 | | CYT4BBBCEBQ0BZEGS | Infineon Technologies | IC MCU 32BT 4.0625MB FLSH 272BGA | Microcontrollers | 272-BGA (16x16) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7 Core Size: 32-Bit Quad-Core Connectivity: CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 4.0625MB (4.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 90x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 272-BGA (16×16) | 986 | |
 | | CYT4BBBCEBQ0BZEGST | Infineon Technologies | IC MCU 32BT 4.0625MB FLSH 272BGA | Microcontrollers | 272-BGA (16x16) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7 Core Size: 32-Bit Quad-Core Connectivity: CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 4.0625MB (4.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 90x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 272-BGA (16×16) | 56 | |
 | | CYT4BBBCEBQ0BZSGS | Infineon Technologies | IC MCU 32BT 4.0625MB FLSH 272BGA | Microcontrollers | 272-BGA (16x16) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7 Core Size: 32-Bit Quad-Core Connectivity: CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 4.0625MB (4.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 90x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 272-BGA (16×16) | 1,199 | |
 | | CYT4BBBCEBQ0BZSGST | Infineon Technologies | IC MCU 32BT 4.0625MB FLSH 272BGA | Microcontrollers | 272-BGA (16x16) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7 Core Size: 32-Bit Quad-Core Connectivity: CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 4.0625MB (4.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 90x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 272-BGA (16×16) | 1,362 | |
 | N/A | CYT4BBBCEBR0BZEGST | Infineon Technologies | IC MCU 32BT 4.0625MB FLSH 272BGA | Microcontrollers | 272-BGA (16x16) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7 Core Size: 32-Bit Quad-Core Connectivity: CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 4.0625MB (4.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 90x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 272-BGA (16×16) | 305 | |
 | | CYT4BF8CDDQ0AEEGS | Infineon Technologies | IC MCU 32BT 8.1875MB FLSH 176QFP | Microcontrollers | 176-TEQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F Core Size: 32-Bit Quad-Core Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 8.1875MB (8.1875M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 99x12b SAR Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-TEQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 1,171 | |
 | | CYT4BF8CDDQ0AEEGST | Infineon Technologies | IC MCU 32BT 8.1875MB FLSH 176QFP | Microcontrollers | 176-TEQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F Core Size: 32-Bit Quad-Core Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 8.1875MB (8.1875M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 99x12b SAR Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-TEQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 272 | |
 | | CYT4BF8CDDQ0AESGS | Infineon Technologies | IC MCU 32BT 8.1875MB FLSH 176QFP | Microcontrollers | 176-TEQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F Core Size: 32-Bit Quad-Core Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 8.1875MB (8.1875M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 99x12b SAR Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-TEQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 261 | |
 | | CYT4BF8CDDQ0AESGST | Infineon Technologies | IC MCU 32BT 8.1875MB FLSH 176QFP | Microcontrollers | 176-TEQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F Core Size: 32-Bit Quad-Core Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 8.1875MB (8.1875M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 99x12b SAR Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-TEQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 54 | |
 | N/A | CYT4BF8CDDR0AEEGST | Infineon Technologies | IC MCU 32BT 8.188MB FLSH 176QFP | Microcontrollers | 176-TEQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7 Core Size: 32-Bit Quad-Core Connectivity: eMMC/SD/SDIO, I2C, IrDA, LINbus, Microwire, QSPI, SmartCard, SPI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, Temp Sensor, WDT Program Memory Size: 8.188MB (8.188M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 99x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-TEQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 468 | |
 | | CYT4BF8CEDQ0AEEGS | Infineon Technologies | IC MCU 32BT 8.1875MB FLSH 176QFP | Microcontrollers | 176-TEQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+/M4F Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 8.1875MB (8.1875M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 99x12b SAR Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-TEQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 15 | |
 | | CYT4BF8CEDQ0AEEGST | Infineon Technologies | IC MCU 32BT 8.1875MB FLSH 176QFP | Microcontrollers | 176-TEQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7 Core Size: 32-Bit Quad-Core Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 8.1875MB (8.1875M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 99x12b SAR Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-TEQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 62 | |
 | | CYT4BF8CEDQ0AESGS | Infineon Technologies | IC MCU 32BT 8.1875MB FLSH 176QFP | Microcontrollers | 176-TEQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F Core Size: 32-Bit Quad-Core Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 8.1875MB (8.1875M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 99x12b SAR Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-TEQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 844 | |
 | | CYT4BF8CEDQ0AESGST | Infineon Technologies | IC MCU 32BT 8.1875MB FLSH 176QFP | Microcontrollers | 176-TEQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F Core Size: 32-Bit Quad-Core Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 8.1875MB (8.1875M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 99x12b SAR Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-TEQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 354 | |
| N/A | N/A | CYT4BF8CEDR0AESGST | Infineon Technologies | TRAVEO-2 BODY HIGH-END | Microcontrollers | N/A | N/A | N/A | N/A | 732 | |
 | | CYT4BFBCHDQ0BZEGS | Infineon Technologies | IC MCU 32BT 8.1875MB FLSH 272BGA | Microcontrollers | 272-BGA (16x16) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F Core Size: 32-Bit Quad-Core Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 8.1875MB (8.1875M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 114x12b SAR Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 272-BGA (16×16) | 429 | |
 | | CYT4BFBCHDQ0BZEGST | Infineon Technologies | IC MCU 32BT 8.1875MB FLSH 272BGA | Microcontrollers | 272-BGA (16x16) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F Core Size: 32-Bit Quad-Core Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 8.1875MB (8.1875M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 114x12b SAR Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 272-BGA (16×16) | 617 | |
 | | CYT4BFBCHDQ0BZSGS | Infineon Technologies | IC MCU 32BT 8.1875MB FLSH 272BGA | Microcontrollers | 272-BGA (16x16) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F Core Size: 32-Bit Quad-Core Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 8.1875MB (8.1875M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 114x12b SAR Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 272-BGA (16×16) | 159 | |
 | | CYT4BFBCHDQ0BZSGST | Infineon Technologies | IC MCU 32BT 8.1875MB FLSH 272BGA | Microcontrollers | 272-BGA (16x16) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F Core Size: 32-Bit Quad-Core Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 8.1875MB (8.1875M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 114x12b SAR Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 272-BGA (16×16) | 528 | |
 | | CYT4BFBCJDQ0BZEGS | Infineon Technologies | IC MCU 32BT 8.1875MB FLSH 272BGA | Microcontrollers | 272-BGA (16x16) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F Core Size: 32-Bit Quad-Core Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 8.1875MB (8.1875M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 114x12b SAR Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 272-BGA (16×16) | 9 | |