FX053013

IC MPU C6-INTEG 300MHZ 298NFBGA
Part Description

ARM® Cortex®-A8 Microprocessor IC C6-Integra™, DaVinci™, Sitara™ 1 Core, 32-Bit 300MHz 298-NFBGA (13x13)

Quantity 168 Available (as of October 8, 2026)
Product CategoryMicroprocessors
ManufacturerTexas Instruments
Manufacturing StatusActive
Manufacturer Standard Lead Time6 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A8Device Package298-NFBGA (13x13)
Display & Interface ControllersLCD, TouchscreenECCN5A992CEthernet10/100/1000Mbps (2)
GradeCommercialGraphics AccelerationYesHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 90°CPackage / Case298-LFBGA
RAM ControllersDDR2, DDR3, DDR3L, LPDDRREACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Security FeaturesCryptography, Random Number GeneratorSpeed300MHzSupplier Device Package298-NFBGA (13×13)
USBUSB 2.0 + PHY (2)Voltage – I/O1.8V, 3.3V

Overview of FX053013 – ARM Cortex-A8 300 MHz Microprocessor (298-NFBGA)

The FX053013 is a Texas Instruments ARM® Cortex®-A8 microprocessor IC offered in a 298‑NFBGA (13×13) package. It provides a single 32‑bit core running at 300 MHz with multimedia-focused co‑processing and a broad set of memory and I/O interfaces for embedded system integration.

Designed for commercial embedded applications requiring integrated connectivity, display support and hardware security, this device combines processing, multimedia acceleration and multi‑interface connectivity in a surface‑mount BGA package.

Key Features

  • Core — ARM® Cortex®-A8 single 32‑bit core operating at 300 MHz, suitable for embedded compute tasks.
  • Multimedia Co‑processors — Includes multimedia co‑processing support and NEON™ SIMD for optimized media and signal processing workloads.
  • Memory Controllers — Integrated controllers for DDR2, DDR3, DDR3L and LPDDR memory types to support a range of memory performance and power targets.
  • Display Support — Display interface controllers for LCD and touchscreen integration, enabling embedded user interfaces.
  • Networking — Two 10/100/1000 Mbps Ethernet interfaces for wired network connectivity.
  • USB — Two USB 2.0 ports with PHY for host/device connectivity.
  • Additional Interfaces — CAN interface for vehicle or industrial network integration and other control applications.
  • Security — Hardware cryptography and a random number generator to support secure communications and trusted functions.
  • Graphics — Graphics acceleration supported to offload display and UI rendering tasks.
  • Package & Mounting — 298‑LFBGA package case / 298‑NFBGA (13×13) supplier device package; surface mount mounting type.
  • Operating Range — Commercial grade operation from 0 °C to 90 °C.
  • Compliance — RoHS compliant.

Typical Applications

  • Human‑Machine Interfaces — LCD and touchscreen controllers plus graphics acceleration make the device suitable for embedded displays and control panels.
  • Multimedia Systems — NEON™ SIMD and multimedia co‑processors support audio/video processing and other media tasks in embedded products.
  • Industrial Networking — Dual Gigabit Ethernet and CAN support wired networking and industrial communication use cases.
  • Embedded Connectivity — Multiple USB 2.0 ports and various memory interface options enable peripheral-rich embedded designs.

Unique Advantages

  • Single‑chip integration: Combines CPU core, multimedia co‑processors, memory controllers and multiple I/O interfaces to reduce external components and simplify board design.
  • Flexible memory support: Native controllers for DDR2/DDR3/DDR3L/LPDDR allow designers to match memory technology to system performance and power needs.
  • Dual high‑speed networking: Two 10/100/1000 Mbps Ethernet ports enable robust wired connectivity options for networked embedded systems.
  • Hardware security primitives: Built‑in cryptography and a random number generator provide hardware‑level support for secure communications and trusted functions.
  • Compact BGA footprint: 298‑NFBGA (13×13) surface‑mount package supports high‑density PCB layouts for space‑constrained applications.
  • Commercial temperature rating: Rated for 0 °C to 90 °C operation to meet typical commercial embedded deployment environments.

Why Choose FX053013?

The FX053013 positions a 300 MHz ARM® Cortex®‑A8 core alongside multimedia acceleration, dual Gigabit Ethernet, multiple USB ports and broad memory support in a single, surface‑mount BGA package. This combination provides a balanced platform for embedded designs that require integrated connectivity, display capability and hardware security while maintaining a compact board footprint.

It is well suited for engineers and product teams developing commercial embedded systems that need a validated set of interfaces and processing features, offering design scalability through flexible memory options and a package compatible with modern PCB assembly processes.

Request a quote or submit a purchasing inquiry to receive pricing and availability for FX053013 and discuss how this microprocessor can fit your next embedded design.

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