Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
DF2167VT33V
DF2167VT33VRenesasIC MCU 16BIT 384KB FLASH 144TQFPMicrocontrollers144-TQFP (16x16)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
33MHz
Connectivity:
I2C, IrDA, LPC, SCI, SmartCard
Peripherals:
POR, PWM, WDT
Number of I/O:
106
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
RAM Size:
40K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-TQFP (16×16)
Package / Case:
144-TQFP
797
DF2168VT33V
DF2168VT33VRenesasIC MCU 16BIT 256KB FLASH 144TQFPMicrocontrollers144-TQFP (16x16)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
33MHz
Connectivity:
I2C, IrDA, LPC, SCI, SmartCard
Peripherals:
POR, PWM, WDT
Number of I/O:
106
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
40K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-TQFP (16×16)
Package / Case:
144-TQFP
7
DF2210CUFP24V
DF2210CUFP24VRenesasIC MCU 16BIT 32KB FLASH 64LQFPMicrocontrollers64-LFQFP (10x10)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
24MHz
Connectivity:
SCI, SmartCard, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
37
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 6x10b
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
587
DF2210CUNP24V
DF2210CUNP24VRenesasIC MCU 16BIT 32KB FLASH 64VQFNMicrocontrollers64-VQFN (8.2x8.2)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
24MHz
Connectivity:
SCI, SmartCard, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
37
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 6x10b
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-VQFN (8.2×8.2)
Package / Case:
64-VFQFN
150
DF2211CUFP24V
DF2211CUFP24VRenesasIC MCU 16BIT 64KB FLASH 64LQFPMicrocontrollers64-LFQFP (10x10)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
24MHz
Connectivity:
SCI, SmartCard, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
37
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 6x10b
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
1,210
DF2211CUNP24V
DF2211CUNP24VRenesasIC MCU 16BIT 64KB FLASH 64VQFNMicrocontrollers64-VQFN (8.2x8.2)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
24MHz
Connectivity:
SCI, SmartCard, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
37
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 6x10b
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-VQFN (8.2×8.2)
Package / Case:
64-VFQFN
307
DF2211FP24V
DF2211FP24VRenesasIC MCU 16BIT 64KB FLASH 64LQFPMicrocontrollers64-LFQFP (10x10)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
24MHz
Connectivity:
SCI, SmartCard, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
37
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 6x10b
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
313
DF2211UFP24V
DF2211UFP24VRenesasIC MCU 16BIT 64KB FLASH 64LQFPMicrocontrollers64-LFQFP (10x10)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
24MHz
Connectivity:
SCI, SmartCard, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
37
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 6x10b
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
130
DF2212CUFP24V
DF2212CUFP24VRenesasIC MCU 16BIT 128KB FLASH 64LQFPMicrocontrollers64-LFQFP (10x10)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
24MHz
Connectivity:
SCI, SmartCard, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
37
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
12K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 6x10b
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
185
DF2212CUNP24V
DF2212CUNP24VRenesasIC MCU 16BIT 128KB FLASH 64VQFNMicrocontrollers64-VQFN (8.2x8.2)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
24MHz
Connectivity:
SCI, SmartCard, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
37
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
12K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 6x10b
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-VQFN (8.2×8.2)
Package / Case:
64-VFQFN
328
DF2212FP24V
DF2212FP24VRenesasIC MCU 16BIT 128KB FLASH 64LQFPMicrocontrollers64-LFQFP (10x10)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
24MHz
Connectivity:
SCI, SmartCard, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
37
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
12K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 6x10b
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
1,595
DF2212UFP24V
DF2212UFP24VRenesasIC MCU 16BIT 128KB FLASH 64LQFPMicrocontrollers64-LFQFP (10x10)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
24MHz
Connectivity:
SCI, SmartCard, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
37
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
12K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 6x10b
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
1,739
N/A
DF2214TE16VRenesasDF2214TE16V - MCU 16BIT H8S/2214MicrocontrollersN/AN/AN/A

N/A

1,223
DF2215BR16V
DF2215BR16VRenesasIC MCU 16BIT 256KB FLASH 112BGAMicrocontrollers112-LFBGA (10x10)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
SCI, SmartCard, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
68
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 6x10b; D/A 2x8b
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-LFBGA (10×10)
Package / Case:
112-LFBGA
1,600
DF2215CUBR24V
DF2215CUBR24VRenesasIC MCU 16BIT 256KB FLSH 112LFBGAMicrocontrollers112-LFBGA (10x10)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
24MHz
Connectivity:
SCI, SmartCard, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
68
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 6x10b; D/A 2x8b
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-LFBGA (10×10)
Package / Case:
112-LFBGA
543
DF2215CUTE24V
DF2215CUTE24VRenesasIC MCU 16BIT 256KB FLASH 120TQFPMicrocontrollers120-TQFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
24MHz
Connectivity:
SCI, SmartCard, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
68
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 6x10b; D/A 2x8b
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
120-TQFP (14×14)
Package / Case:
120-TQFP
916
DF2215RBR24V
DF2215RBR24VRenesasIC MCU 16BIT 256KB FLSH 112LFBGAMicrocontrollers112-LFBGA (10x10)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
24MHz
Connectivity:
SCI, SmartCard, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
68
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
20K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 6x10b; D/A 2x8b
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-LFBGA (10×10)
Package / Case:
112-LFBGA
719
DF2215RTE24V
DF2215RTE24VRenesasIC MCU 16BIT 256KB FLASH 120TQFPMicrocontrollers120-TQFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
24MHz
Connectivity:
SCI, SmartCard, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
68
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
20K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 6x10b; D/A 2x8b
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
120-TQFP (14×14)
Package / Case:
120-TQFP
645
DF2215RUBR24V
DF2215RUBR24VRenesasMICROCONTROLLER, 16-BIT, FLASH,Microcontrollers112-LFBGA (10x10)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
24MHz
Connectivity:
SCI, SmartCard, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
68
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
20K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 6x10b; D/A 2x8b
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-LFBGA (10×10)
Package / Case:
112-LFBGA
910
DF2215RUTE24V
DF2215RUTE24VRenesasIC MCU 16BIT 256KB FLASH 120TQFPMicrocontrollers120-TQFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
24MHz
Connectivity:
SCI, SmartCard, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
68
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
20K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 6x10b; D/A 2x8b
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
120-TQFP (14×14)
Package / Case:
120-TQFP
362

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