 | | CY8C4248FNI-BL583T | Infineon Technologies | IC MCU 32BIT 256KB FLASH 76WLCSP | Microcontrollers | 76-WLCSP (4.04×3.87) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART Peripherals: Bluetooth, Brown-out Detect/Reset, Cap Sense, DMA LCD, LVD, POR, PWM, SmartCard, SmartSense, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 5.5V Data Converters: A/D 16x12b SAR; D/A 2xIDAC Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 76-WLCSP (4.04×3.87) Package / Case: 76-UFBGA, WLCSP | 1,031 | |
| N/A | | CY8C4248FNI-BL593T | Infineon Technologies | IC MCU 32BIT 256KB FLASH 76WLCSP | Microcontrollers | 76-WLCSP (4.04x3.87) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART Peripherals: Bluetooth, Brown-out Detect/Reset, CapSense, DMA, LCD, LVD, POR, PWM, SmartCard, SmartSense, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 5.5V Data Converters: A/D 16x12b; D/A 1x7b, 1x8b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 76-WLCSP (4.04×3.87) Package / Case: 76-UFBGA, WLCSP | 1,830 | |
| N/A | N/A | CY8C4248FNQ-BL583T | Infineon Technologies | IC MCU 32BIT 256KB FLASH 76WLCSP | Microcontrollers | 76-WLCSP (4.04x3.87) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0 Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART Peripherals: Bluetooth, Brown-out Detect/Reset, CapSense, DMA, LCD, LVD, POR, PWM, SmartCard, SmartSense, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 5.5V Data Converters: A/D 8x12b SAR; D/A 2x7b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 76-WLCSP (4.04×3.87) Package / Case: 76-UFBGA, WLCSP | 1,117 | |
 | | CY8C4248LQI-BL453 | Infineon Technologies | IC MCU 32BIT 256KB FLASH 56QFN | Microcontrollers | 56-QFN (7x7) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART Peripherals: Bluetooth, Brown-out Detect/Reset, Cap Sense, DMA LVD, POR, PWM, SmartCard, SmartSense, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 5.5V Data Converters: A/D 16x12b SAR; D/A 2xIDAC Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 56-QFN (7×7) Package / Case: 56-UFQFN Exposed Pad | 719 | |
 | | CY8C4248LQI-BL473 | Infineon Technologies | IC MCU 32BIT 256KB FLASH 56QFN | Microcontrollers | 56-QFN (7x7) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART Peripherals: Bluetooth, Brown-out Detect/Reset, DMA LVD, POR, PWM, SmartCard, SmartSense, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 5.5V Data Converters: A/D 16x12b SAR; D/A 2xIDAC Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 56-QFN (7×7) Package / Case: 56-UFQFN Exposed Pad | 508 | |
 | | CY8C4248LQI-BL473T | Infineon Technologies | IC MCU 32BIT 256KB FLASH 56QFN | Microcontrollers | 56-QFN (7x7) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART Peripherals: Bluetooth, Brown-out Detect/Reset, DMA LVD, POR, PWM, SmartCard, SmartSense, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 5.5V Data Converters: A/D 16x12b SAR; D/A 2xIDAC Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 56-QFN (7×7) Package / Case: 56-UFQFN Exposed Pad | 1,181 | |
 | | CY8C4248LQI-BL483 | Infineon Technologies | IC MCU 32BIT 256KB FLASH 56QFN | Microcontrollers | 56-QFN (7x7) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART Peripherals: Bluetooth, Brown-out Detect/Reset, Cap Sense, DMA LCD, LVD, POR, PWM, SmartCard, SmartSense, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 5.5V Data Converters: A/D 16x12b SAR; D/A 2xIDAC Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 56-QFN (7×7) Package / Case: 56-UFQFN Exposed Pad | 410 | |
 | | CY8C4248LQI-BL483T | Infineon Technologies | IC MCU 32BIT 256KB FLASH 56QFN | Microcontrollers | 56-QFN (7x7) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART Peripherals: Bluetooth, Brown-out Detect/Reset, Cap Sense, DMA LCD, LVD, POR, PWM, SmartCard, SmartSense, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 5.5V Data Converters: A/D 16x12b SAR; D/A 2xIDAC Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 56-QFN (7×7) Package / Case: 56-UFQFN Exposed Pad | 1,156 | |
 | | CY8C4248LQI-BL543 | Infineon Technologies | MICROCONTROLLER ARM CORTEX | Microcontrollers | 56-QFN (7x7) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART Peripherals: Bluetooth, Brown-out Detect/Reset, DMA LCD, LVD, POR, PWM, SmartCard, SmartSense, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 5.5V Data Converters: A/D 16x12b SAR; D/A 2xIDAC Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 56-QFN (7×7) Package / Case: 56-UFQFN Exposed Pad | 288 | |
 | N/A | CY8C4248LQI-BL543T | Infineon Technologies | IC MCU 32BIT 256KB FLASH 56QFN | Microcontrollers | 56-QFN (7x7) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART Peripherals: Bluetooth, Brown-out Detect/Reset, DMA, LVD, POR, PWM, SmartCard, SmartSense, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 5.5V Data Converters: A/D 8x12b SAR; D/A 2x7b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 56-QFN (7×7) Package / Case: 56-UFQFN Exposed Pad | 670 | |
