZ 432BGAMicroprocessors432-BGA (40x40)N/A0°C ~ 70°C (TA)
Core Processor:
StrongARM
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
166MHz
Co-Processors/DSP:
Data; Microengine
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
432-LBGA
Supplier Device Package:
432-BGA (40×40)
1,081
GCIXP1240AB
GCIXP1240ABIntelIC MPU STRONGARM 200MHZ 432BGAMicroprocessors432-BGA (40x40)N/A0°C ~ 70°C (TA)
Core Processor:
StrongARM
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
200MHz
Co-Processors/DSP:
Data; Microengine
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
432-LBGA
Supplier Device Package:
432-BGA (40×40)
466
GCIXP1240AC
GCIXP1240ACIntelIC MPU 232MHZ 432BGAMicroprocessors432-BGA (40x40)N/A0°C ~ 70°C (TA)
Core Processor:
StrongARM
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
232MHz
Co-Processors/DSP:
Data; Microengine
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
432-LBGA
Supplier Device Package:
432-BGA (40×40)
235
GCIXP1250BA
GCIXP1250BAIntelIC MPU STRONGARM 166MHZ 520BGAMicroprocessors520-HL-PBGA (40x40)N/A0°C ~ 70°C (TA)
Core Processor:
StrongARM
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
166MHz
Co-Processors/DSP:
Data; Microengine
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
520-LFBGA
Supplier Device Package:
520-HL-PBGA (40×40)
1,906
GCIXP1250BB
GCIXP1250BBIntelIC MPU STRONGARM 200MHZ 520BGAMicroprocessors520-HL-PBGA (40x40)N/A0°C ~ 70°C (TA)
Core Processor:
StrongARM
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
200MHz
Co-Processors/DSP:
Data; Microengine
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
520-LFBGA
Supplier Device Package:
520-HL-PBGA (40×40)
1,228
GCIXP1250BC
GCIXP1250BCIntelIC MPU STRONGARM 232MHZ 520BGAMicroprocessors520-HL-PBGA (40x40)N/A0°C ~ 70°C (TA)
Core Processor:
StrongARM
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
232MHz
Co-Processors/DSP:
Data; Microengine
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
520-LFBGA
Supplier Device Package:
520-HL-PBGA (40×40)
896
GD80960JA25
GD80960JA25IntelIC MPU I960 25MHZ 196BGAMicroprocessors196-BGAN/A0°C ~ 100°C (TC)
Core Processor:
i960
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 100°C (TC)
Mounting Type:
Surface Mount
Package / Case:
196-BGA
Supplier Device Package:
196-BGA
1,144
GD80960JF33
GD80960JF33IntelIC MPU I960 33MHZ 196BGAMicroprocessors196-BGAN/A0°C ~ 100°C (TC)
Core Processor:
i960
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
33MHz
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 100°C (TC)
Mounting Type:
Surface Mount
Package / Case:
196-BGA
Supplier Device Package:
196-BGA
591
N/A
GWIXP425ABBTIntelIC MPU INTEL 266MHZ PBGA492Microprocessors492-PBGA (35x35)N/A-40°C ~ 85°C (TA)
Core Processor:
Intel® IXP42X
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (2)
USB:
USB 1.1 (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
3DES, AES, DES, MD5, SHA-1
Mounting Type:
Surface Mount
Package / Case:
492-BBGA
Supplier Device Package:
492-PBGA (35×35)
Additional Interfaces:
HDLC, HSS, PCI, UART, UTOPIA 2
568
N/A
GWIXP425ABCTIntelIC MPU INTEL 400MHZ PBGA492Microprocessors492-PBGA (35x35)N/A-40°C ~ 85°C (TA)
Core Processor:
Intel® IXP42X
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (2)
USB:
USB 1.1 (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
3DES, AES, DES, MD5, SHA-1
Mounting Type:
Surface Mount
Package / Case:
492-BBGA
Supplier Device Package:
492-PBGA (35×35)
Additional Interfaces:
HDLC, HSS, PCI, UART, UTOPIA 2
420

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