TSPC603RVGH12LC

The TSPC603RVGH12LC is a PowerPC 603e microprocessor in the TSPC60x (PowerPC) series from Microchip Technology. It integrates a single 32‑bit PowerPC 603e core running at 266 MHz and is designed for embedded, industrial applications that require a compact, surface‑mount processor solution.

Key attributes include 3.3 V I/O signaling, a high‑density 255‑ball HiTCE CBGA package with exposed pad, and an industrial operating temperature range of −40 °C to 110 °C—making it suitable for temperature‑sensitive embedded systems.

Key Features

• Core and Performance Single PowerPC 603e core, 32‑bit architecture operating at 266 MHz, providing deterministic processing for embedded tasks.
• Power and I/O 3.3 V I/O voltage compatibility for standard embedded system interfacing.
• Package and Mounting 255‑HiTCE‑CBGA (21×21) supplier device package with 255‑BCBGA exposed pad case; surface‑mount mounting type for compact board integration.
• Industrial Temperature Range Rated for operation from −40 °C to 110 °C to meet demanding environmental requirements.
• Compliance RoHS compliant for environmental and regulatory conformity.
• Graphics No dedicated graphics acceleration—optimized for CPU‑centric embedded workloads.

Typical Applications

• Embedded Industrial Control — Suitable for control and automation applications that require a robust processor operating across −40 °C to 110 °C.
• OEM Embedded Systems — Compact CBGA package and surface‑mount form factor allow integration into space‑constrained OEM devices.
• Communication and Network Appliances — 32‑bit PowerPC core at 266 MHz provides deterministic processing for protocol handling and real‑time tasks.

Unique Advantages

• Proven PowerPC Core: The PowerPC 603e core provides a known 32‑bit architecture at 266 MHz for consistent embedded processing.
• Industrial‑Grade Temperature Range: Rated −40 °C to 110 °C for deployment in harsh or temperature‑variable environments.
• Compact, High‑Density Package: 255‑HiTCE‑CBGA (21×21) with exposed pad delivers high pin count in a compact surface‑mount footprint.
• Standard 3.3 V I/O: Facilitates interfacing with common embedded peripherals and legacy I/O domains.
• Environmental Compliance: RoHS compliance supports regulatory requirements for many commercial and industrial applications.

Why Choose TSPC603RVGH12LC?

TSPC603RVGH12LC delivers a balanced combination of deterministic 32‑bit PowerPC processing at 266 MHz, industrial temperature tolerance, and a compact 255‑ball CBGA package suitable for embedded system integration. Its 3.3 V I/O and surface‑mount form factor simplify board design while meeting environmental compliance requirements.

This part is positioned for designers and OEMs building embedded and industrial systems that require reliable, long‑lived processor hardware from the TSPC60x (PowerPC) series by Microchip Technology.

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