TSPC603RVGU10LC

The TSPC603RVGU10LC is a PowerPC 603e microprocessor IC featuring a single 32-bit core running at 233 MHz. Designed for embedded applications, this industrial-grade device combines a defined operating temperature range and a compact 255-CBGA (21×21) exposed-pad package for surface-mount integration.

With 3.3 V I/O and RoHS compliance, the part addresses embedded and industrial designs that require a known-performance processor footprint with specified thermal and mounting characteristics.

Key Features

• Core Single PowerPC 603e 32-bit core providing a fixed 233 MHz operating frequency for deterministic processing.
• Power and I/O 3.3 V I/O specification for compatibility with common embedded system voltage domains.
• Package 255-CBGA (21×21) exposed-pad package in a 255-BCBGA footprint suitable for surface-mount assembly and compact board designs.
• Mounting Surface mount package type for automated PCB assembly processes.
• Operating Temperature Industrial temperature rating from −40 °C to 110 °C for use in temperature-demanding environments.
• Environmental Compliance RoHS compliant to meet common environmental and manufacturing requirements.
• Graphics No graphics acceleration; intended for general-purpose embedded processing tasks.

Typical Applications

• Embedded Systems Integration as a single-core 32-bit processor for control and processing duties in embedded designs.
• Industrial Equipment Use in industrial control and monitoring applications where the −40 °C to 110 °C range and industrial grade are required.
• Surface-Mount Modules Suitable for compact, PCB-mounted modules leveraging the 255-CBGA (21×21) exposed-pad package for space-constrained designs.

Unique Advantages

• Defined processing performance: 233 MHz PowerPC 603e core provides predictable single-core processing throughput.
• Industrial temperature capability: −40 °C to 110 °C rating supports deployment in temperature-challenging environments.
• Compact exposed-pad CBGA package: 255-CBGA (21×21) enables dense PCB integration and thermal conduction through the exposed pad.
• 3.3 V I/O compatibility: Matches common embedded I/O voltage domains for straightforward system interfacing.
• RoHS compliant: Meets environmental manufacturing requirements for lead-free production.
• Surface-mount ready: Designed for standard automated assembly and reflow processes.

Why Choose TSPC603RVGU10LC?

The TSPC603RVGU10LC positions a single PowerPC 603e 32-bit core at 233 MHz into a compact, industrial-grade CBGA package, delivering a clear specification set for embedded and industrial applications. Its combination of defined performance, 3.3 V I/O, and an extended temperature range supports designs that require predictable processor behavior and robust environmental tolerance.

This part is suited to engineers and procurement teams building embedded systems and industrial modules that need a known PowerPC-based processing element with RoHS compliance and surface-mount packaging. The specified package and temperature characteristics support long-term deployment in controlled production and demanding operational settings.

Request a quote or submit an inquiry to receive pricing and availability information for TSPC603RVGU10LC.