 | | CY8C4248LQI-BL553 | Infineon Technologies | IC MCU 32BIT 256KB FLASH 56QFN | Microcontrollers | 56-QFN (7x7) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART Peripherals: Bluetooth, Brown-out Detect/Reset, Cap Sense, DMA LCD, LVD, POR, PWM, SmartCard, SmartSense, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 5.5V Data Converters: A/D 16x12b SAR; D/A 2xIDAC Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 56-QFN (7×7) Package / Case: 56-UFQFN Exposed Pad | 926 | |
 | | CY8C4248LQI-BL553T | Infineon Technologies | IC MCU 32BIT 256KB FLASH 56QFN | Microcontrollers | 56-QFN (7x7) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART Peripherals: Bluetooth, Brown-out Detect/Reset, Cap Sense, DMA LCD, LVD, POR, PWM, SmartCard, SmartSense, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 5.5V Data Converters: A/D 16x12b SAR; D/A 2xIDAC Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 56-QFN (7×7) Package / Case: 56-UFQFN Exposed Pad | 1,242 | |
 | | CY8C4248LQI-BL563 | Infineon Technologies | MICROCONTROLLER ARM CORTEX | Microcontrollers | 56-QFN (7x7) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART Peripherals: Bluetooth, Brown-out Detect/Reset, DMA LCD, LVD, POR, PWM, SmartCard, SmartSense, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 5.5V Data Converters: A/D 16x12b SAR; D/A 2xIDAC Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 56-QFN (7×7) Package / Case: 56-UFQFN Exposed Pad | 658 | |
 | | CY8C4248LQI-BL563T | Infineon Technologies | IC MCU 32BIT 256KB FLASH 56QFN | Microcontrollers | 56-QFN (7x7) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART Peripherals: Bluetooth, Brown-out Detect/Reset, DMA LCD, LVD, POR, PWM, SmartCard, SmartSense, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 5.5V Data Converters: A/D 16x12b SAR; D/A 2xIDAC Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 56-QFN (7×7) Package / Case: 56-UFQFN Exposed Pad | 1,737 | |
 | | CY8C4248LQI-BL573 | Infineon Technologies | IC MCU 32BIT 256KB FLASH 56QFN | Microcontrollers | 56-QFN (7x7) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART Peripherals: Bluetooth, Brown-out Detect/Reset, DMA LVD, POR, PWM, SmartCard, SmartSense, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 5.5V Data Converters: A/D 16x12b SAR; D/A 2xIDAC Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 56-QFN (7×7) Package / Case: 56-UFQFN Exposed Pad | 350 | |
 | | CY8C4248LQI-BL573T | Infineon Technologies | IC MCU 32BIT 256KB FLASH 56QFN | Microcontrollers | 56-QFN (7x7) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART Peripherals: Bluetooth, Brown-out Detect/Reset, DMA LVD, POR, PWM, SmartCard, SmartSense, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 5.5V Data Converters: A/D 16x12b SAR; D/A 2xIDAC Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 56-QFN (7×7) Package / Case: 56-UFQFN Exposed Pad | 1,035 | |
 | | CY8C4248LQI-BL583 | Infineon Technologies | IC MCU 32BIT 256KB FLASH 56QFN | Microcontrollers | 56-QFN (7x7) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART Peripherals: Bluetooth, Brown-out Detect/Reset, Cap Sense, DMA LCD, LVD, POR, PWM, SmartCard, SmartSense, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 5.5V Data Converters: A/D 16x12b SAR; D/A 2xIDAC Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 56-QFN (7×7) Package / Case: 56-UFQFN Exposed Pad | 1,181 | |
 | | CY8C4248LQI-BL583T | Infineon Technologies | IC MCU 32BIT 256KB FLASH 56QFN | Microcontrollers | 56-QFN (7x7) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART Peripherals: Bluetooth, Brown-out Detect/Reset, Cap Sense, DMA LCD, LVD, POR, PWM, SmartCard, SmartSense, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 5.5V Data Converters: A/D 16x12b SAR; D/A 2xIDAC Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 56-QFN (7×7) Package / Case: 56-UFQFN Exposed Pad | 939 | |
 | | CY8C4248LQI-BL593 | Infineon Technologies | IC MCU 32BIT 256KB FLASH 56QFN | Microcontrollers | 56-QFN (7x7) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART Peripherals: Bluetooth, Brown-out Detect/Reset, CapSense, DMA, LCD, LVD, POR, PWM, SmartCard, SmartSense, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 5.5V Data Converters: A/D 16x12b; D/A 1x7b, 1x8b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 56-QFN (7×7) Package / Case: 56-UFQFN Exposed Pad | 1,139 | |
 | N/A | CY8C4248LQI-BL593T | Infineon Technologies | IC MCU 32BIT 256KB FLASH 56QFN | Microcontrollers | 56-QFN (7x7) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART Peripherals: Bluetooth, Brown-out Detect/Reset, CapSense, DMA, LCD, LVD, POR, PWM, SmartCard, SmartSense, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 5.5V Data Converters: A/D 8x12b SAR; D/A 2x7b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 56-QFN (7×7) Package / Case: 56-UFQFN Exposed Pad | 65 | |