Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,054
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
CYT4BB5CEBQ1AEEGSN/ACYT4BB5CEBQ1AEEGSInfineon TechnologiesTRAVEO-2 BODY HIGH-ENDMicrocontrollers100-TEQFP (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7
Core Size:
32-Bit Tri-Core
Speed:
100MHz, 250MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
72
Program Memory Size:
4.0625MB (4.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 55x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TEQFP (14×14)
Package / Case:
100-LQFP Exposed Pad
669
CYT4BB5CEBQ1AEEGSTN/ACYT4BB5CEBQ1AEEGSTInfineon TechnologiesIC MCU 32BIT 4MB FLASH 100LQFPMicrocontrollers100-TEQFP (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7F
Core Size:
32-Bit Tri-Core
Speed:
100MHz, 250MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
72
Program Memory Size:
4.0625MB (4.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 37x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TEQFP (14×14)
Package / Case:
100-LQFP Exposed Pad
259
CYT4BB5CEBQ1AESGSN/ACYT4BB5CEBQ1AESGSInfineon TechnologiesIC MCU 32BIT 4MB FLASH 100LQFPMicrocontrollers100-TEQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7F
Core Size:
32-Bit Tri-Core
Speed:
100MHz, 250MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
72
Program Memory Size:
4.0625MB (4.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 37x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TEQFP (14×14)
Package / Case:
100-LQFP Exposed Pad
502
CYT4BB5CEBQ1AESGSTN/ACYT4BB5CEBQ1AESGSTInfineon TechnologiesIC MCU 32BIT 4MB FLASH 100LQFPMicrocontrollers100-TEQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7F
Core Size:
32-Bit Tri-Core
Speed:
100MHz, 250MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
72
Program Memory Size:
4.0625MB (4.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 37x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TEQFP (14×14)
Package / Case:
100-LQFP Exposed Pad
516
N/ACYT4BB7CEBQ0AEEGSInfineon TechnologiesIC MCU 32BT 4.0625MB FLSH 144QFPMicrocontrollers144-TEQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7
Core Size:
32-Bit Quad-Core
Speed:
100MHz, 250MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
116
Program Memory Size:
4.0625MB (4.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 70x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-TEQFP (20×20)
Package / Case:
144-LQFP Exposed Pad
77
N/ACYT4BB7CEBQ0AEEGSTInfineon TechnologiesIC MCU 32BT 4.0625MB FLSH 144QFPMicrocontrollers144-TEQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7
Core Size:
32-Bit Quad-Core
Speed:
100MHz, 250MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
116
Program Memory Size:
4.0625MB (4.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 70x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-TEQFP (20×20)
Package / Case:
144-LQFP Exposed Pad
261
N/ACYT4BB7CEBQ0AESGSInfineon TechnologiesIC MCU 32BT 4.0625MB FLSH 144QFPMicrocontrollers144-TEQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7
Core Size:
32-Bit Quad-Core
Speed:
100MHz, 250MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
116
Program Memory Size:
4.0625MB (4.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 70x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-TEQFP (20×20)
Package / Case:
144-LQFP Exposed Pad
710
N/ACYT4BB7CEBQ0AESGSTInfineon TechnologiesIC MCU 32BT 4.0625MB FLSH 144QFPMicrocontrollers144-TEQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7
Core Size:
32-Bit Quad-Core
Speed:
100MHz, 250MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
116
Program Memory Size:
4.0625MB (4.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 70x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-TEQFP (20×20)
Package / Case:
144-LQFP Exposed Pad
544
N/AN/ACYT4BB7CEBQ1AEEGSInfineon TechnologiesIC MCU 32BIT 4MB FLASH 144LQFPMicrocontrollers144-TEQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7F
Core Size:
32-Bit Tri-Core
Speed:
100MHz, 250MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
116
Program Memory Size:
4.0625MB (4.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 52x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-TEQFP (20×20)
Package / Case:
144-LQFP Exposed Pad
661
N/AN/ACYT4BB7CEBQ1AEEGSTInfineon TechnologiesIC MCU 32BIT 4MB FLASH 144LQFPMicrocontrollers144-TEQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7F
Core Size:
32-Bit Tri-Core
Speed:
100MHz, 250MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
116
Program Memory Size:
4.0625MB (4.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 52x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-TEQFP (20×20)
Package / Case:
144-LQFP Exposed Pad
576
N/AN/ACYT4BB7CEBQ1AESGSInfineon TechnologiesIC MCU 32BIT 4MB FLASH 144LQFPMicrocontrollers144-TEQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7F
