Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
DF2328BVF25V
DF2328BVF25VRenesasIC MCU 16BIT 256KB FLASH 128QFPMicrocontrollers128-QFP (14x20)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
SCI, SmartCard
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
86
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
128-QFP (14×20)
Package / Case:
128-BFQFP
905
DF2328BVF25WV
DF2328BVF25WVRenesasIC MCU 16BIT 256KB FLASH 128QFPMicrocontrollers128-QFP (14x20)N/A-40°C ~ 85°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
SCI, SmartCard
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
86
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
128-QFP (14×20)
Package / Case:
128-BFQFP
248
DF2328BVF25WVTRN/ADF2328BVF25WVTRRenesasIC MCU 16BIT 256KB FLASH 128QFPMicrocontrollers128-QFP (14x20)N/A-40°C ~ 85°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
SCI, SmartCard
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
86
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
128-QFP (14×20)
Package / Case:
128-BFQFP
18
DF2328BVTE25V
DF2328BVTE25VRenesasIC MCU 16BIT 256KB FLASH 120TQFPMicrocontrollers120-TQFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
SCI, SmartCard
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
86
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
120-TQFP (14×14)
Package / Case:
120-TQFP
980
DF2328VF25IV
DF2328VF25IVRenesasIC MCU 16BIT 256KB FLASH 128QFPMicrocontrollers128-QFP (14x20)N/A-40°C ~ 85°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
SCI, SmartCard
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
86
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
128-QFP (14×20)
Package / Case:
128-BFQFP
468
DF2328VF25VN/ADF2328VF25VRenesasIC MCU 16BIT 256KB FLASH 128QFPMicrocontrollers128-QFP (14x20)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
SCI, SmartCard
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
86
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
128-QFP (14×20)
Package / Case:
128-BFQFP
1,082
DF2328VTE25APVN/ADF2328VTE25APVRenesasIC MCU 16BIT 256KB FLASH 120TQFPMicrocontrollers120-TQFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
SCI, SmartCard
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
86
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
120-TQFP (14×14)
Package / Case:
120-TQFP
1,261
DF2328VTE25VN/ADF2328VTE25VRenesasIC MCU 16BIT 256KB FLASH 120TQFPMicrocontrollers120-TQFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
SCI, SmartCard
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
86
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
120-TQFP (14×14)
Package / Case:
120-TQFP
117
DF2329BVF25V
DF2329BVF25VRenesasIC MCU 16BIT 384KB FLASH 128QFPMicrocontrollers128-QFP (14x20)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
SCI, SmartCard
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
86
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
128-QFP (14×20)
Package / Case:
128-BFQFP
1,657
DF2329BVF25WV
DF2329BVF25WVRenesasIC MCU 16BIT 384KB FLASH 128QFPMicrocontrollers128-QFP (14x20)N/A-40°C ~ 85°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
SCI, SmartCard
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
86
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
128-QFP (14×20)
Package / Case:
128-BFQFP
523
DF2329BVTE25V
DF2329BVTE25VRenesasIC MCU 16BIT 384KB FLASH 120TQFPMicrocontrollers120-TQFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
SCI, SmartCard
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
86
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
120-TQFP (14×14)
Package / Case:
120-TQFP
1,450
DF2329BVTE25WV
DF2329BVTE25WVRenesasIC MCU 16BIT 384KB FLASH 120TQFPMicrocontrollers120-TQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
SCI, SmartCard
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
86
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
120-TQFP (14×14)
Package / Case:
120-TQFP
477
DF2329EVF25V
DF2329EVF25VRenesasIC MCU 16BIT 384KB FLASH 128QFPMicrocontrollers128-QFP (14x20)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
SCI, SmartCard
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
86
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
128-QFP (14×20)
Package / Case:
128-BFQFP
672
DF2329EVTE25V
DF2329EVTE25VRenesasIC MCU 16BIT 384KB FLASH 120TQFPMicrocontrollers120-TQFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
SCI, SmartCard
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
86
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
120-TQFP (14×14)
Package / Case:
120-TQFP
1,812
DF2329VF25IVN/ADF2329VF25IVRenesasIC MCU 16BIT 384KB FLASH 128QFPMicrocontrollers128-QFP (14x20)N/A-40°C ~ 85°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
SCI, SmartCard
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
86
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
128-QFP (14×20)
Package / Case:
128-BFQFP
4
DF2329VF25VN/ADF2329VF25VRenesasIC MCU 16BIT 384KB FLASH 128QFPMicrocontrollers128-QFP (14x20)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
SCI, SmartCard
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
86
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
128-QFP (14×20)
Package / Case:
128-BFQFP
452
DF2329VTE25VN/ADF2329VTE25VRenesasIC MCU 16BIT 384KB FLASH 120TQFPMicrocontrollers120-TQFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
SCI, SmartCard
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
86
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
120-TQFP (14×14)
Package / Case:
120-TQFP
1,100
DF2338VFC25V
DF2338VFC25VRenesasIC MCU 16BIT 256KB FLASH 144QFPMicrocontrollers144-QFP (20x20)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
SCI, SmartCard
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
106
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 12x10b; D/A 4x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-QFP (20×20)
Package / Case:
144-BFQFP
883
DF2339EVFC25V
DF2339EVFC25VRenesasIC MCU 16BIT 384KB FLASH 144QFPMicrocontrollers144-QFP (20x20)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
SCI, SmartCard
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
106
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 12x10b; D/A 4x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-QFP (20×20)
Package / Case:
144-BFQFP
1,509
DF2339VFC25V
DF2339VFC25VRenesasIC MCU 16BIT 384KB FLASH 144QFPMicrocontrollers144-QFP (20x20)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
SCI, SmartCard
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
106
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 12x10b; D/A 4x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-QFP (20×20)
Package / Case:
144-BFQFP
837

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