TSPC603RVGS10LC

The TSPC603RVGS10LC is a PowerPC 603e microprocessor IC featuring a single 32-bit core running at 233 MHz. It is packaged for surface-mount applications in a 255-CI-CBGA (21x21) form factor with an exposed pad.

Targeted at embedded and industrial designs, this industrial-grade device supports a 3.3 V I/O interface and an operating temperature range of -40 °C to 110 °C. It is RoHS compliant and part of the TSPC60x (PowerPC) series from Microchip Technology.

Key Features

• Core Architecture PowerPC 603e single 32-bit core providing deterministic embedded processing at 233 MHz.
• Operating Frequency 233 MHz clock rate to match mid-range embedded processing requirements.
• Voltage I/O 3.3 V I/O for compatibility with common embedded logic levels.
• Industrial Temperature Range Rated for operation from -40 °C to 110 °C for deployment in temperature-challenging environments.
• Package and Mounting 255-CI-CBGA (21x21) / 255-BCBGA with exposed pad, surface-mount package for compact board layouts and thermal management.
• Environmental Compliance RoHS compliant to support regulatory and environmental requirements.

Typical Applications

• Embedded Systems Suitable for embedded designs requiring a 32-bit PowerPC core and 233 MHz processing capability.
• Industrial Equipment Industrial-grade temperature tolerance makes it appropriate for control and monitoring systems operating across wide temperature ranges.
• Compact Surface-Mount Designs The 255-CI-CBGA (21x21) surface-mount package fits high-density PCBs and automated assembly processes.

Unique Advantages

• Industrial temperature tolerance: Enables reliable operation from -40 °C to 110 °C for demanding environments.
• Proven PowerPC core: The PowerPC 603e single 32-bit core delivers consistent 233 MHz processing for deterministic embedded workloads.
• Standard 3.3 V I/O: Simplifies interfacing with common embedded peripherals and logic domains.
• Compact BGA footprint: 255-CI-CBGA (21x21) with exposed pad supports dense PCB layouts and thermal conduction.
• RoHS compliant: Meets environmental compliance requirements for modern product designs.
• Surface-mount readiness: Designed for automated assembly to streamline manufacturing.

Why Choose TSPC603RVGS10LC?

Part of the TSPC60x (PowerPC) series from Microchip Technology, the TSPC603RVGS10LC pairs a single 32-bit PowerPC 603e core running at 233 MHz with industrial-grade temperature performance and a compact 255-CI-CBGA (21x21) package. This combination makes the device well suited to embedded and industrial applications where predictable processing, thermal management, and board density are priorities.

Designers who require a 3.3 V I/O interface, RoHS compliance, and a proven architecture will find the TSPC603RVGS10LC appropriate for control, instrumentation, and other embedded deployments that demand reliable operation across a wide temperature range.

Request a quote or submit an inquiry to receive pricing, lead time, and availability for the TSPC603RVGS10LC.