Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,054
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
CYT4BFBCJDQ0BZEGSTCYT4BFBCJDQ0BZEGSTInfineon TechnologiesIC MCU 32BT 8.1875MB FLSH 272BGAMicrocontrollers272-BGA (16x16)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Quad-Core
Speed:
100MHz, 350MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
220
Program Memory Size:
8.1875MB (8.1875M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 114x12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
272-BGA (16×16)
Package / Case:
272-LFBGA
589
CYT4BFBCJDQ0BZSGSCYT4BFBCJDQ0BZSGSInfineon TechnologiesIC MCU 32BT 8.1875MB FLSH 272BGAMicrocontrollers272-BGA (16x16)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Quad-Core
Speed:
100MHz, 350MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
220
Program Memory Size:
8.1875MB (8.1875M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 114x12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
272-BGA (16×16)
Package / Case:
272-LFBGA
438
CYT4BFBCJDQ0BZSGSTCYT4BFBCJDQ0BZSGSTInfineon TechnologiesIC MCU 32BT 8.1875MB FLSH 272BGAMicrocontrollers272-BGA (16x16)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Quad-Core
Speed:
100MHz, 350MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
220
Program Memory Size:
8.1875MB (8.1875M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 114x12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
272-BGA (16×16)
Package / Case:
272-LFBGA
18
CYT4BFCCHDQ0BZEGSCYT4BFCCHDQ0BZEGSInfineon TechnologiesIC MCU 32BT 8.1875MB FLSH 320BGAMicrocontrollers320-BGA (17x17)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Quad-Core
Speed:
100MHz, 350MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
240
Program Memory Size:
8.1875MB (8.1875M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 114x12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
320-BGA (17×17)
Package / Case:
320-LFBGA
624
CYT4BFCCHDQ0BZEGSTCYT4BFCCHDQ0BZEGSTInfineon TechnologiesIC MCU 32BT 8.1875MB FLSH 320BGAMicrocontrollers320-BGA (17x17)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Quad-Core
Speed:
100MHz, 350MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
240
Program Memory Size:
8.1875MB (8.1875M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 114x12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
320-BGA (17×17)
Package / Case:
320-LFBGA
755
CYT4BFCCHDQ0BZSGSCYT4BFCCHDQ0BZSGSInfineon TechnologiesIC MCU 32BT 8.1875MB FLSH 320BGAMicrocontrollers320-BGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Quad-Core
Speed:
100MHz, 350MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
240
Program Memory Size:
8.1875MB (8.1875M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 114x12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
320-BGA (17×17)
Package / Case:
320-LFBGA
93
CYT4BFCCHDQ0BZSGSTCYT4BFCCHDQ0BZSGSTInfineon TechnologiesIC MCU 32BT 8.1875MB FLSH 320BGAMicrocontrollers320-BGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Quad-Core
Speed:
100MHz, 350MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
240
Program Memory Size:
8.1875MB (8.1875M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 114x12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
320-BGA (17×17)
Package / Case:
320-LFBGA
689
CYT4BFCCHDR0BZEGSTN/ACYT4BFCCHDR0BZEGSTInfineon TechnologiesIC MCU 32BIT 8.188MB FLSH 320BGAMicrocontrollers320-BGA (17x17)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7
Core Size:
32-Bit Quad-Core
Speed:
100MHz, 350MHz
Connectivity:
eMMC/SD/SDIO, I2C, IrDA, LINbus, Microwire, QSPI, SmartCard, SPI, SSP, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, Temp Sensor, WDT
Number of I/O:
195
Program Memory Size:
8.188MB (8.188M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 114x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
320-BGA (17×17)
Package / Case:
320-LFBGA
286
CYT4BFCCJDQ0BZEGSCYT4BFCCJDQ0BZEGSInfineon TechnologiesIC MCU 32BT 8.1875MB FLSH 320BGAMicrocontrollers320-BGA (17x17)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+/M4F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 350MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
240
Program Memory Size:
8.1875MB (8.1875M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 114x12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
320-BGA (17×17)
Package / Case:
320-LFBGA
421
CYT4BFCCJDQ0BZEGSTCYT4BFCCJDQ0BZEGSTInfineon TechnologiesIC MCU 32BT 8.1875MB FLSH 320BGAMicrocontrollers320-BGA (17x17)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7
Core Size:
32-Bit Quad-Core
Speed:
100MHz, 350MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
240
Program Memory Size:
8.1875MB (8.1875M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 114x12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
320-BGA (17×17)
Package / Case:
320-LFBGA
1,055
CYT4BFCCJDQ0BZSGSCYT4BFCCJDQ0BZSGSInfineon TechnologiesIC MCU 32BT 8.1875MB FLSH 320BGAMicrocontrollers320-BGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Quad-Core
Speed:
100MHz, 350MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
240
Program Memory Size:
8.1875MB (8.1875M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 114x12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
320-BGA (17×17)
Package / Case:
320-LFBGA
261
CYT4BFCCJDQ0BZSGSTCYT4BFCCJDQ0BZSGSTInfineon TechnologiesIC MCU 32BT 8.1875MB FLSH 320BGAMicrocontrollers320-BGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Quad-Core
Speed:
100MHz, 350MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
240
Program Memory Size:
8.1875MB (8.1875M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 114x12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
320-BGA (17×17)
Package / Case:
320-LFBGA
71
CYT4DNJBRCQ1BZSGSN/ACYT4DNJBRCQ1BZSGSInfineon TechnologiesIC MCU 32BIT 6.188MB FLSH 327BGAMicrocontrollers327-BGAN/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7F
Core Size:
32-Bit Quad-Core
Speed:
320MHz
Connectivity:
DMA, I2S, LVD, Temp Sensor, WDT
Peripherals:
DMA, I2S, LVD, Temp Sensor, WDT
Number of I/O:
168
Program Memory Size:
6.188MB (6.188M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
640K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
327-BGA
Package / Case:
327-BGA
772
CYT4DNJBRCQ1BZSGSTN/ACYT4DNJBRCQ1BZSGSTInfineon TechnologiesIC MCU 32BIT 6.188MB FLSH 327BGAMicrocontrollers327-BGAN/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7F
Core Size:
32-Bit Quad-Core
Speed:
320MHz
Connectivity:
DMA, I2S, LVD, Temp Sensor, WDT
Peripherals:
DMA, I2S, LVD, Temp Sensor, WDT
Number of I/O:
168
Program Memory Size:
6.188MB (6.188M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
640K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
327-BGA
Package / Case:
327-BGA
637
N/AN/ACYTR21100-44LQI28Infineon TechnologiesTRACKPADMicrocontrollersN/AN/A–

