TSPC603RVGH10LC

The TSPC603RVGH10LC is a PowerPC 603e microprocessor IC featuring a single 32-bit core running at 233 MHz. Packaged in a 255-HiTCE-CBGA (21×21) surface-mount BGA with exposed pad, it is supplied by Microchip Technology for embedded applications that require industrial-grade operating conditions.

Key attributes include 3.3 V I/O signaling, an industrial temperature grade, and RoHS compliance, making this device suitable for embedded designs where specified thermal and packaging characteristics are required.

Key Features

• Core & Performance PowerPC 603e core, single 32-bit processor operating at 233 MHz.
• Power & I/O 3.3 V I/O voltage level for interfacing with standard embedded peripherals.
• Package & Mounting 255-HiTCE-CBGA (21×21) supplier device package; 255-BCBGA package case with exposed pad; surface-mount mounting type for compact PCB implementations.
• Industrial Grade & Temperature Range Rated industrial grade with an operating temperature range of −40 °C to 110 °C for deployment in demanding environments.
• Environmental Compliance RoHS compliant to meet environmental regulatory requirements.

Typical Applications

• Industrial Control Embedded controllers and instrumentation that require industrial temperature operation and a 32-bit PowerPC core.
• Embedded Computing General embedded systems requiring a single-core PowerPC 603e processor at 233 MHz in a compact BGA package.
• Surface-Mount High-Density Designs PCB designs that benefit from a 255-HiTCE-CBGA (21×21) package with exposed pad for thermal and mechanical integration.

Unique Advantages

• Industrial Temperature Capability: Supports operation from −40 °C to 110 °C for robust performance in harsh conditions.
• Proven PowerPC Architecture: The 32-bit PowerPC 603e core at 233 MHz delivers a clear performance point for embedded workloads.
• Compact BGA Packaging: 255-HiTCE-CBGA (21×21) with exposed pad enables high-density surface-mount assembly and thermal conduction to the PCB.
• Standard 3.3 V I/O: Simplifies interface design with common embedded peripherals and I/O domains.
• RoHS Compliant: Meets environmental compliance requirements for regulated markets.

Why Choose TSPC603RVGH10LC?

The TSPC603RVGH10LC positions itself as a reliable embedded microprocessor solution combining the PowerPC 603e 32-bit core at 233 MHz with industrial-grade temperature capability and a compact 255-HiTCE-CBGA package. These attributes make it well suited to designers targeting industrial and embedded applications that require a defined performance level, standardized 3.3 V I/O, and surface-mount BGA integration.

Manufactured by Microchip Technology and supplied in a RoHS-compliant package, the TSPC603RVGH10LC delivers the specification-focused characteristics needed for projects where packaging, operating temperature, and core architecture are primary selection criteria.

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