Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
CYT3BB5CEBQ1AESGST
CYT3BB5CEBQ1AESGSTInfineon TechnologiesIC MCU 32BIT 4MB FLASH 100LQFPMicrocontrollers100-TEQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 250MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
72
Program Memory Size:
4.0625MB (4.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 37x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TEQFP (14×14)
Package / Case:
100-LQFP Exposed Pad
667
CYT3BB5CEBR0AESGST
CYT3BB5CEBR0AESGSTInfineon TechnologiesIC MCU 32BT 4.063MB FLSH 100QFPMicrocontrollers100-TEQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 250MHz
Connectivity:
eMMC/SD/SDIO, I2C, IrDA, LINbus, Microwire, QSPI, SmartCard, SPI, SSP, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, Temp Sensor, WDT
Number of I/O:
72
Program Memory Size:
4.063MB (4.063M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 55x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TEQFP (14×14)
Package / Case:
100-LQFP Exposed Pad
1,483
CYT3BB5CEBR1AESGST
CYT3BB5CEBR1AESGSTInfineon TechnologiesIC MCU 32BIT 4MB FLASH 100LQFPMicrocontrollers100-TEQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 250MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
72
Program Memory Size:
4.0625MB (4.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 37x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TEQFP (14×14)
Package / Case:
100-LQFP Exposed Pad
122
N/A
CYT3BB7CEBQ0AEEGSInfineon TechnologiesIC MCU 32BT 4.0625MB FLSH 144QFPMicrocontrollers144-TEQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 250MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
116
Program Memory Size:
4.0625MB (4.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 70x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-TEQFP (20×20)
Package / Case:
144-LQFP Exposed Pad
757
N/A
CYT3BB7CEBQ0AEEGSTInfineon TechnologiesIC MCU 32BT 4.0625MB FLSH 144QFPMicrocontrollers144-TEQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 250MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
116
Program Memory Size:
4.0625MB (4.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 70x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-TEQFP (20×20)
Package / Case:
144-LQFP Exposed Pad
662
N/A
CYT3BB7CEBQ0AESGSInfineon TechnologiesIC MCU 32BT 4.0625MB FLSH 144QFPMicrocontrollers144-TEQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 250MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
116
Program Memory Size:
4.0625MB (4.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 70x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-TEQFP (20×20)
Package / Case:
144-LQFP Exposed Pad
689
N/A
CYT3BB7CEBQ0AESGSTInfineon TechnologiesIC MCU 32BT 4.0625MB FLSH 144QFPMicrocontrollers144-TEQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 250MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
116
Program Memory Size:
4.0625MB (4.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 70x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-TEQFP (20×20)
Package / Case:
144-LQFP Exposed Pad
498
N/A
CYT3BB7CEBQ1AEEGSInfineon TechnologiesIC MCU 32BIT 4MB FLASH 144LQFPMicrocontrollers144-TEQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 250MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
116
Program Memory Size:
4.0625MB (4.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 52x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-TEQFP (20×20)
Package / Case:
144-LQFP Exposed Pad
715
N/A
CYT3BB7CEBQ1AEEGSTInfineon TechnologiesIC MCU 32BIT 4MB FLASH 144LQFPMicrocontrollers144-TEQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 250MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
116
Program Memory Size:
4.0625MB (4.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 52x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-TEQFP (20×20)
Package / Case:
144-LQFP Exposed Pad
1,454
N/A
CYT3BB7CEBQ1AESGSInfineon TechnologiesTRAVEO-2 BODY HIGH-ENDMicrocontrollers144-TEQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 250MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
116
Program Memory Size:
4.0625MB (4.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 70x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-TEQFP (20×20)
Package / Case:
144-LQFP Exposed Pad
18
N/A
CYT3BB7CEBQ1AESGSTInfineon TechnologiesIC MCU 32BIT 4MB FLASH 144LQFPMicrocontrollers144-TEQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 250MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
116
Program Memory Size:
4.0625MB (4.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 52x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-TEQFP (20×20)
Package / Case:
144-LQFP Exposed Pad
999
CYT3BB8CEBQ0AEEGS
CYT3BB8CEBQ0AEEGSInfineon TechnologiesIC MCU 32BT 4.0625MB FLSH 176QFPMicrocontrollers176-TEQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 250MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
148
Program Memory Size:
4.0625MB (4.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 82x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-TEQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
323
CYT3BB8CEBQ0AEEGST
CYT3BB8CEBQ0AEEGSTInfineon TechnologiesIC MCU 32BT 4.0625MB FLSH 176QFPMicrocontrollers176-TEQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 250MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
148
Program Memory Size:
4.0625MB (4.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 82x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-TEQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
255
CYT3BB8CEBQ0AESGS
CYT3BB8CEBQ0AESGSInfineon TechnologiesIC MCU 32BT 4.0625MB FLSH 176QFPMicrocontrollers176-TEQFP (24x24)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+/M7
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 250MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
148
Program Memory Size:
4.0625MB (4.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 82x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-TEQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
1,036
CYT3BB8CEBQ0AESGST
CYT3BB8CEBQ0AESGSTInfineon TechnologiesIC MCU 32BT 4.0625MB FLSH 176QFPMicrocontrollers176-TEQFP (24x24)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 250MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
148
Program Memory Size:
4.0625MB (4.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 82x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-TEQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
1,067
CYT3BB8CEBQ1AEEGS
CYT3BB8CEBQ1AEEGSInfineon TechnologiesTRAVEO-2 BODY HIGH-ENDMicrocontrollers176-TEQFP (24x24)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 250MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
148
Program Memory Size:
4.0625MB (4.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 82x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-TEQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
802
CYT3BB8CEBQ1AEEGST
CYT3BB8CEBQ1AEEGSTInfineon TechnologiesIC MCU 32BIT 4MB FLASH 176LQFPMicrocontrollers176-TEQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 250MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
148
Program Memory Size:
4.0625MB (4.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 64x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-TEQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
17
CYT3BB8CEBQ1AESGS
CYT3BB8CEBQ1AESGSInfineon TechnologiesIC MCU 32BIT 4MB FLASH 176LQFPMicrocontrollers176-TEQFP (24x24)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 250MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
148
Program Memory Size:
4.0625MB (4.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 64x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-TEQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
198
CYT3BB8CEBQ1AESGST
CYT3BB8CEBQ1AESGSTInfineon TechnologiesIC MCU 32BIT 4MB FLASH 176LQFPMicrocontrollers176-TEQFP (24x24)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 250MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
148
Program Memory Size:
4.0625MB (4.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 64x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-TEQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
1,603
CYT3BB8CEBR0AESGST
CYT3BB8CEBR0AESGSTInfineon TechnologiesIC MCU 32BT 4.063MB FLSH 176QFPMicrocontrollers176-TEQFP (24x24)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 250MHz
Connectivity:
eMMC/SD/SDIO, I2C, IrDA, LINbus, Microwire, QSPI, SmartCard, SPI, SSP, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, Temp Sensor, WDT
Number of I/O:
148
Program Memory Size:
4.063MB (4.063M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 82x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-TEQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
872

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