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Total Products: 31,199
ImageData
Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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TSC80251G2D-24IA
TSC80251G2D-24IAMicrochip TechnologyIC MCU 8/16BIT ROMLESS 40PDILMicrocontrollers40-PDILN/A-40°C ~ 85°C (TA)
Core Processor:
C251
Core Size:
8/16-Bit
Speed:
24MHz
Connectivity:
EBI/EMI, I2C, Microwire, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
32
Program Memory Type:
ROMless
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
40-PDIL
Package / Case:
40-DIP (0.600″”, 15.24mm)
371
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TSC80251G2D-24IB
TSC80251G2D-24IBMicrochip TechnologyIC MCU 8/16BIT ROMLESS 44PLCCMicrocontrollers44-PLCC (16.6x16.6)N/A-40°C ~ 85°C (TA)
Core Processor:
C251
Core Size:
8/16-Bit
Speed:
24MHz
Connectivity:
EBI/EMI, I2C, Microwire, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
32
Program Memory Type:
ROMless
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-PLCC (16.6×16.6)
Package / Case:
44-LCC (J-Lead)
836
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TSC80251G2D-24IBR
TSC80251G2D-24IBRMicrochip TechnologyIC MCU 8/16BIT ROMLESS 44PLCCMicrocontrollers44-PLCC (16.6x16.6)N/A-40°C ~ 85°C (TA)
Core Processor:
C251
Core Size:
8/16-Bit
Speed:
24MHz
Connectivity:
EBI/EMI, I2C, Microwire, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
32
Program Memory Type:
ROMless
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-PLCC (16.6×16.6)
Package / Case:
44-LCC (J-Lead)
1,966
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TSC80251G2D-L16CB
TSC80251G2D-L16CBMicrochip TechnologyIC MCU 8/16BIT ROMLESS 44PLCCMicrocontrollers44-PLCC (16.6x16.6)N/A0°C ~ 70°C (TA)
Core Processor:
C251
Core Size:
8/16-Bit
Speed:
16MHz
Connectivity:
EBI/EMI, I2C, Microwire, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
32
Program Memory Type:
ROMless
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-PLCC (16.6×16.6)
Package / Case:
44-LCC (J-Lead)
619
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TSC87251G2D-16CB
TSC87251G2D-16CBMicrochip TechnologyIC MCU 8/16BIT 32KB OTP 44PLCCMicrocontrollers44-PLCC (16.6x16.6)N/A0°C ~ 70°C (TA)
Core Processor:
C251
Core Size:
8/16-Bit
Speed:
16MHz
Connectivity:
EBI/EMI, I2C, Microwire, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
32
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
OTP
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-PLCC (16.6×16.6)
Package / Case:
44-LCC (J-Lead)
534
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TSC87251G2D-24IA
TSC87251G2D-24IAMicrochip TechnologyIC MCU 8/16BIT 32KB OTP 40PDILMicrocontrollers40-PDILN/A-40°C ~ 85°C (TA)
Core Processor:
C251
Core Size:
8/16-Bit
Speed:
24MHz
Connectivity:
EBI/EMI, I2C, Microwire, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
32
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
OTP
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
40-PDIL
Package / Case:
40-DIP (0.600″”, 15.24mm)
791
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TSC87251G2D-24IB
TSC87251G2D-24IBMicrochip TechnologyIC MCU 8/16BIT 32KB OTP 44PLCCMicrocontrollers44-PLCC (16.6x16.6)N/A-40°C ~ 85°C (TA)
Core Processor:
C251
Core Size:
8/16-Bit
Speed:
24MHz
Connectivity:
EBI/EMI, I2C, Microwire, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
32
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
OTP
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-PLCC (16.6×16.6)
Package / Case:
44-LCC (J-Lead)
768
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TSC87251G2D-24IBR
TSC87251G2D-24IBRMicrochip TechnologyIC MCU 8/16BIT 32KB OTP 44PLCCMicrocontrollers44-PLCC (16.6x16.6)N/A-40°C ~ 85°C (TA)
Core Processor:
C251
Core Size:
8/16-Bit
Speed:
24MHz
Connectivity:
EBI/EMI, I2C, Microwire, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
32
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
OTP
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-PLCC (16.6×16.6)
Package / Case:
44-LCC (J-Lead)
411
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N/A
TSC87251G2D-24ICMicrochip TechnologyIC MCU 8/16BIT 32KB OTP 44CQPJMicrocontrollers44-CQPJN/A-40°C ~ 85°C (TA)
Core Processor:
C251
Core Size:
8/16-Bit
Speed:
24MHz
Connectivity:
EBI/EMI, I2C, Microwire, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
32
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
OTP
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-CQPJ
1,267
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N/A
TSC87251G2D-24IJMicrochip TechnologyIC MCU 8/16BIT 32KB OTP 44CDILMicrocontrollers44-CDILN/A-40°C ~ 85°C (TA)
Core Processor:
C251
Core Size:
8/16-Bit
Speed:
24MHz
Connectivity:
