TS68EN360VA33L

The TS68EN360VA33L from Microchip Technology is a CPU32+ microprocessor IC featuring a single 32‑bit core operating at 33 MHz. It is designed for embedded applications that require integrated communications and memory control in an industrial‑grade device.

This device includes a communications co‑processor (CPM), a DRAM controller, a 10 Mbps Ethernet interface and SCC interfaces, and is supplied in a 240‑CERQUAD (31x31) surface‑mount package. It supports 5 V I/O and an operating temperature range of −40 °C to 85 °C.

Key Features

• Core & Performance  CPU32+ single 32‑bit core running at 33 MHz for deterministic embedded processing.
• Memory & Controllers  Integrated DRAM controller for direct memory interfacing on DRAM‑based platforms.
• Communications & Interfaces  Communications co‑processor (CPM), a 10 Mbps Ethernet interface and SCC additional interfaces for networked and serial communications.
• Power & I/O  5 V I/O compatibility for interfacing with legacy and 5 V logic systems.
• Package & Mounting  240‑BFCQFP supplier device package: 240‑CERQUAD (31x31) in a surface‑mount form factor suitable for compact PCB layouts.
• Temperature & Grade  Industrial grade device with an operating temperature range of −40 °C to 85 °C for deployment in demanding environments.
• Environmental Compliance  RoHS compliant to meet environmental regulatory requirements.

Typical Applications

• Embedded Industrial Systems  Industrial embedded control where extended temperature range and industrial grading are required.
• Networked Communications Modules  Ethernet and CPM support enable implementation of 10 Mbps networked devices and communication offload.
• DRAM‑Based Embedded Platforms  On‑chip DRAM controller supports designs that require external DRAM memory interfacing.
• Compact Surface‑Mount Designs  240‑CERQUAD (31x31) package supports dense PCB layouts and surface‑mount assembly processes.

Unique Advantages

• Integrated communications processing  The CPM co‑processor combined with SCC interfaces and 10 Mbps Ethernet reduces the need for additional external communication controllers.
• Built‑in DRAM controller  On‑chip DRAM control simplifies memory subsystem design and lowers BOM complexity for DRAM‑based systems.
• Industrial temperature rating  −40 °C to 85 °C operating range supports deployment in temperature‑challenging environments.
• Compact surface‑mount package  240‑CERQUAD (31x31) BFCQFP enables high‑density PCB integration for space‑constrained applications.
• 5 V I/O compatibility  Direct 5 V I/O support eases integration with existing 5 V logic and legacy subsystems.
• RoHS compliant  Meets RoHS environmental requirements for regulated markets and supply chains.

Why Choose TS68EN360VA33L?

The TS68EN360VA33L combines a CPU32+ 32‑bit core with integrated communications and memory control in an industrial‑grade package, positioning it for embedded designs that require reliable networked interfaces and DRAM support. Its 5 V I/O and surface‑mount 240‑CERQUAD (31x31) packaging make it suitable for compact, legacy‑friendly designs deployed in temperature‑sensitive environments.

As a Microchip Technology product with RoHS compliance, the TS68EN360VA33L is intended for engineers and procurement teams building embedded industrial systems that demand integration, predictable performance at 33 MHz, and long‑term environmental compliance.

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