Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
CYT2B74CADQ0AZSGS
CYT2B74CADQ0AZSGSInfineon TechnologiesIC MCU 32BT 1.0625MB FLSH 80LQFPMicrocontrollers80-LQFP (12x12)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 160MHz
Connectivity:
CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT
Number of I/O:
63
Program Memory Size:
1.0625MB (1.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
96K x 8
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 52x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-LQFP (12×12)
Package / Case:
80-LQFP
1,345
CYT2B74CADQ0AZSGST
CYT2B74CADQ0AZSGSTInfineon TechnologiesIC MCU 32BT 1.0625MB FLSH 80LQFPMicrocontrollers80-LQFP (12x12)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 160MHz
Connectivity:
CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT
Number of I/O:
63
Program Memory Size:
1.0625MB (1.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
96K x 8
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 52x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-LQFP (12×12)
Package / Case:
80-LQFP
189
CYT2B74CADR0AZSGST
CYT2B74CADR0AZSGSTInfineon TechnologiesIC MCU 32BT 1.0625MB FLSH 80LQFPMicrocontrollers80-LQFP (12x12)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 160MHz
Connectivity:
CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT
Number of I/O:
63
Program Memory Size:
1.0625MB (1.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
96K x 8
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 52x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-LQFP (12×12)
Package / Case:
80-LQFP
1,185
CYT2B75BADQ0AZEGS
CYT2B75BADQ0AZEGSInfineon TechnologiesIC MCU 32BT 1.0625MB FLSH 100QFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 160MHz
Connectivity:
CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT
Number of I/O:
78
Program Memory Size:
1.0625MB (1.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
96K x 8
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 57x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
491
CYT2B75BADQ0AZEGST
CYT2B75BADQ0AZEGSTInfineon TechnologiesIC MCU 32BT 1.0625MB FLSH 100QFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 160MHz
Connectivity:
CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT
Number of I/O:
78
Program Memory Size:
1.0625MB (1.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
96K x 8
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 57x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
266
CYT2B75BADQ0AZSGS
CYT2B75BADQ0AZSGSInfineon TechnologiesIC MCU 32BT 1.0625MB FLSH 100QFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 160MHz
Connectivity:
CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT
Number of I/O:
78
Program Memory Size:
1.0625MB (1.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
96K x 8
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 57x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
517
CYT2B75BADQ0AZSGST
CYT2B75BADQ0AZSGSTInfineon TechnologiesIC MCU 32BT 1.0625MB FLSH 100QFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 160MHz
Connectivity:
CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT
Number of I/O:
78
Program Memory Size:
1.0625MB (1.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
96K x 8
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 57x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
637
CYT2B75BADR0AZEGSTN/ACYT2B75BADR0AZEGSTInfineon TechnologiesIC MCU 32BT 1.0625MB FLSH 100QFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 160MHz
Connectivity:
CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT
Number of I/O:
78
Program Memory Size:
1.0625MB (1.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
96K x 8
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 57x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
1,748
CYT2B75BADR0AZSGSTN/ACYT2B75BADR0AZSGSTInfineon TechnologiesIC MCU 32BT 1.0625MB FLSH 100QFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 160MHz
Connectivity:
CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT
Number of I/O:
78
Program Memory Size:
1.0625MB (1.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
96K x 8
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 57x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
938
CYT2B75CADQ0AZEGS
CYT2B75CADQ0AZEGSInfineon TechnologiesTVII-B-E-1M-100 CFLASH 1MBMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+/M4F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 160MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
74
Program Memory Size:
1.0625MB (1.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
96K x 8
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 57x12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
1,943
CYT2B75CADQ0AZEGST
CYT2B75CADQ0AZEGSTInfineon TechnologiesIC MCU 32BT 1.0625MB FLSH 100QFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 160MHz
Connectivity:
CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT
Number of I/O:
78
Program Memory Size:
1.0625MB (1.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
96K x 8
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 57x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
1,657
CYT2B75CADQ0AZSGS
CYT2B75CADQ0AZSGSInfineon TechnologiesIC MCU 32BT 1.0625MB FLSH 100QFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 160MHz
Connectivity:
CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT
Number of I/O:
78
Program Memory Size:
1.0625MB (1.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
96K x 8
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 57x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
74
CYT2B75CADQ0AZSGST
CYT2B75CADQ0AZSGSTInfineon TechnologiesIC MCU 32BT 1.0625MB FLSH 100QFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 160MHz
Connectivity:
CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT
Number of I/O:
78
Program Memory Size:
1.0625MB (1.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
96K x 8
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 57x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
748
CYT2B75CADR0AZEGSTN/ACYT2B75CADR0AZEGSTInfineon TechnologiesIC MCU 32BT 1.0625MB FLSH 100QFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 160MHz
Connectivity:
CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT
Number of I/O:
78
Program Memory Size:
1.0625MB (1.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
96K x 8
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 57x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
839
CYT2B75CADR0AZSGST
CYT2B75CADR0AZSGSTInfineon TechnologiesIC MCU 32BT 1.0625MB FLSH 100QFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 160MHz
Connectivity:
CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT
Number of I/O:
78
Program Memory Size:
1.0625MB (1.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
96K x 8
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 57x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
1,005
CYT2B77BADQ0AZEGS
CYT2B77BADQ0AZEGSInfineon TechnologiesIC MCU 32BT 1.0625MB FLSH 144QFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 160MHz
Connectivity:
CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT
Number of I/O:
122
Program Memory Size:
1.0625MB (1.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
96K x 8
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 72x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
134
CYT2B77BADQ0AZEGST
CYT2B77BADQ0AZEGSTInfineon TechnologiesIC MCU 32BT 1.0625MB FLSH 144QFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 160MHz
Connectivity:
CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT
Number of I/O:
122
Program Memory Size:
1.0625MB (1.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
96K x 8
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 72x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
109
CYT2B77BADQ0AZSGS
CYT2B77BADQ0AZSGSInfineon TechnologiesIC MCU 32BT 1.0625MB FLSH 144QFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 160MHz
Connectivity:
CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT
Number of I/O:
122
Program Memory Size:
1.0625MB (1.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
96K x 8
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 72x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
468
CYT2B77BADQ0AZSGST
CYT2B77BADQ0AZSGSTInfineon TechnologiesIC MCU 32BT 1.0625MB FLSH 144QFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 160MHz
Connectivity:
CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT
Number of I/O:
122
Program Memory Size:
1.0625MB (1.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
96K x 8
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 72x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
404
CYT2B77CADQ0AZEGS
CYT2B77CADQ0AZEGSInfineon TechnologiesIC MCU 32BT 1.0625MB FLSH 144QFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 160MHz
Connectivity:
CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT
Number of I/O:
122
Program Memory Size:
1.0625MB (1.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
96K x 8
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 72x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
693

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