 | | CY9BF416TBGL-GK7E1 | Infineon Technologies | IC MCU 32BIT 512KB FLASH 192FBGA | Microcontrollers | 192-FBGA (12x12) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M3 Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 32x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 192-FBGA (12×12) | 1,205 | |
 | | CY9BF417TBGL-GK7E1 | Infineon Technologies | IC MCU 32BIT 768KB FLASH 192FBGA | Microcontrollers | 192-FBGA (12x12) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M3 Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 768KB (768K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 32x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 192-FBGA (12×12) | 967 | |
 | | CY9BF418TBGL-GK7E1 | Infineon Technologies | IC MCU 32BIT 1MB FLASH 192FBGA | Microcontrollers | 192-FBGA (12x12) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M3 Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 32x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 192-FBGA (12×12) | 1,055 | |
 | | CY9BF428TABGL-GK7E1 | Infineon Technologies | IC MCU 32B 1.0625MB FLSH 192FBGA | Microcontrollers | 192-FBGA (12x12) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M3 Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 1.0625MB (1.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 24x12b; D/A 2x10b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 192-FBGA (12×12) | 164 | |
| N/A | N/A | CY9BF428TBGL-GK7E1 | Infineon Technologies | MULTI-MARKET MCUS | Microcontrollers | 192-FBGA (12x12) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M3 Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 1.0625MB (1.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 24x12b SAR; D/A 2x10b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 192-FBGA (12×12) | 415 | |
 | | CY9BF429SPMC-GK7E1 | Infineon Technologies | IC MCU 32B 1.5625MB FLSH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M3 Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 1.5625MB (1.5625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 24x12b; D/A 2x10b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 112 | |
 | | CY9BF429TABGL-GK7E1 | Infineon Technologies | IC MCU 32B 1.5625MB FLSH 192FBGA | Microcontrollers | 192-FBGA (12x12) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M3 Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 1.5625MB (1.5625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 24x12b; D/A 2x10b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 192-FBGA (12×12) | 1,872 | |
| N/A | N/A | CY9BF429TBGL-GK7E1 | Infineon Technologies | MULTI-MARKET MCUS | Microcontrollers | 192-FBGA (12x12) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M3 Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 1.5625MB (1.5625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 24x12b SAR; D/A 2x10b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 192-FBGA (12×12) | 1,064 | |
 | | CY9BF464KPMC-G-JNE2 | Infineon Technologies | IC MCU 32BIT 288KB FLASH 48LQFP | Microcontrollers | 48-LQFP (7x7) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, I2C, LINbus, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 288KB (288K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 8x12b; D/A 2x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 48-LQFP (7×7) | 843 | |
 | | CY9BF464KQN-G-AVE2 | Infineon Technologies | IC MCU 32BIT 288KB FLASH 48QFN | Microcontrollers | 48-QFN (7x7) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, I2C, LINbus, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 288KB (288K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 8x12b; D/A 2x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 48-QFN (7×7) Package / Case: 48-VFQFN Exposed Pad | 83 | |
 | | CY9BF464LPMC-G-JNE2 | Infineon Technologies | IC MCU 32BIT 288KB FLASH 64LQFP | Microcontrollers | 64-LQFP (12x12) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, I2C, LINbus, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 288KB (288K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 15x12b; D/A 2x10b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-LQFP (12×12) | 46 | |
 | | CY9BF464LPMC1-G-JNE2 | Infineon Technologies | IC MCU 32BIT 288KB FLASH 64LQFP | Microcontrollers | 64-LQFP (10x10) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, I2C, LINbus, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 288KB (288K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 15x12b; D/A 2x10b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-LQFP (10×10) | 777 | |
 | | CY9BF464LQN-G-AVE2 | Infineon Technologies | IC MCU 32BIT 288KB FLASH 64QFN | Microcontrollers | 64-QFN (9x9) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, I2C, LINbus, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 288KB (288K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 15x12b; D/A 2x10b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-QFN (9×9) Package / Case: 64-VFQFN Exposed Pad | 705 | |
 | | CY9BF465KPMC-G-JNE2 | Infineon Technologies | IC MCU 32BIT 416KB FLASH 48LQFP | Microcontrollers | 48-LQFP (7x7) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, I2C, LINbus, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 416KB (416K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 8x12b; D/A 2x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 48-LQFP (7×7) | 1,049 | |
 | | CY9BF465KQN-G-AVE2 | Infineon Technologies | IC MCU 32BIT 416KB FLASH 48QFN | Microcontrollers | 48-QFN (7x7) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, I2C, LINbus, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 416KB (416K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 8x12b; D/A 2x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 48-QFN (7×7) Package / Case: 48-VFQFN Exposed Pad | 844 | |
 | | CY9BF465LPMC-G-JNE2 | Infineon Technologies | IC MCU 32BIT 416KB FLASH 64LQFP | Microcontrollers | 64-LQFP (12x12) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, I2C, LINbus, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 416KB (416K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 15x12b; D/A 2x10b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-LQFP (12×12) | 661 | |
 | | CY9BF465LPMC1-G-JNE2 | Infineon Technologies | IC MCU 32BIT 416KB FLASH 64LQFP | Microcontrollers | 64-LQFP (10x10) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, I2C, LINbus, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 416KB (416K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 15x12b; D/A 2x10b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-LQFP (10×10) | 136 | |
 | | CY9BF465LQN-G-AVE2 | Infineon Technologies | IC MCU 32BIT 416KB FLASH 64QFN | Microcontrollers | 64-QFN (9x9) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, I2C, LINbus, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 416KB (416K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 15x12b; D/A 2x10b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-QFN (9×9) Package / Case: 64-VFQFN Exposed Pad | 741 | |
 | | CY9BF466KPMC-G-JNE2 | Infineon Technologies | IC MCU 32BIT 544KB FLASH 48LQFP | Microcontrollers | 48-LQFP (7x7) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, I2C, LINbus, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 544KB (544K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 8x12b; D/A 2x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 48-LQFP (7×7) | 304 | |
 | | CY9BF466KQN-G-AVE2 | Infineon Technologies | IC MCU 32BIT 544KB FLASH 48QFN | Microcontrollers | 48-QFN (7x7) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, I2C, LINbus, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 544KB (544K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 8x12b; D/A 2x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 48-QFN (7×7) Package / Case: 48-VFQFN Exposed Pad | 137 | |