 | N/A | CY8C4247LWA-M484 | Infineon Technologies | PSOC4 - GENERAL | Microcontrollers | 56-QFN-EP (8x8) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Connectivity: CANbus, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, Cap Sense, LCD, LVD, POR, PWM, SmartSense, WDT Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 5.5V Data Converters: A/D 24x12b SAR; D/A 4×7/8b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount, Wettable Flank Supplier Device Package: 56-QFN-EP (8×8) Package / Case: 56-VFQFN Exposed Pad | 1,364 | |
 | N/A | CY8C4247LWA-M484T | Infineon Technologies | PSOC4 - GENERAL | Microcontrollers | 56-QFN-EP (8x8) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Connectivity: CANbus, FIFO, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, Cap Sense, DMA, LCD, LVD, POR, PWM, SmartSense, Temp Sensor, WDT Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 5.5V Data Converters: A/D 16x12b SAR; D/A 4×7/8b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount, Wettable Flank Supplier Device Package: 56-QFN-EP (8×8) Package / Case: 56-VFQFN Exposed Pad | 249 | |
 | N/A | CY8C4247LWS-M464 | Infineon Technologies | PSOC4 - GENERAL | Microcontrollers | 56-QFN-EP (8x8) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0 Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, Cap Sense, LCD, LVD, POR, PWM, SmartSense, WDT Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 5.5V Data Converters: A/D 24x12b SAR; D/A 4×7/8b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Supplier Device Package: 56-QFN-EP (8×8) Package / Case: 56-VFQFN Exposed Pad | 508 | |
 | N/A | CY8C4247LWS-M464T | Infineon Technologies | PSOC4 - GENERAL | Microcontrollers | 56-QFN-EP (8x8) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0 Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, Cap Sense, LCD, LVD, POR, PWM, SmartSense, WDT Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 5.5V Data Converters: A/D 24x12b SAR; D/A 4×7/8b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Supplier Device Package: 56-QFN-EP (8×8) Package / Case: 56-VFQFN Exposed Pad | 1,571 | |
 | | CY8C4247LWS-M484 | Infineon Technologies | PSOC4 - GENERAL | Microcontrollers | 56-QFN-EP (8x8) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0 Connectivity: CANbus, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, Cap Sense, LCD, LVD, POR, PWM, SmartSense, WDT Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 5.5V Data Converters: A/D 24x12b SAR; D/A 4×7/8b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Supplier Device Package: 56-QFN-EP (8×8) Package / Case: 56-VFQFN Exposed Pad | 802 | |
 | N/A | CY8C4247LWS-M484T | Infineon Technologies | PSOC4 - GENERAL | Microcontrollers | 56-QFN-EP (8x8) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0 Connectivity: CANbus, FIFO, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, Cap Sense, DMA, LCD, LVD, POR, PWM, SmartSense, Temp Sensor, WDT Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 5.5V Data Converters: A/D 16x12b SAR; D/A 4×7/8b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Supplier Device Package: 56-QFN-EP (8×8) Package / Case: 56-VFQFN Exposed Pad | 423 | |
 | | CY8C4248AZI-L475 | Infineon Technologies | IC MCU 32BIT 256KB FLASH 64TQFP | Microcontrollers | 64-TQFP (10x10) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, CapSense, DMA, LCD, LVD, POR, PWM, SmartSense, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 5.5V Data Converters: A/D 16x12b; D/A 2x7b, 2x8b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-TQFP (10×10) | 641 | |
 | | CY8C4248AZI-L485 | Infineon Technologies | IC MCU 32BIT 256KB FLASH 64TQFP | Microcontrollers | 64-TQFP (10x10) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: CANbus, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, Cap Sense, DMA, LCD, LVD, POR, PWM, SmartSense, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 5.5V Data Converters: A/D 16x12b SAR; D/A 4x8b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-TQFP (10×10) | 596 | |
 | N/A | CY8C4248AZI-L485T | Infineon Technologies | IC MCU 32BIT 256KB FLASH 64TQFP | Microcontrollers | 64-TQFP (10x10) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Connectivity: CANbus, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, Capsense, DMA, LVD, POR, PWM, SmartSense, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 5.5V Data Converters: A/D 16x12b SAR; D/A 4x8b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-TQFP (10×10) | 151 | |
 | | CY8C4248BZI-L469 | Infineon Technologies | IC MCU 32BIT 256KB FLSH 124VFBGA | Microcontrollers | 124-VFBGA (9x9) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, CapSense, DMA, LVD, POR, PWM, SmartSense, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 5.5V Data Converters: A/D 16x12b; D/A 2x7b, 2x8b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 124-VFBGA (9×9) | 530 | |
