Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
CYT3BB8CEBR1AESGST
CYT3BB8CEBR1AESGSTInfineon TechnologiesIC MCU 32BIT 4MB FLASH 176LQFPMicrocontrollers176-TEQFP (24x24)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 250MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
148
Program Memory Size:
4.0625MB (4.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 64x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-TEQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
1,387
CYT3BBBCEBQ0BZEGS
CYT3BBBCEBQ0BZEGSInfineon TechnologiesIC MCU 32BT 4.0625MB FLSH 272BGAMicrocontrollers272-BGA (16x16)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+/M7
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 250MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
220
Program Memory Size:
4.0625MB (4.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 90x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
272-BGA (16×16)
Package / Case:
272-LFBGA
1,005
CYT3BBBCEBQ0BZEGST
CYT3BBBCEBQ0BZEGSTInfineon TechnologiesIC MCU 32BT 4.0625MB FLSH 272BGAMicrocontrollers272-BGA (16x16)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 250MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
220
Program Memory Size:
4.0625MB (4.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 90x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
272-BGA (16×16)
Package / Case:
272-LFBGA
119
CYT3BBBCEBQ0BZSGS
CYT3BBBCEBQ0BZSGSInfineon TechnologiesIC MCU 32BT 4.0625MB FLSH 272BGAMicrocontrollers272-BGA (16x16)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 250MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
220
Program Memory Size:
4.0625MB (4.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 90x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
272-BGA (16×16)
Package / Case:
272-LFBGA
199
CYT3BBBCEBQ0BZSGST
CYT3BBBCEBQ0BZSGSTInfineon TechnologiesIC MCU 32BT 4.0625MB FLSH 272BGAMicrocontrollers272-BGA (16x16)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 250MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
220
Program Memory Size:
4.0625MB (4.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 90x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
272-BGA (16×16)
Package / Case:
272-LFBGA
879
N/AN/ACYT3DLABABQ1AESGSTInfineon TechnologiesIC MCU 32BT 4.063MB FLSH 216TQFPMicrocontrollers216-TQFPN/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7F
Core Size:
32-Bit Dual-Core
Speed:
240MHz
Connectivity:
DMA, I2S, LVD, Temp Sensor, WDT
Peripherals:
DMA, I2S, LVD, Temp Sensor, WDT
Number of I/O:
108
Program Memory Size:
4.063MB (4.063M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
216-TQFP
Package / Case:
216-QFP
1,026
N/AN/ACYT3DLABGBQ1AESGSInfineon TechnologiesIC MCU 32BT 4.063MB FLSH 216TQFPMicrocontrollers216-TQFPN/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7F
Core Size:
32-Bit Dual-Core
Speed:
240MHz
Connectivity:
DMA, I2S, LVD, Temp Sensor, WDT
Peripherals:
DMA, I2S, LVD, Temp Sensor, WDT
Number of I/O:
108
Program Memory Size:
4.063MB (4.063M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
216-TQFP
Package / Case:
216-QFP
1,862
N/AN/ACYT3DLABGBQ1AESGSTInfineon TechnologiesIC MCU 32BT 4.063MB FLSH 216TQFPMicrocontrollers216-TQFPN/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7F
Core Size:
32-Bit Dual-Core
Speed:
240MHz
Connectivity:
DMA, I2S, LVD, Temp Sensor, WDT
Peripherals:
DMA, I2S, LVD, Temp Sensor, WDT
Number of I/O:
108
Program Memory Size:
4.063MB (4.063M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
216-TQFP
Package / Case:
216-QFP
377
CYT3DLABHBQ1AESGS
CYT3DLABHBQ1AESGSInfineon TechnologiesIC MCU 32BT 4.063MB FLSH 216TQFPMicrocontrollers216-TQFPN/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7F
Core Size:
32-Bit Dual-Core
Speed:
240MHz
Connectivity:
DMA, I2S, LVD, Temp Sensor, WDT
Peripherals:
DMA, I2S, LVD, Temp Sensor, WDT
Number of I/O:
108
Program Memory Size:
4.063MB (4.063M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
216-TQFP
Package / Case:
216-QFP
517
N/AN/ACYT3DLBBEBQ1BZSGSInfineon TechnologiesIC MCU 32BIT 4.063MB FLSH 272BGAMicrocontrollers272-BGAN/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7F
Core Size:
32-Bit Dual-Core
Speed:
240MHz
Connectivity:
DMA, I2S, LVD, Temp Sensor, WDT
Peripherals:
DMA, I2S, LVD, Temp Sensor, WDT
Number of I/O:
135
Program Memory Size:
4.063MB (4.063M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
272-BGA
Package / Case:
272-BGA
341
N/AN/ACYT3DLBBGBQ1BZSGSInfineon TechnologiesIC MCU 32BIT 4.063MB FLSH 272BGAMicrocontrollers272-BGAN/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7F
