KXPC823VR81B2T

IC MPU MPC8XX 81MHZ 256BGA
Part Description

PowerPC Microprocessor IC MPC8xx 1 Core, 32-Bit 81MHz 256-PBGA (23x23)

Quantity 1,476 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesKXPC823
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; RISC CPMCore ProcessorPowerPCDevice Package256-PBGA (23x23)
Display & Interface ControllersLCD, VideoECCN3A001A3Ethernet10Mbps (1)
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature0°C ~ 95°C (TA)Package / Case256-BBGARAM ControllersDRAM
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSpeed81MHz
Supplier Device Package256-PBGA (23×23)USBUSB 1.x (1)Voltage – I/O3.3V

Overview of KXPC823VR81B2T – IC MPU MPC8XX 81MHZ 256BGA

The KXPC823VR81B2T is a PowerPC-based microprocessor IC featuring a single 32-bit core running at 81 MHz in a 256-PBGA (23x23) surface-mount package. It combines an embedded PowerPC core with a dedicated Communications Processor Module (CPM) and a broad set of on-chip peripherals to address compact, low-power embedded designs.

Targeted at portable and consumer embedded markets, this device integrates display and imaging support, serial communications, USB and 10 Mbps Ethernet connectivity, and DRAM controller support to reduce external component count and simplify system design. The part is RoHS compliant and specified for 0 °C to 95 °C operation.

Key Features

  • Core Architecture PowerPC single 32-bit core at 81 MHz providing a standard embedded processor architecture for control and application processing.
  • Communications Processor Module (CPM) On-chip RISC communications processor for offloading imaging and communication tasks from the main core, with dedicated DMA acceleration and dual-access RAM.
  • Memory and MMU On-chip support for DRAM controllers and memory management features derived from the MPC8xx family, including caches and translation support referenced in the series documentation.
  • On-chip Caches Series documentation specifies instruction and data caches to improve code and data throughput for embedded tasks.
  • Display and Multimedia Integrated video and LCD display controllers suitable for user interfaces and image-handling applications.
  • Serial and Peripheral Interfaces Multiple serial channels including I2C, SPI, serial communication and management controllers for peripheral connectivity.
  • Connectivity Built-in USB 1.x channel and 10 Mbps Ethernet interface for device and network connectivity.
  • Data Bus Flexibility Series-level support for dynamic bus sizing (8-, 16-, and 32-bit) to interface with a variety of external memory and peripherals.
  • Power and IO 3.3 V I/O boundary for standard embedded system power domains.
  • Package and Mounting 256-PBGA (23x23) surface-mount package suitable for space-constrained board designs.
  • Operating Range and Qualification Consumer-qualified device rated for operation from 0 °C to 95 °C and RoHS compliant.

Typical Applications

  • Portable devices Low-power processing and integrated peripherals make the device suitable for compact, battery- or bus-powered portable electronics.
  • Image capture and processing On-chip CPM and video/LCD controllers support imaging tasks such as capture, compression/decompression and display control.
  • Personal communication products USB and Ethernet connectivity combined with multiple serial interfaces enable wired device communication and peripheral integration.
  • Embedded user interfaces LCD and video controllers with on-chip processing support responsive, integrated display solutions for consumer products.

Unique Advantages

  • Integrated communications and processing: The CPM offloads imaging and serial communication tasks from the main PowerPC core, simplifying software partitioning and reducing external processing requirements.
  • Broad on-chip peripheral set: USB 1.x, I2C, SPI, multiple serial controllers and 10 Mbps Ethernet reduce BOM and board area by minimizing external interface chips.
  • Display and imaging support: Built-in video and LCD controllers enable direct connection to displays and streamline image-handling designs.
  • Standard 3.3 V I/O: Compatible with common embedded power domains for straightforward integration into existing system architectures.
  • Compact package: 256-PBGA (23x23) surface-mount package balances I/O density with a small board footprint for space-constrained applications.
  • RoHS compliant: Meets environmental directives for lead-free assembly in consumer products.

Why Choose KXPC823VR81B2T?

The KXPC823VR81B2T positions itself as an integrated embedded MPU solution that combines a PowerPC core with a dedicated communications processor and a rich set of on-chip peripherals. Its combination of display, imaging, serial interfaces, USB and Ethernet reduces external components and streamlines system design for consumer and portable embedded products.

This part is suitable for engineers designing devices that require compact packaging, 3.3 V I/O, and a mix of control processing plus dedicated communications/imaging acceleration. With RoHS compliance and an operating range of 0 °C to 95 °C, it offers a practical option for consumer-focused embedded designs that need integrated connectivity and display support.

Request a quote or submit an inquiry to obtain pricing, availability and lead-time information for the KXPC823VR81B2T. Our team can provide further technical details and help determine fit for your project requirements.

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