TSXPC860SRVZQU66D

The TSXPC860SRVZQU66D is a single‑core PowerPC microprocessor optimized for embedded and industrial applications. It delivers a 32‑bit PowerPC core running at 66 MHz with integrated system peripherals suited for networking and control functions.

Designed for industrial-grade systems, this device provides integration of communications co‑processing, DRAM controller support, 10/100 Mbps Ethernet, and common serial interfaces while operating across a wide temperature range.

Key Features

• Core — Single PowerPC 32‑bit core running at 66 MHz for deterministic embedded processing.
• Memory and Controllers — Integrated DRAM controller to support system memory interfaces.
• Communications Co‑processing — Co‑processor functionality for communications tasks (CPM) and DSP‑style communications support.
• Ethernet — Built‑in 10/100 Mbps Ethernet interface (1) for network connectivity.
• Interfaces — I2C interface available for peripheral control and low‑speed communications.
• Power and I/O — 3.3 V I/O voltage compatibility for common embedded logic levels.
• Package and Mounting — Supplied in a 357‑PBGA (25×25) package, surface mount.
• Operating Range — Industrial temperature grade with operating range from −40°C to 110°C.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Industrial Control and Automation — Use as the main processor in embedded controllers where an industrial temperature range and integrated communications are required.
• Networking Equipment — Ideal for networked embedded devices that require 10/100 Mbps Ethernet and communications co‑processing.
• Embedded Communications Modules — Suitable for modules that leverage the CPM co‑processor and DRAM controller for protocol handling and buffering.

Unique Advantages

• Integrated Communications Co‑processor: Offloads communications tasks to the CPM, reducing external component needs for protocol handling.
• On‑chip DRAM Controller: Simplifies memory subsystem design and supports system memory integration without separate controller ICs.
• Built‑in Ethernet: 10/100 Mbps Ethernet interface enables straightforward network connectivity for embedded systems.
• Industrial‑Grade Temperature Range: Rated from −40°C to 110°C for reliable operation in harsh environments.
• Standard 3.3 V I/O: Matches common embedded logic levels to simplify board design and interfacing.
• RoHS Compliant: Meets environmental regulations for lead‑free manufacturing processes.

Why Choose TSXPC860SRVZQU66D?

The TSXPC860SRVZQU66D positions itself as a compact, integrated PowerPC solution for embedded and industrial designs that require moderate processing performance, onboard communications support, and a robust operating temperature range. Its combination of a 32‑bit PowerPC core, CPM communications co‑processor, DRAM controller, and Ethernet interface reduces external components while addressing common embedded system requirements.

Backed by Microchip Technology, this device is suited for engineers and procurement teams building industrial controls, networking modules, and other embedded platforms that prioritize integration, environmental compliance, and industrial temperature performance.

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