Core Size:
32-Bit Dual-Core
Speed:
240MHz
Connectivity:
DMA, I2S, LVD, Temp Sensor, WDT
Peripherals:
DMA, I2S, LVD, Temp Sensor, WDT
Number of I/O:
135
Program Memory Size:
4.063MB (4.063M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
272-BGA
Package / Case:
272-BGA
1,751
CYT3DLBBHBQ1BZSGS
CYT3DLBBHBQ1BZSGSInfineon TechnologiesIC MCU 32BIT 4.063MB FLSH 272BGAMicrocontrollers272-BGAN/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7F
Core Size:
32-Bit Dual-Core
Speed:
240MHz
Connectivity:
DMA, I2S, LVD, Temp Sensor, WDT
Peripherals:
DMA, I2S, LVD, Temp Sensor, WDT
Number of I/O:
135
Program Memory Size:
4.063MB (4.063M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
272-BGA
Package / Case:
272-BGA
1,470
N/A
CYT4BB5CEBQ0AEEGSInfineon TechnologiesIC MCU 32BT 4.0625MB FLSH 100QFPMicrocontrollers100-TEQFP (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7
Core Size:
32-Bit Quad-Core
Speed:
100MHz, 250MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
72
Program Memory Size:
4.0625MB (4.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 55x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TEQFP (14×14)
Package / Case:
100-LQFP Exposed Pad
382
CYT4BB5CEBQ0AEEGST
CYT4BB5CEBQ0AEEGSTInfineon TechnologiesIC MCU 32BT 4.0625MB FLSH 100QFPMicrocontrollers100-TEQFP (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7
Core Size:
32-Bit Quad-Core
Speed:
100MHz, 250MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
72
Program Memory Size:
4.0625MB (4.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 55x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TEQFP (14×14)
Package / Case:
100-LQFP Exposed Pad
43
CYT4BB5CEBQ0AESGS
CYT4BB5CEBQ0AESGSInfineon TechnologiesIC MCU 32BT 4.0625MB FLSH 100QFPMicrocontrollers100-TEQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7
Core Size:
32-Bit Quad-Core
Speed:
100MHz, 250MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
72
Program Memory Size:
4.0625MB (4.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 55x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TEQFP (14×14)
Package / Case:
100-LQFP Exposed Pad
402
N/A
CYT4BB5CEBQ0AESGSTInfineon TechnologiesIC MCU 32BT 4.0625MB FLSH 100QFPMicrocontrollers100-TEQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7
Core Size:
32-Bit Quad-Core
Speed:
100MHz, 250MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
72
Program Memory Size:
4.0625MB (4.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 55x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TEQFP (14×14)
Package / Case:
100-LQFP Exposed Pad
1,801
CYT4BB5CEBQ1AEEGS
CYT4BB5CEBQ1AEEGSInfineon TechnologiesTRAVEO-2 BODY HIGH-ENDMicrocontrollers100-TEQFP (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7
Core Size:
32-Bit Tri-Core
Speed:
100MHz, 250MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
72
Program Memory Size:
4.0625MB (4.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 55x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TEQFP (14×14)
Package / Case:
100-LQFP Exposed Pad
274
CYT4BB5CEBQ1AEEGST
CYT4BB5CEBQ1AEEGSTInfineon TechnologiesIC MCU 32BIT 4MB FLASH 100LQFPMicrocontrollers100-TEQFP (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7F
Core Size:
32-Bit Tri-Core
Speed:
100MHz, 250MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
72
Program Memory Size:
4.0625MB (4.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 37x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TEQFP (14×14)
Package / Case:
100-LQFP Exposed Pad
324
CYT4BB5CEBQ1AESGS
CYT4BB5CEBQ1AESGSInfineon TechnologiesIC MCU 32BIT 4MB FLASH 100LQFPMicrocontrollers100-TEQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7F
Core Size:
32-Bit Tri-Core
Speed:
100MHz, 250MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
72
Program Memory Size:
4.0625MB (4.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 37x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TEQFP (14×14)
Package / Case:
100-LQFP Exposed Pad
738
CYT4BB5CEBQ1AESGST
CYT4BB5CEBQ1AESGSTInfineon TechnologiesIC MCU 32BIT 4MB FLASH 100LQFPMicrocontrollers100-TEQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7F
Core Size:
32-Bit Tri-Core
Speed:
100MHz, 250MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
72
Program Memory Size:
4.0625MB (4.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 37x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TEQFP (14×14)
Package / Case:
100-LQFP Exposed Pad
1,479

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