KXPC8240LVV200E
| Part Description |
PowerPC 603e Microprocessor IC MPC82xx 1 Core, 32-Bit 200MHz 352-TBGA (35x35) |
|---|---|
| Quantity | 1,098 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | KXPC8240 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Core Processor | PowerPC 603e | Device Package | 352-TBGA (35x35) | ECCN | 3A001A3 | ||
|---|---|---|---|---|---|---|---|
| Graphics Acceleration | No | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | ||
| Operating Temperature | 0°C ~ 105°C (TA) | Package / Case | 352-LBGA | RAM Controllers | DRAM, SDRAM | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Speed | 200MHz | ||
| Supplier Device Package | 352-TBGA (35×35) | Voltage – I/O | 3.3V |
Overview of KXPC8240LVV200E – IC MPU MPC82XX 200MHZ 352TBGA
The KXPC8240LVV200E is a PowerPC-based microprocessor featuring a single PowerPC 603e core running at 200 MHz in a 352‑TBGA (35×35) surface-mount package. It integrates a processor core and peripheral logic to simplify embedded system designs that require PCI connectivity, memory controllers and common peripheral interfaces.
Designed for high-performance embedded systems in networking, telecommunications and imaging markets, the device emphasizes integration and system-level functionality including memory support, DMA and interrupt management to reduce component count and simplify board design.
Key Features
- Processor Core: PowerPC 603e single 32‑bit core clocked at 200 MHz with floating-point support and memory management capabilities.
- On‑chip Caches: Includes 16‑Kbyte instruction and 16‑Kbyte data cache to reduce external memory accesses and improve system throughput.
- Integrated Peripheral Logic: Peripheral block integrates a PCI bridge, memory controller, DMA controller, EPIC interrupt controller, message unit with I2O support, and an I2C controller to minimize external logic.
- Memory Support: On‑chip controllers for DRAM and SDRAM with ECC/parity support options noted in the technical summary.
- Interfaces: PCI bus interface and I2C for board-level communication; JTAG/COP debug support included in device specification.
- Power and Clocking: 3.3 V I/O voltage and power management features; separate PLLs allow the processor core and peripheral logic to operate at different frequencies.
- Package & Mounting: 352‑TBGA (35×35) surface-mount package suitable for compact embedded designs.
- Environmental & Qualification: Consumer qualification with an operating temperature range of 0°C to 105°C and RoHS compliance.
Typical Applications
- Network Routers & Switches: Integrated PCI and DMA plus on‑chip memory controllers support control-plane processing and packet handling tasks.
- Telecommunications Systems: Peripheral integration and separate PLLs enable flexible clocking and system partitioning for telecom control applications.
- Mass Storage Subsystems: DMA and peripheral logic assist in offloading data movement for storage controllers and appliances.
- Network Appliances: Combined processing and peripheral features are suitable for security appliances, gateways and management devices.
- Print & Imaging Systems: On‑chip control features and I/O support simplify controller designs for printers and imaging equipment.
Unique Advantages
- Highly integrated processor and peripheral logic: Reduces external component count by combining PCI, memory controllers, DMA, interrupt and message units on a single die.
- Flexible clock domains: Separate PLLs for core and peripheral logic allow designers to trade off performance and power while maintaining synchronous bus interfaces.
- Memory subsystem with ECC/parity options: On‑chip support for DRAM/SDRAM and ECC/parity improves data integrity for embedded systems.
- Compact TBGA package: 352‑TBGA (35×35) surface-mount format enables high‑density board layouts in space‑constrained designs.
- Developer-friendly debug and control: JTAG/COP interface and standard interfaces such as I2C facilitate bring‑up and system management.
- Standards-oriented I/O: PCI bus interface and I2C support simplify integration with common peripherals and system buses.
Why Choose KXPC8240LVV200E?
The KXPC8240LVV200E positions itself as a compact, integrated embedded processor solution that combines a PowerPC 603e core with a rich peripheral logic set. Its 200 MHz core, on‑chip caches, memory controllers and PCI-capable interface make it a pragmatic choice for designers targeting networking, storage, telecommunications and imaging equipment where integration and predictable thermal range matter.
For developers and procurement teams seeking a RoHS‑compliant, consumer‑qualified microprocessor in a 352‑TBGA package, this device delivers reduced BOM complexity, flexible clocking options and on‑chip system functions that simplify board design and system integration.
Request a quote or submit an inquiry to get pricing and availability for the KXPC8240LVV200E. Our team can provide lead‑time information and support for volume requirements.

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