Core Size:
32-Bit Tri-Core
Speed:
100MHz, 250MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
116
Program Memory Size:
4.0625MB (4.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 52x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-TEQFP (20×20)
Package / Case:
144-LQFP Exposed Pad
506
N/AN/ACYT4BB7CEBQ1AESGSTInfineon TechnologiesIC MCU 32BIT 4MB FLASH 144LQFPMicrocontrollers144-TEQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7F
Core Size:
32-Bit Tri-Core
Speed:
100MHz, 250MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
116
Program Memory Size:
4.0625MB (4.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 52x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-TEQFP (20×20)
Package / Case:
144-LQFP Exposed Pad
1,886
CYT4BB8CEBQ0AEEGSCYT4BB8CEBQ0AEEGSInfineon TechnologiesIC MCU 32BT 4.0625MB FLSH 176QFPMicrocontrollers176-TEQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7
Core Size:
32-Bit Quad-Core
Speed:
100MHz, 250MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
148
Program Memory Size:
4.0625MB (4.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 82x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-TEQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
351
CYT4BB8CEBQ0AEEGSTCYT4BB8CEBQ0AEEGSTInfineon TechnologiesIC MCU 32BT 4.0625MB FLSH 176QFPMicrocontrollers176-TEQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7
Core Size:
32-Bit Quad-Core
Speed:
100MHz, 250MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
148
Program Memory Size:
4.0625MB (4.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 82x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-TEQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
1,642
CYT4BB8CEBQ0AESGSCYT4BB8CEBQ0AESGSInfineon TechnologiesIC MCU 32BT 4.0625MB FLSH 176QFPMicrocontrollers176-TEQFP (24x24)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7
Core Size:
32-Bit Quad-Core
Speed:
100MHz, 250MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
148
Program Memory Size:
4.0625MB (4.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 82x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-TEQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
401
CYT4BB8CEBQ0AESGSTCYT4BB8CEBQ0AESGSTInfineon TechnologiesIC MCU 32BT 4.0625MB FLSH 176QFPMicrocontrollers176-TEQFP (24x24)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7
Core Size:
32-Bit Quad-Core
Speed:
100MHz, 250MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
148
Program Memory Size:
4.0625MB (4.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 82x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-TEQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
991
CYT4BB8CEBQ1AEEGSN/ACYT4BB8CEBQ1AEEGSInfineon TechnologiesTRAVEO-2 BODY HIGH-ENDMicrocontrollers176-TEQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7
Core Size:
32-Bit Tri-Core
Speed:
100MHz, 250MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
148
Program Memory Size:
4.0625MB (4.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 82x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-TEQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
1,427
CYT4BB8CEBQ1AEEGSTN/ACYT4BB8CEBQ1AEEGSTInfineon TechnologiesIC MCU 32BIT 4MB FLASH 176LQFPMicrocontrollers176-TEQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7F
Core Size:
32-Bit Tri-Core
Speed:
100MHz, 250MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
148
Program Memory Size:
4.0625MB (4.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 64x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-TEQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
601
CYT4BB8CEBQ1AESGSN/ACYT4BB8CEBQ1AESGSInfineon TechnologiesIC MCU 32BIT 4MB FLASH 176LQFPMicrocontrollers176-TEQFP (24x24)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7F
Core Size:
32-Bit Tri-Core
Speed:
100MHz, 250MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
148
Program Memory Size:
4.0625MB (4.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 64x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-TEQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
784
CYT4BB8CEBQ1AESGSTN/ACYT4BB8CEBQ1AESGSTInfineon TechnologiesIC MCU 32BIT 4MB FLASH 176LQFPMicrocontrollers176-TEQFP (24x24)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7F
Core Size:
32-Bit Tri-Core
Speed:
100MHz, 250MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, eMMC/SD, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
148
Program Memory Size:
4.0625MB (4.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 64x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-TEQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
920

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