 | | CYT3BB8CEBR1AESGST | Infineon Technologies | IC MCU 32BIT 4MB FLASH 176LQFP | Microcontrollers | 176-TEQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7F Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 4.0625MB (4.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 64x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-TEQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 1,387 | |
 | | CYT3BBBCEBQ0BZEGS | Infineon Technologies | IC MCU 32BT 4.0625MB FLSH 272BGA | Microcontrollers | 272-BGA (16x16) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+/M7 Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 4.0625MB (4.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 90x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 272-BGA (16×16) | 1,005 | |
 | | CYT3BBBCEBQ0BZEGST | Infineon Technologies | IC MCU 32BT 4.0625MB FLSH 272BGA | Microcontrollers | 272-BGA (16x16) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7 Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 4.0625MB (4.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 90x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 272-BGA (16×16) | 119 | |
 | | CYT3BBBCEBQ0BZSGS | Infineon Technologies | IC MCU 32BT 4.0625MB FLSH 272BGA | Microcontrollers | 272-BGA (16x16) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7 Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 4.0625MB (4.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 90x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 272-BGA (16×16) | 199 | |
 | | CYT3BBBCEBQ0BZSGST | Infineon Technologies | IC MCU 32BT 4.0625MB FLSH 272BGA | Microcontrollers | 272-BGA (16x16) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7 Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 4.0625MB (4.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 90x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 272-BGA (16×16) | 879 | |
| N/A | N/A | CYT3DLABABQ1AESGST | Infineon Technologies | IC MCU 32BT 4.063MB FLSH 216TQFP | Microcontrollers | 216-TQFP | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7F Core Size: 32-Bit Dual-Core Connectivity: DMA, I2S, LVD, Temp Sensor, WDT Peripherals: DMA, I2S, LVD, Temp Sensor, WDT Program Memory Size: 4.063MB (4.063M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 216-TQFP | 1,026 | |
| N/A | N/A | CYT3DLABGBQ1AESGS | Infineon Technologies | IC MCU 32BT 4.063MB FLSH 216TQFP | Microcontrollers | 216-TQFP | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7F Core Size: 32-Bit Dual-Core Connectivity: DMA, I2S, LVD, Temp Sensor, WDT Peripherals: DMA, I2S, LVD, Temp Sensor, WDT Program Memory Size: 4.063MB (4.063M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 216-TQFP | 1,862 | |
| N/A | N/A | CYT3DLABGBQ1AESGST | Infineon Technologies | IC MCU 32BT 4.063MB FLSH 216TQFP | Microcontrollers | 216-TQFP | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7F Core Size: 32-Bit Dual-Core Connectivity: DMA, I2S, LVD, Temp Sensor, WDT Peripherals: DMA, I2S, LVD, Temp Sensor, WDT Program Memory Size: 4.063MB (4.063M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 216-TQFP | 377 | |
 | | CYT3DLABHBQ1AESGS | Infineon Technologies | IC MCU 32BT 4.063MB FLSH 216TQFP | Microcontrollers | 216-TQFP | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7F Core Size: 32-Bit Dual-Core Connectivity: DMA, I2S, LVD, Temp Sensor, WDT Peripherals: DMA, I2S, LVD, Temp Sensor, WDT Program Memory Size: 4.063MB (4.063M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 216-TQFP | 517 | |
| N/A | N/A | CYT3DLBBEBQ1BZSGS | Infineon Technologies | IC MCU 32BIT 4.063MB FLSH 272BGA | Microcontrollers | 272-BGA | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7F Core Size: 32-Bit Dual-Core Connectivity: DMA, I2S, LVD, Temp Sensor, WDT Peripherals: DMA, I2S, LVD, Temp Sensor, WDT Program Memory Size: 4.063MB (4.063M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 272-BGA | 341 | |
| N/A | N/A | CYT3DLBBGBQ1BZSGS | Infineon Technologies | IC MCU 32BIT 4.063MB FLSH 272BGA | Microcontrollers | 272-BGA | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7F Core Size: 32-Bit Dual-Core Connectivity: DMA, I2S, LVD, Temp Sensor, WDT Peripherals: DMA, I2S, LVD, Temp Sensor, WDT Program Memory Size: 4.063MB (4.063M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 272-BGA | 1,751 | |
 | | CYT3DLBBHBQ1BZSGS | Infineon Technologies | IC MCU 32BIT 4.063MB FLSH 272BGA | Microcontrollers | 272-BGA | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7F Core Size: 32-Bit Dual-Core Connectivity: DMA, I2S, LVD, Temp Sensor, WDT Peripherals: DMA, I2S, LVD, Temp Sensor, WDT Program Memory Size: 4.063MB (4.063M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 272-BGA | 1,470 | |
| N/A | | CYT4BB5CEBQ0AEEGS | Infineon Technologies | IC MCU 32BT 4.0625MB FLSH 100QFP | Microcontrollers | 100-TEQFP (14x14) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7 Core Size: 32-Bit Quad-Core Connectivity: CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 4.0625MB (4.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 55x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-TEQFP (14×14) Package / Case: 100-LQFP Exposed Pad | 382 | |
 | | CYT4BB5CEBQ0AEEGST | Infineon Technologies | IC MCU 32BT 4.0625MB FLSH 100QFP | Microcontrollers | 100-TEQFP (14x14) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7 Core Size: 32-Bit Quad-Core Connectivity: CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 4.0625MB (4.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 55x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-TEQFP (14×14) Package / Case: 100-LQFP Exposed Pad | 43 | |
 | | CYT4BB5CEBQ0AESGS | Infineon Technologies | IC MCU 32BT 4.0625MB FLSH 100QFP | Microcontrollers | 100-TEQFP (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7 Core Size: 32-Bit Quad-Core Connectivity: CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 4.0625MB (4.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 55x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-TEQFP (14×14) Package / Case: 100-LQFP Exposed Pad | 402 | |
| N/A | | CYT4BB5CEBQ0AESGST | Infineon Technologies | IC MCU 32BT 4.0625MB FLSH 100QFP | Microcontrollers | 100-TEQFP (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7 Core Size: 32-Bit Quad-Core Connectivity: CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 4.0625MB (4.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 55x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-TEQFP (14×14) Package / Case: 100-LQFP Exposed Pad | 1,801 | |
 | | CYT4BB5CEBQ1AEEGS | Infineon Technologies | TRAVEO-2 BODY HIGH-END | Microcontrollers | 100-TEQFP (14x14) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7 Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 4.0625MB (4.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 55x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-TEQFP (14×14) Package / Case: 100-LQFP Exposed Pad | 274 | |
 | | CYT4BB5CEBQ1AEEGST | Infineon Technologies | IC MCU 32BIT 4MB FLASH 100LQFP | Microcontrollers | 100-TEQFP (14x14) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7F Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 4.0625MB (4.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 37x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-TEQFP (14×14) Package / Case: 100-LQFP Exposed Pad | 324 | |
 | | CYT4BB5CEBQ1AESGS | Infineon Technologies | IC MCU 32BIT 4MB FLASH 100LQFP | Microcontrollers | 100-TEQFP (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7F Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 4.0625MB (4.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 37x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-TEQFP (14×14) Package / Case: 100-LQFP Exposed Pad | 738 | |
 | | CYT4BB5CEBQ1AESGST | Infineon Technologies | IC MCU 32BIT 4MB FLASH 100LQFP | Microcontrollers | 100-TEQFP (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7F Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 4.0625MB (4.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 37x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-TEQFP (14×14) Package / Case: 100-LQFP Exposed Pad | 1,479 | |