 | | KW45Z41083AFTBR | NXP Semiconductors | KW45: 32-BIT BLUETOOTH5.3 LONG-R | RF Transceiver ICs | 48-HVQFN (7x7) | 0.9V ~ 2.4V, 1.175V ~ 3.6V | -40°C ~ 105°C (TA) | RF Family/Standard: Bluetooth Modulation: FSK, GFSK, GMSK, MSK Frequency: 2.36GHz ~ 2.4835GHz Memory Size: 1MB Flash, 128kB RAM Serial Interfaces: GPIO, I2C, PWM, SPI, UART Voltage – Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V Current – Receiving: 4.1mA ~ 10.01mA Current – Transmitting: 4.6mA ~ 22.4mA Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-HVQFN (7×7) | 1,611 | |
 | | KW45Z41083AFTBT | NXP Semiconductors | K4W1 HVQFN48 | Microcontrollers | 48-HVQFN (7x7) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Connectivity: CANbus, HMI, I2C, SPI, UART/USART Peripherals: DMA, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 14x16b SAR Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Supplier Device Package: 48-HVQFN (7×7) Package / Case: 48-VFQFN Exposed Pad | 1,093 | |
 | | KXPC823VR81B2T | NXP Semiconductors | IC MPU MPC8XX 81MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM Display & Interface Controllers: LCD, Video Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) Additional Interfaces: I2C, SMC, SCC, SPI, UART | 593 | |
 | | KXPC8240LVV200E | NXP Semiconductors | IC MPU MPC82XX 200MHZ 352TBGA | Microprocessors | 352-TBGA (35x35) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DRAM, SDRAM Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 352-TBGA (35×35) Additional Interfaces: I2C, I²O, PCI, UART | 979 | |
 | | KXPC8240RVV250E | NXP Semiconductors | IC MPU MPC82XX 250MHZ 352TBGA | Microprocessors | 352-TBGA (35x35) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DRAM, SDRAM Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 352-TBGA (35×35) Additional Interfaces: I2C, I²O, PCI, UART | 365 | |
 | | LH75401N0Q100C0,55 | NXP Semiconductors | IC MCU 32BIT ROMLESS 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Microwire, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.7V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 407 | |
 | | LH75411N0Q100C0,55 | NXP Semiconductors | IC MCU 32BIT ROMLESS 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.7V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 790 | |
 | | LH75411N0Q100C0;55 | NXP Semiconductors | IC MCU 32BIT ROMLESS 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.7V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 1,225 | |
 | | LH79520N0Q000B1,55 | NXP Semiconductors | IC MCU 32BIT ROMLESS 176LQFP | Microcontrollers | 176-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, IrDA, Microwire, SPI, SSI, SSP, UART/USART Peripherals: DMA, LCD, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.62V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (20×20) | 7 | |
 | | LH79520N0Q000B1;55 | NXP Semiconductors | IC MCU 32BIT ROMLESS 176LQFP | Microcontrollers | 176-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, IrDA, Microwire, SPI, SSI, SSP, UART/USART Peripherals: DMA, LCD, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.62V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (20×20) | 1,233 | |
| N/A | N/A | LH79524N0F100A1 | NXP Semiconductors | IC MCU 32BIT ROMLESS 208LFBGA | Microcontrollers | 208-LFBGA (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM720T™ RISC Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 10x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-LFBGA (14×14) | 1,879 | |
 | | LH79524N0F100A1,55 | NXP Semiconductors | IC MCU 32BIT ROMLESS 208LFBGA | Microcontrollers | 208-LFBGA (14x14) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.7V ~ 3.6V Data Converters: A/D 10x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-LFBGA (14×14) | 1,284 | |
 | | LH79524N0F100A1;55 | NXP Semiconductors | IC MCU 32BIT ROMLESS 208LFBGA | Microcontrollers | 208-LFBGA (14x14) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.7V ~ 3.6V Data Converters: A/D 10x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-LFBGA (14×14) | 618 | |
| N/A | N/A | LH79525N0Q100A1 | NXP Semiconductors | IC MCU 32BIT ROMLESS 176LQFP | Microcontrollers | 176-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM720T™ RISC Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 10x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (20×20) | 1,808 | |
 | | LH79525N0Q100A1;55 | NXP Semiconductors | IC MCU 32BIT ROMLESS 176LQFP | Microcontrollers | 176-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.7V ~ 3.6V Data Converters: A/D 10x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (20×20) | 44 | |
| N/A | N/A | LH7A400N0G000B5 | NXP Semiconductors | IC MCU 32BIT ROMLESS 256BGA | Microcontrollers | 256-BGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, IrDA, Microwire, Memory Card, SmartCard, SPI, SSI, SSP, UART/USART, USB Peripherals: AC’97, DMA, LCD, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.71V ~ 1.89V, 2V ~ 2.2V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-BGA (17×17) | 967 | |
 | | LH7A400N0G000B5,55 | NXP Semiconductors | IC MCU 32BIT ROMLESS 256BGA | Microcontrollers | 256-BGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, IrDA, Microwire, Memory Card, SmartCard, SPI, SSI, SSP, UART/USART, USB Peripherals: AC’97, DMA, LCD, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-BGA (17×17) | 935 | |
 | | LH7A400N0G000B5;55 | NXP Semiconductors | IC MCU 32BIT ROMLESS 256BGA | Microcontrollers | 256-BGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, IrDA, Microwire, Memory Card, SmartCard, SPI, SSI, SSP, UART/USART, USB Peripherals: AC’97, DMA, LCD, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-BGA (17×17) | 1,268 | |
 | | LH7A404N0F000B3,55 | NXP Semiconductors | IC MCU 32BIT ROMLESS 324LFBGA | Microcontrollers | 324-LFBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, IrDA, Microwire, Memory Card, PS/2, SmartCard, SPI, SSI, SSP, UART/USART, USB Peripherals: AC’97, DMA, LCD, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 9x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 324-LFBGA (17×17) | 1,228 | |
 | | LH7A404N0F000B3;55 | NXP Semiconductors | IC MCU 32BIT ROMLESS 324LFBGA | Microcontrollers | 324-LFBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, IrDA, Microwire, Memory Card, PS/2, SmartCard, SPI, SSI, SSP, UART/USART, USB Peripherals: AC’97, DMA, LCD, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 9x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 324-LFBGA (17×17) | 1,461 | |