 | | CY9BF468NPMC-GNE2 | Infineon Technologies | IC MCU 32B 1.03125MB FLSH 100QFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, SD, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 1.03125MB (1.03125M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 24x12b SAR; D/A 2x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 1,810 | |
 | | CY9BF468NPQC-G-JNE2 | Infineon Technologies | IC MCU 32BIT 1.03125MB 100PQFP | Microcontrollers | 100-PQFP (14x20) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, I2C, LINbus, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 1.03125MB (1.03125M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 24x12b; D/A 2x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-PQFP (14×20) | 462 | |
 | | CY9BF468RBGL-GK7E1 | Infineon Technologies | IC MCU 32BIT 1.03125MB 144FBGA | Microcontrollers | 144-FBGA (7x7) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, I2C, LINbus, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 1.03125MB (1.03125M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 24x12b; D/A 2x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-FBGA (7×7) | 597 | |
 | | CY9BF504NBPMC-G-UNE2 | Infineon Technologies | IC MCU 32BIT 256KB FLASH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M3 Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 16x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 285 | |
 | N/A | CY9BF504NPMC-G-JNE1 | Infineon Technologies | IC MCU 32BIT 256KB FLASH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M3 Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 16x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 750 | |
 | | CY9BF505NBPMC-G-JNE2 | Infineon Technologies | IC MCU 32BIT 384KB FLASH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M3 Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 384KB (384K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 16x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 1,034 | |
 | | CY9BF506NBBGL-GK6E1 | Infineon Technologies | IC MCU 32BIT 512KB FLSH 112PFBGA | Microcontrollers | 112-PFBGA (10x10) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M3 Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 16x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 112-PFBGA (10×10) | 911 | |
 | | CY9BF506NBPMC-G-JNE2 | Infineon Technologies | IC MCU 32BIT 512KB FLASH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M3 Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 16x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 100 | |
 | | CY9BF506NBPMC-G-UNE2 | Infineon Technologies | IC MCU 32BIT 512KB FLASH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M3 Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 16x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 45 | |
 | N/A | CY9BF506NPMC-G-JNE1 | Infineon Technologies | IC MCU 32BIT 512KB FLASH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M3 Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 16x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 161 | |
 | N/A | CY9BF506RBPMC-G-UNE1 | Infineon Technologies | MULTI-MARKET MCUS | Microcontrollers | 120-LQFP (16x16) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M3 Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 16x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 120-LQFP (16×16) | 1,804 | |
 | | CY9BF506RBPMC-G-UNE2 | Infineon Technologies | IC MCU 32BIT 512KB FLASH 120LQFP | Microcontrollers | 120-LQFP (16x16) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M3 Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 16x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 120-LQFP (16×16) | 1,659 | |
 | N/A | CY9BF512NBGL-GK9E1 | Infineon Technologies | IC MCU 32BIT 160KB FLASH 112BGA | Microcontrollers | 112-PFBGA (10x10) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M3 Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 160KB (160K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 16x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 112-PFBGA (10×10) | 667 | |
 | | CY9BF512NPMC-G-JNE2 | Infineon Technologies | IC MCU 32BIT 160KB FLASH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M3 Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 160KB (160K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 16x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 386 | |
 | | CY9BF512NPMC-GE1 | Infineon Technologies | MULTI-MARKET MCUS | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M3 Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 160KB (160K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 16x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 976 | |
 | | CY9BF512NPQC-G-JNE2 | Infineon Technologies | IC MCU 32BIT 160KB FLASH 100PQFP | Microcontrollers | 100-PQFP (14x20) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M3 Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 160KB (160K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 16x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-PQFP (14×20) | 340 | |
 | | CY9BF512RPMC-G-JNE2 | Infineon Technologies | IC MCU 32BIT 160KB FLASH 120LQFP | Microcontrollers | 120-LQFP (16x16) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M3 Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 160KB (160K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 16x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 120-LQFP (16×16) | 1,242 | |
 | N/A | CY9BF514NBGL-GK9E1 | Infineon Technologies | IC MCU 32BIT 288KB FLASH 112BGA | Microcontrollers | 112-PFBGA (10x10) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M3 Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 288KB (288K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 16x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 112-PFBGA (10×10) | 1,327 | |
 | | CY9BF514NPMC-G-JNE1 | Infineon Technologies | MULTI-MARKET MCUS | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M3 Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 288KB (288K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 16x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 27 | |
 | | CY9BF514NPMC-G-JNE2 | Infineon Technologies | IC MCU 32BIT 288KB FLASH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M3 Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 288KB (288K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 16x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 54 | |