Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

Featured Brands

About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
CYT2B65CADQ0AZEGST
CYT2B65CADQ0AZEGSTInfineon TechnologiesIC MCU 32BIT 576KB FLASH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
80MHz
Connectivity:
CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT
Number of I/O:
78
Program Memory Size:
576KB (576K x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 32x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
235
CYT2B65CADQ0AZSGS
CYT2B65CADQ0AZSGSInfineon TechnologiesIC MCU 32BIT 576KB FLASH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
80MHz
Connectivity:
CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT
Number of I/O:
78
Program Memory Size:
576KB (576K x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 32x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
428
CYT2B65CADQ0AZSGST
CYT2B65CADQ0AZSGSTInfineon TechnologiesIC MCU 32BIT 576KB FLASH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
80MHz
Connectivity:
CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT
Number of I/O:
78
Program Memory Size:
576KB (576K x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 32x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
186
CYT2B73BADQ0AZEGS
CYT2B73BADQ0AZEGSInfineon TechnologiesIC MCU 32BT 1.0625MB FLSH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 160MHz
Connectivity:
CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT
Number of I/O:
49
Program Memory Size:
1.0625MB (1.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
96K x 8
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 45x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
308
CYT2B73BADQ0AZEGST
CYT2B73BADQ0AZEGSTInfineon TechnologiesIC MCU 32BT 1.0625MB FLSH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 160MHz
Connectivity:
CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT
Number of I/O:
49
Program Memory Size:
1.0625MB (1.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
96K x 8
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 45x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
717
CYT2B73BADQ0AZSGS
CYT2B73BADQ0AZSGSInfineon TechnologiesIC MCU 32BT 1.0625MB FLSH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 160MHz
Connectivity:
CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT
Number of I/O:
49
Program Memory Size:
1.0625MB (1.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
96K x 8
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 45x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
1,367
CYT2B73BADQ0AZSGST
CYT2B73BADQ0AZSGSTInfineon TechnologiesIC MCU 32BT 1.0625MB FLSH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 160MHz
Connectivity:
CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT
Number of I/O:
49
Program Memory Size:
1.0625MB (1.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
96K x 8
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 45x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
87
CYT2B73BADR0AZSGST
CYT2B73BADR0AZSGSTInfineon TechnologiesIC MCU 32BT 1.0625MB FLSH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 160MHz
Connectivity:
CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT
Number of I/O:
49
Program Memory Size:
1.0625MB (1.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
96K x 8
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 45x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
319
CYT2B73CADQ0AZEGS
CYT2B73CADQ0AZEGSInfineon TechnologiesIC MCU 32BT 1.0625MB FLSH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 160MHz
Connectivity:
CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT
Number of I/O:
49
Program Memory Size:
1.0625MB (1.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
96K x 8
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 45x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
666
CYT2B73CADQ0AZEGST
CYT2B73CADQ0AZEGSTInfineon TechnologiesIC MCU 32BT 1.0625MB FLSH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 160MHz
Connectivity:
CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT
Number of I/O:
49
Program Memory Size:
1.0625MB (1.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
96K x 8
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 45x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
572
CYT2B73CADQ0AZSGS
CYT2B73CADQ0AZSGSInfineon TechnologiesIC MCU 32BT 1.0625MB FLSH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 160MHz
Connectivity:
CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT
Number of I/O:
49
Program Memory Size:
1.0625MB (1.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
96K x 8
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 45x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
1,345
CYT2B73CADQ0AZSGST
CYT2B73CADQ0AZSGSTInfineon TechnologiesIC MCU 32BT 1.0625MB FLSH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 160MHz
Connectivity:
CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT
Number of I/O:
49
Program Memory Size:
1.0625MB (1.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
96K x 8
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 45x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
1,536
CYT2B73CADR0AZSGST
CYT2B73CADR0AZSGSTInfineon TechnologiesIC MCU 32BT 1.0625MB FLSH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 160MHz
Connectivity:
CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT
Number of I/O:
49
Program Memory Size:
1.0625MB (1.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
96K x 8
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 45x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
549
CYT2B74BADQ0AZEGS
CYT2B74BADQ0AZEGSInfineon TechnologiesIC MCU 32BT 1.0625MB FLSH 80LQFPMicrocontrollers80-LQFP (12x12)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 160MHz
Connectivity:
CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT
Number of I/O:
63
Program Memory Size:
1.0625MB (1.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
96K x 8
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 52x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-LQFP (12×12)
Package / Case:
80-LQFP
1,763
CYT2B74BADQ0AZEGST
CYT2B74BADQ0AZEGSTInfineon TechnologiesIC MCU 32BT 1.0625MB FLSH 80LQFPMicrocontrollers80-LQFP (12x12)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 160MHz
Connectivity:
CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT
Number of I/O:
63
Program Memory Size:
1.0625MB (1.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
96K x 8
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 52x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-LQFP (12×12)
Package / Case:
80-LQFP
263
CYT2B74BADQ0AZSGS
CYT2B74BADQ0AZSGSInfineon TechnologiesIC MCU 32BT 1.0625MB FLSH 80LQFPMicrocontrollers80-LQFP (12x12)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 160MHz
Connectivity:
CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT
Number of I/O:
63
Program Memory Size:
1.0625MB (1.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
96K x 8
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 52x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-LQFP (12×12)
Package / Case:
80-LQFP
671
CYT2B74BADQ0AZSGST
CYT2B74BADQ0AZSGSTInfineon TechnologiesIC MCU 32BT 1.0625MB FLSH 80LQFPMicrocontrollers80-LQFP (12x12)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 160MHz
Connectivity:
CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT
Number of I/O:
63
Program Memory Size:
1.0625MB (1.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
96K x 8
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 52x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-LQFP (12×12)
Package / Case:
80-LQFP
1,840
CYT2B74BADR0AZSGST
CYT2B74BADR0AZSGSTInfineon TechnologiesIC MCU 32BT 1.0625MB FLSH 80LQFPMicrocontrollers80-LQFP (12x12)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 160MHz
Connectivity:
CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT
Number of I/O:
63
Program Memory Size:
1.0625MB (1.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
96K x 8
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 52x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-LQFP (12×12)
Package / Case:
80-LQFP
1,000
CYT2B74CADQ0AZEGS
CYT2B74CADQ0AZEGSInfineon TechnologiesIC MCU 32BT 1.0625MB FLSH 80LQFPMicrocontrollers80-LQFP (12x12)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 160MHz
Connectivity:
CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT
Number of I/O:
63
Program Memory Size:
1.0625MB (1.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
96K x 8
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 52x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-LQFP (12×12)
Package / Case:
80-LQFP
795
CYT2B74CADQ0AZEGST
CYT2B74CADQ0AZEGSTInfineon TechnologiesIC MCU 32BT 1.0625MB FLSH 80LQFPMicrocontrollers80-LQFP (12x12)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 160MHz
Connectivity:
CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT
Number of I/O:
63
Program Memory Size:
1.0625MB (1.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
96K x 8
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 52x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-LQFP (12×12)
Package / Case:
80-LQFP
408

See What We Have to Offer!

See What We Have to Offer!

keyboard_arrow_up