 | | CY8C4248BZI-L479 | Infineon Technologies | IC MCU 32BIT 256KB FLSH 124VFBGA | Microcontrollers | 124-VFBGA (9x9) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, CapSense, DMA, LCD, LVD, POR, PWM, SmartSense, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 5.5V Data Converters: A/D 16x12b; D/A 2x7b, 2x8b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 124-VFBGA (9×9) | 114 | |
 | | CY8C4248BZI-L489 | Infineon Technologies | IC MCU 32BIT 256KB FLSH 124VFBGA | Microcontrollers | 124-VFBGA (9x9) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: CANbus, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, Cap Sense, DMA, LCD, LVD, POR, PWM, SmartSense, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 5.5V Data Converters: A/D 16x12b SAR; D/A 4x8b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 124-VFBGA (9×9) | 383 | |
 | | CY8C4248BZS-L489 | Infineon Technologies | IC MCU 32BIT 256KB FLSH 124VFBGA | Microcontrollers | 124-VFBGA (9x9) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0 Connectivity: CANbus, FIFO, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, CapSense, DMA, LCD, LVD, POR, PWM, Temp Sensor, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 5.5V Data Converters: A/D 16x12b SAR; D/A 4×7/8b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 124-VFBGA (9×9) | 149 | |
| N/A | | CY8C4248FLI-BL483T | Infineon Technologies | IC MCU 32BIT 256KB FLASH 76WLCSP | Microcontrollers | 76-WLCSP (4.04x3.87) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART Peripherals: Bluetooth, Brown-out Detect/Reset, Cap Sense, DMA LCD, LVD, POR, PWM, SmartCard, SmartSense, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 5.5V Data Converters: A/D 16x12b SAR; D/A 2xIDAC Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 76-WLCSP (4.04×3.87) Package / Case: 76-XFBGA, WLCSP | 513 | |
| N/A | | CY8C4248FLI-BL583T | Infineon Technologies | IC MCU 32BIT 256KB FLASH 76WLCSP | Microcontrollers | 76-WLCSP (4.04x3.87) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART Peripherals: Bluetooth, Brown-out Detect/Reset, Cap Sense, DMA LCD, LVD, POR, PWM, SmartCard, SmartSense, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 5.5V Data Converters: A/D 16x12b SAR; D/A 2xIDAC Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 76-WLCSP (4.04×3.87) Package / Case: 76-XFBGA, WLCSP | 381 | |
 | | CY8C4248FNI-BL483T | Infineon Technologies | IC MCU 32BIT 256KB FLASH 76WLCSP | Microcontrollers | 76-WLCSP (4.04×3.87) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART Peripherals: Bluetooth, Brown-out Detect/Reset, Cap Sense, DMA LCD, LVD, POR, PWM, SmartCard, SmartSense, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 5.5V Data Converters: A/D 16x12b SAR; D/A 2xIDAC Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 76-WLCSP (4.04×3.87) Package / Case: 76-UFBGA, WLCSP | 289 | |
| N/A | N/A | CY8C4248FNI-BL543T | Infineon Technologies | IC MCU 32BIT 256KB FLASH 76WLCSP | Microcontrollers | 76-WLCSP (4.04x3.87) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART Peripherals: Bluetooth, Brown-out Detect/Reset, DMA, LVD, POR, PWM, SmartCard, SmartSense, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 5.5V Data Converters: A/D 8x12b SAR; D/A 2x7b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 76-WLCSP (4.04×3.87) Package / Case: 76-UFBGA, WLCSP | 1,309 | |
| N/A | | CY8C4248FNI-BL553T | Infineon Technologies | IC MCU 32BIT 256KB FLASH 76WLCSP | Microcontrollers | 76-WLCSP (4.04x3.87) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART Peripherals: Bluetooth, Brown-out Detect/Reset, CapSense, DMA , LVD, POR, PWM, SmartCard, SmartSense, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 5.5V Data Converters: A/D 16x12b; D/A 1x7b, 1x8b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 76-WLCSP (4.04×3.87) Package / Case: 76-UFBGA, WLCSP | 833 | |
| N/A | N/A | CY8C4248FNI-BL563T | Infineon Technologies | IC MCU 32BIT 256KB FLASH 76WLCSP | Microcontrollers | 76-WLCSP (4.04x3.87) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART Peripherals: Bluetooth, Brown-out Detect/Reset, CapSense, DMA, LCD, LVD, POR, PWM, SmartCard, SmartSense, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 5.5V Data Converters: A/D 8x12b SAR; D/A 2x7b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 76-WLCSP (4.04×3.87) Package / Case: 76-UFBGA, WLCSP | 428 | |
| N/A | | CY8C4248FNI-BL573T | Infineon Technologies | IC MCU 32BIT 256KB FLASH 76WLCSP | Microcontrollers | 76-WLCSP (4.04x3.87) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART Peripherals: Bluetooth, Brown-out Detect/Reset, CapSense, DMA , LVD, POR, PWM, SmartCard, SmartSense, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 5.5V Data Converters: A/D 16x12b; D/A 1x7b, 1x8b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 76-WLCSP (4.04×3.87) Package / Case: 76-UFBGA, WLCSP | 1,281 | |