FX053013
| Part Description |
ARM® Cortex®-A8 Microprocessor IC C6-Integra™, DaVinci™, Sitara™ 1 Core, 32-Bit 300MHz 298-NFBGA (13x13) |
|---|---|
| Quantity | 168 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Manufacturer | Texas Instruments |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 6 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A8 | Device Package | 298-NFBGA (13x13) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | LCD, Touchscreen | ECCN | 5A992C | Ethernet | 10/100/1000Mbps (2) | ||
| Grade | Commercial | Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | Mounting Type | Surface Mount | ||
| Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | 0°C ~ 90°C | Package / Case | 298-LFBGA | ||
| RAM Controllers | DDR2, DDR3, DDR3L, LPDDR | REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | ||
| Security Features | Cryptography, Random Number Generator | Speed | 300MHz | Supplier Device Package | 298-NFBGA (13×13) | ||
| USB | USB 2.0 + PHY (2) | Voltage – I/O | 1.8V, 3.3V |
Overview of FX053013 – ARM Cortex-A8 300 MHz Microprocessor (298-NFBGA)
The FX053013 is a Texas Instruments ARM® Cortex®-A8 microprocessor IC offered in a 298‑NFBGA (13×13) package. It provides a single 32‑bit core running at 300 MHz with multimedia-focused co‑processing and a broad set of memory and I/O interfaces for embedded system integration.
Designed for commercial embedded applications requiring integrated connectivity, display support and hardware security, this device combines processing, multimedia acceleration and multi‑interface connectivity in a surface‑mount BGA package.
Key Features
- Core — ARM® Cortex®-A8 single 32‑bit core operating at 300 MHz, suitable for embedded compute tasks.
- Multimedia Co‑processors — Includes multimedia co‑processing support and NEON™ SIMD for optimized media and signal processing workloads.
- Memory Controllers — Integrated controllers for DDR2, DDR3, DDR3L and LPDDR memory types to support a range of memory performance and power targets.
- Display Support — Display interface controllers for LCD and touchscreen integration, enabling embedded user interfaces.
- Networking — Two 10/100/1000 Mbps Ethernet interfaces for wired network connectivity.
- USB — Two USB 2.0 ports with PHY for host/device connectivity.
- Additional Interfaces — CAN interface for vehicle or industrial network integration and other control applications.
- Security — Hardware cryptography and a random number generator to support secure communications and trusted functions.
- Graphics — Graphics acceleration supported to offload display and UI rendering tasks.
- Package & Mounting — 298‑LFBGA package case / 298‑NFBGA (13×13) supplier device package; surface mount mounting type.
- Operating Range — Commercial grade operation from 0 °C to 90 °C.
- Compliance — RoHS compliant.
Typical Applications
- Human‑Machine Interfaces — LCD and touchscreen controllers plus graphics acceleration make the device suitable for embedded displays and control panels.
- Multimedia Systems — NEON™ SIMD and multimedia co‑processors support audio/video processing and other media tasks in embedded products.
- Industrial Networking — Dual Gigabit Ethernet and CAN support wired networking and industrial communication use cases.
- Embedded Connectivity — Multiple USB 2.0 ports and various memory interface options enable peripheral-rich embedded designs.
Unique Advantages
- Single‑chip integration: Combines CPU core, multimedia co‑processors, memory controllers and multiple I/O interfaces to reduce external components and simplify board design.
- Flexible memory support: Native controllers for DDR2/DDR3/DDR3L/LPDDR allow designers to match memory technology to system performance and power needs.
- Dual high‑speed networking: Two 10/100/1000 Mbps Ethernet ports enable robust wired connectivity options for networked embedded systems.
- Hardware security primitives: Built‑in cryptography and a random number generator provide hardware‑level support for secure communications and trusted functions.
- Compact BGA footprint: 298‑NFBGA (13×13) surface‑mount package supports high‑density PCB layouts for space‑constrained applications.
- Commercial temperature rating: Rated for 0 °C to 90 °C operation to meet typical commercial embedded deployment environments.
Why Choose FX053013?
The FX053013 positions a 300 MHz ARM® Cortex®‑A8 core alongside multimedia acceleration, dual Gigabit Ethernet, multiple USB ports and broad memory support in a single, surface‑mount BGA package. This combination provides a balanced platform for embedded designs that require integrated connectivity, display capability and hardware security while maintaining a compact board footprint.
It is well suited for engineers and product teams developing commercial embedded systems that need a validated set of interfaces and processing features, offering design scalability through flexible memory options and a package compatible with modern PCB assembly processes.
Request a quote or submit a purchasing inquiry to receive pricing and availability for FX053013 and discuss how this microprocessor can fit your next embedded design.

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