EBI/EMI, I2C, Microwire, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
32
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
OTP
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Supplier Device Package:
44-CDIL
1,242
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TSC87251G2D-L16CB
TSC87251G2D-L16CBMicrochip TechnologyIC MCU 8/16BIT 32KB OTP 44PLCCMicrocontrollers44-PLCC (16.6x16.6)N/A0°C ~ 70°C (TA)
Core Processor:
C251
Core Size:
8/16-Bit
Speed:
16MHz
Connectivity:
EBI/EMI, I2C, Microwire, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
32
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
OTP
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-PLCC (16.6×16.6)
Package / Case:
44-LCC (J-Lead)
889
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N/A
TSPC106AVGU66CGMicrochip TechnologyIC PCI MEM CTRLR 66MHZ 303CBGAControllers303-CBGA (25x21)3.135V ~ 3.465V-55°C ~ 125°C
Voltage – Supply:
3.135V ~ 3.465V
Current – Supply:
15µA
Operating Temperature:
-55°C ~ 125°C
Package / Case:
303-CBGA
Supplier Device Package:
303-CBGA (25×21)
793
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TSPC603RVA8LC
TSPC603RVA8LCMicrochip TechnologyIC MPU 200MHZ 240CERQUADMicroprocessors240-CERQUAD (31x31)N/A-40°C ~ 110°C (TC)
Core Processor:
PowerPC 603e
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
200MHz
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 110°C (TC)
Mounting Type:
Surface Mount
Package / Case:
240-BFCQFP
Supplier Device Package:
240-CERQUAD (31×31)
Grade:
Industrial
847
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N/A
TSPC603RVGH10LCMicrochip TechnologyIC MPU 603E 233MHZ 255CBGAMicroprocessors255-HiTCE-CBGA (21x21)N/A-40°C ~ 110°C (TC)
Core Processor:
PowerPC 603e
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
233MHz
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 110°C (TC)
Mounting Type:
Surface Mount
Package / Case:
255-BCBGA Exposed Pad
Supplier Device Package:
255-HiTCE-CBGA (21×21)
Grade:
Industrial
1,542
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N/A
TSPC603RVGH12LCMicrochip TechnologyIC MPU 603E 266MHZ 255CBGAMicroprocessors255-HiTCE-CBGA (21x21)N/A-40°C ~ 110°C (TC)
Core Processor:
PowerPC 603e
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 110°C (TC)
Mounting Type:
Surface Mount
Package / Case:
255-BCBGA Exposed Pad
Supplier Device Package:
255-HiTCE-CBGA (21×21)
Grade:
Industrial
142
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N/A
TSPC603RVGH8LCMicrochip TechnologyIC MPU 603E 200MHZ 255CBGAMicroprocessors255-HiTCE-CBGA (21x21)N/A-40°C ~ 110°C (TC)
Core Processor:
PowerPC 603e
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
200MHz
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 110°C (TC)
Mounting Type:
Surface Mount
Package / Case:
255-BCBGA Exposed Pad
Supplier Device Package:
255-HiTCE-CBGA (21×21)
Grade:
Industrial
1,645
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N/A
TSPC603RVGS10LCMicrochip TechnologyIC MPU 603E 233MHZ 255CICBGAMicroprocessors255-CI-CBGA (21x21)N/A-40°C ~ 110°C (TC)
Core Processor:
PowerPC 603e
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
233MHz
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 110°C (TC)
Mounting Type:
Surface Mount
Package / Case:
255-BCBGA Exposed Pad
Supplier Device Package:
255-CI-CBGA (21×21)
Grade:
Industrial
481
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N/A
TSPC603RVGS12LCMicrochip TechnologyIC MPU 603E 266MHZ 255CICBGAMicroprocessors255-CI-CGA (21x21)N/A-40°C ~ 110°C (TC)
Core Processor:
PowerPC 603e
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 110°C (TC)
Mounting Type:
Surface Mount
Package / Case:
255-BCGA
Supplier Device Package:
255-CI-CGA (21×21)
Grade:
Industrial
923
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N/A
TSPC603RVGS6LCMicrochip TechnologyIC MPU 603E 166MHZ 255CICBGAMicroprocessors255-CI-CBGA (21x21)N/A-40°C ~ 110°C (TC)
Core Processor:
PowerPC 603e
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
166MHz
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 110°C (TC)
Mounting Type:
Surface Mount
Package / Case:
255-BCBGA Exposed Pad
Supplier Device Package:
255-CI-CBGA (21×21)
Grade:
Industrial
1,796
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N/A
TSPC603RVGS8LCMicrochip TechnologyIC MPU 603E 200MHZ 255CICBGAMicroprocessors255-CI-CBGA (21x21)N/A-40°C ~ 110°C (TC)
Core Processor:
PowerPC 603e
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
200MHz
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 110°C (TC)
Mounting Type:
Surface Mount
Package / Case:
255-BCBGA Exposed Pad
Supplier Device Package:
255-CI-CBGA (21×21)
Grade:
Industrial
215
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