TS68EN360VA25L

The TS68EN360VA25L from Microchip Technology is a CPU32+ microprocessor IC featuring a single 32-bit core running at 25 MHz. It integrates communications-focused functionality and memory controllers in a compact surface-mount package for embedded use.

Targeted at industrial embedded applications, the device combines a communications co-processor (CPM), DRAM controllers, an SCC interface and a 10 Mbps Ethernet port, while supporting 5 V I/O and an industrial operating range of −40°C to 85°C.

Key Features

• Core A single CPU32+ 32-bit core running at 25 MHz for deterministic embedded processing.
• Communications Co-Processor (CPM) Integrated CPM to offload communications tasks and streamline protocol handling.
• Memory and Controllers On-chip DRAM controllers for simplified external memory interfacing and data buffering.
• Ethernet Built-in 10 Mbps Ethernet interface to provide network connectivity for embedded systems.
• Serial Communications Additional SCC interface for serial peripheral connectivity and protocol support.
• Power and I/O 5 V I/O voltage compatibility for interfacing with industrial-level peripherals.
• Package and Mounting Available in a 240-CERQUAD (31×31) supplier package and 240-BFCQFP case, designed for surface-mount PCB assembly.
• Operating Temperature Industrial-grade operation across −40°C to 85°C for deployment in temperature-variable environments.

Typical Applications

• Industrial Control Leverages the industrial temperature rating and integrated communications for sensor and actuator control systems.
• Embedded Networking Uses the onboard 10 Mbps Ethernet and CPM to enable networked embedded devices and remote monitoring.
• Communications Equipment Employs the CPM and SCC interface for protocol handling and serial connectivity in communication-focused designs.
• DRAM-Based Embedded Systems Utilizes integrated DRAM controllers for applications requiring external memory for buffering or program storage.

Unique Advantages

• Integrated Communications Offload: The CPM reduces main CPU overhead by handling communications tasks, simplifying application software.
• Built-In Network Interface: On-chip 10 Mbps Ethernet provides native networking capability for connected embedded systems.
• Industrial Temperature Support: Rated for −40°C to 85°C operation to meet demanding environmental requirements.
• Legacy-Compatible I/O Voltage: 5 V I/O compatibility eases integration with established industrial peripherals.
• High-Density Surface-Mount Package: 240-CERQUAD (31×31) / 240-BFCQFP packaging supports compact, high-density PCB designs.

Why Choose TS68EN360VA25L?

TS68EN360VA25L delivers a compact, integrated microprocessor solution combining a CPU32+ core with communications co-processing, DRAM controllers and Ethernet connectivity—features aligned to embedded and industrial designs that require reliable networking and protocol handling. Its 5 V I/O and industrial temperature rating support robust operation across a wide range of environments.

Manufactured by Microchip Technology, this device is suited for engineers and procurement teams specifying a surface-mount, 32-bit microprocessor with built-in communications and memory interface capabilities for industrial embedded applications.

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