N/A

1,386
N/AN/ACYTR21100-44LQI28TInfineon TechnologiesTRACKPADMicrocontrollersN/AN/A–

N/A

1,514
CYUSB3343-BZXIN/ACYUSB3343-BZXIInfineon TechnologiesUSB SUPER SPEED HUBSControllers121-FBGA (10x10)3V ~ 3.6V-40°C ~ 85°C (TA)
Protocol:
USB
Function:
Hub Controller
Interface:
I2C, USB
Standards:
USB 3.1
Voltage – Supply:
3V ~ 3.6V
Current – Supply:
5mA
Operating Temperature:
-40°C ~ 85°C (TA)
Package / Case:
121-TFBGA
Supplier Device Package:
121-FBGA (10×10)
95
CYWB0120AB-BVXIN/ACYWB0120AB-BVXIInfineon TechnologiesIC WEST BRIDGE ANTIOCH 100VFBGAControllers100-VFBGA (6x6)1.8V ~ 3.3V-40°C ~ 85°C
Protocol:
USB, Memory Card
Function:
Controller
Interface:
Parallel
Standards:
USB 2.0
Voltage – Supply:
1.8V ~ 3.3V
Current – Supply:
110mA
Operating Temperature:
-40°C ~ 85°C
Package / Case:
100-VFBGA
Supplier Device Package:
100-VFBGA (6×6)
1,489
CYWB0124AB-BVXICYWB0124AB-BVXIInfineon TechnologiesIC WEST BRIDGE ANTIOCH 100-VFBGAControllers100-VFBGA (6x6)1.8V ~ 3.3V-40°C ~ 85°C
Protocol:
USB, Memory Card
Function:
Controller
Interface:
Parallel
Standards:
USB 2.0
Voltage – Supply:
1.8V ~ 3.3V
Current – Supply:
110mA
Operating Temperature:
-40°C ~ 85°C
Package / Case:
100-VFBGA
Supplier Device Package:
100-VFBGA (6×6)
374
CYWB0124AB-BVXITCYWB0124AB-BVXITInfineon TechnologiesIC WEST BRIDGE ANTIOCH 100-VFBGAControllers100-VFBGA (6x6)1.8V ~ 3.3V-40°C ~ 85°C
Protocol:
USB, Memory Card
Function:
Controller
Interface:
Parallel
Standards:
USB 2.0
Voltage – Supply:
1.8V ~ 3.3V
Current – Supply:
110mA
Operating Temperature:
-40°C ~ 85°C
Package / Case:
100-VFBGA
Supplier Device Package:
100-VFBGA (6×6)
524

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