KXPC8240LVV200E

IC MPU MPC82XX 200MHZ 352TBGA
Part Description

PowerPC 603e Microprocessor IC MPC82xx 1 Core, 32-Bit 200MHz 352-TBGA (35x35)

Quantity 1,098 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesKXPC8240
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Core ProcessorPowerPC 603eDevice Package352-TBGA (35x35)ECCN3A001A3
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature0°C ~ 105°C (TA)Package / Case352-LBGARAM ControllersDRAM, SDRAM
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSpeed200MHz
Supplier Device Package352-TBGA (35×35)Voltage – I/O3.3V

Overview of KXPC8240LVV200E – IC MPU MPC82XX 200MHZ 352TBGA

The KXPC8240LVV200E is a PowerPC-based microprocessor featuring a single PowerPC 603e core running at 200 MHz in a 352‑TBGA (35×35) surface-mount package. It integrates a processor core and peripheral logic to simplify embedded system designs that require PCI connectivity, memory controllers and common peripheral interfaces.

Designed for high-performance embedded systems in networking, telecommunications and imaging markets, the device emphasizes integration and system-level functionality including memory support, DMA and interrupt management to reduce component count and simplify board design.

Key Features

  • Processor Core: PowerPC 603e single 32‑bit core clocked at 200 MHz with floating-point support and memory management capabilities.
  • On‑chip Caches: Includes 16‑Kbyte instruction and 16‑Kbyte data cache to reduce external memory accesses and improve system throughput.
  • Integrated Peripheral Logic: Peripheral block integrates a PCI bridge, memory controller, DMA controller, EPIC interrupt controller, message unit with I2O support, and an I2C controller to minimize external logic.
  • Memory Support: On‑chip controllers for DRAM and SDRAM with ECC/parity support options noted in the technical summary.
  • Interfaces: PCI bus interface and I2C for board-level communication; JTAG/COP debug support included in device specification.
  • Power and Clocking: 3.3 V I/O voltage and power management features; separate PLLs allow the processor core and peripheral logic to operate at different frequencies.
  • Package & Mounting: 352‑TBGA (35×35) surface-mount package suitable for compact embedded designs.
  • Environmental & Qualification: Consumer qualification with an operating temperature range of 0°C to 105°C and RoHS compliance.

Typical Applications

  • Network Routers & Switches: Integrated PCI and DMA plus on‑chip memory controllers support control-plane processing and packet handling tasks.
  • Telecommunications Systems: Peripheral integration and separate PLLs enable flexible clocking and system partitioning for telecom control applications.
  • Mass Storage Subsystems: DMA and peripheral logic assist in offloading data movement for storage controllers and appliances.
  • Network Appliances: Combined processing and peripheral features are suitable for security appliances, gateways and management devices.
  • Print & Imaging Systems: On‑chip control features and I/O support simplify controller designs for printers and imaging equipment.

Unique Advantages

  • Highly integrated processor and peripheral logic: Reduces external component count by combining PCI, memory controllers, DMA, interrupt and message units on a single die.
  • Flexible clock domains: Separate PLLs for core and peripheral logic allow designers to trade off performance and power while maintaining synchronous bus interfaces.
  • Memory subsystem with ECC/parity options: On‑chip support for DRAM/SDRAM and ECC/parity improves data integrity for embedded systems.
  • Compact TBGA package: 352‑TBGA (35×35) surface-mount format enables high‑density board layouts in space‑constrained designs.
  • Developer-friendly debug and control: JTAG/COP interface and standard interfaces such as I2C facilitate bring‑up and system management.
  • Standards-oriented I/O: PCI bus interface and I2C support simplify integration with common peripherals and system buses.

Why Choose KXPC8240LVV200E?

The KXPC8240LVV200E positions itself as a compact, integrated embedded processor solution that combines a PowerPC 603e core with a rich peripheral logic set. Its 200 MHz core, on‑chip caches, memory controllers and PCI-capable interface make it a pragmatic choice for designers targeting networking, storage, telecommunications and imaging equipment where integration and predictable thermal range matter.

For developers and procurement teams seeking a RoHS‑compliant, consumer‑qualified microprocessor in a 352‑TBGA package, this device delivers reduced BOM complexity, flexible clocking options and on‑chip system functions that simplify board design and system integration.

Request a quote or submit an inquiry to get pricing and availability for the KXPC8240LVV200E. Our team can provide lead‑time information and support for volume requirements.

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