Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
DSP56F802TA60EN/ADSP56F802TA60ENXP SemiconductorsIC MCU 16BIT 16KB FLASH 32LQFPMicrocontrollers32-LQFP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
56800
Core Size:
16-Bit
Speed:
60MHz
Connectivity:
SCI
Peripherals:
POR, PWM, WDT
Number of I/O:
8
Program Memory Size:
16KB (8K x 16)
Program Memory Type:
FLASH
RAM Size:
1K x 16
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 5x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-LQFP (7×7)
Package / Case:
32-LQFP
517
DSP56F802TA80EN/ADSP56F802TA80ENXP SemiconductorsIC MCU 16BIT 16KB FLASH 32LQFPMicrocontrollers32-LQFP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
56800
Core Size:
16-Bit
Speed:
80MHz
Connectivity:
SCI
Peripherals:
POR, PWM, WDT
Number of I/O:
8
Program Memory Size:
16KB (8K x 16)
Program Memory Type:
FLASH
RAM Size:
1K x 16
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 5x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-LQFP (7×7)
Package / Case:
32-LQFP
700
DSP56F803BU80
DSP56F803BU80NXP SemiconductorsIC MCU 16BIT 64KB FLASH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
56800
Core Size:
16-Bit
Speed:
80MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
16
Program Memory Size:
64KB (32K x 16)
Program Memory Type:
FLASH
RAM Size:
2K x 16
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
147
DSP56F803BU80E
DSP56F803BU80ENXP SemiconductorsIC MCU 16BIT 64KB FLASH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
56800
Core Size:
16-Bit
Speed:
80MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
16
Program Memory Size:
64KB (32K x 16)
Program Memory Type:
FLASH
RAM Size:
2K x 16
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
1,162
DSP56F805FV80
DSP56F805FV80NXP SemiconductorsIC MCU 16BIT 64KB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
56800
Core Size:
16-Bit
Speed:
80MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
32
Program Memory Size:
64KB (32K x 16)
Program Memory Type:
FLASH
RAM Size:
2K x 16
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
156
DSP56F805FV80E
DSP56F805FV80ENXP SemiconductorsIC MCU 16BIT 64KB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
56800
Core Size:
16-Bit
Speed:
80MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
32
Program Memory Size:
64KB (32K x 16)
Program Memory Type:
FLASH
RAM Size:
2K x 16
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
1,586
DSP56F807PY80E
DSP56F807PY80ENXP SemiconductorsIC MCU 16BIT 120KB FLASH 160LQFPMicrocontrollers160-LQFP (24x24)N/A-40°C ~ 85°C (TA)
Core Processor:
56800
Core Size:
16-Bit
Speed:
80MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
32
Program Memory Size:
120KB (60K x 16)
Program Memory Type:
FLASH
RAM Size:
4K x 16
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 16x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
160-LQFP (24×24)
Package / Case:
160-LQFP
518
DSP56F807VF80
DSP56F807VF80NXP SemiconductorsIC MCU 16B 120KB FLASH 160MAPBGAMicrocontrollers160-MAPBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
56800
Core Size:
16-Bit
Speed:
80MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
32
Program Memory Size:
120KB (60K x 16)
Program Memory Type:
FLASH
RAM Size:
4K x 16
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 16x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
160-MAPBGA (15×15)
Package / Case:
160-BGA
417
DSP56F807VF80E
DSP56F807VF80ENXP SemiconductorsIC MCU 16B 120KB FLASH 160MAPBGAMicrocontrollers160-MAPBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
56800
Core Size:
16-Bit
Speed:
80MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
32
Program Memory Size:
120KB (60K x 16)
Program Memory Type:
FLASH
RAM Size:
4K x 16
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 16x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
160-MAPBGA (15×15)
Package / Case:
160-BGA
920
DSP56F826BU80
DSP56F826BU80NXP SemiconductorsIC MCU 16BIT 64KB FLASH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
56800
Core Size:
16-Bit
Speed:
80MHz
Connectivity:
EBI/EMI, SCI, SPI, SSI
Peripherals:
POR, WDT
Number of I/O:
46
Program Memory Size:
64KB (32K x 16)
Program Memory Type:
FLASH
RAM Size:
4K x 16
Voltage – Supply (Vcc/Vdd):
2.25V ~ 2.75V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
1,323
DSP56F826BU80E
DSP56F826BU80ENXP SemiconductorsIC MCU 16BIT 64KB FLASH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
56800
Core Size:
16-Bit
Speed:
80MHz
Connectivity:
EBI/EMI, SCI, SPI, SSI
Peripherals:
POR, WDT
Number of I/O:
46
Program Memory Size:
64KB (32K x 16)
Program Memory Type:
FLASH
RAM Size:
4K x 16
Voltage – Supply (Vcc/Vdd):
2.25V ~ 2.75V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
618
DSP56F827FG80E
DSP56F827FG80ENXP SemiconductorsIC MCU 16BIT 128KB FLASH 128LQFPMicrocontrollers128-LQFP (14x20)N/A-40°C ~ 85°C (TA)
Core Processor:
56800
Core Size:
16-Bit
Speed:
80MHz
Connectivity:
EBI/EMI, SCI, SPI, SSI
Peripherals:
POR, PWM, WDT
Number of I/O:
64
Program Memory Size:
128KB (64K x 16)
Program Memory Type:
FLASH
RAM Size:
4K x 16
Voltage – Supply (Vcc/Vdd):
2.25V ~ 2.75V
Data Converters:
A/D 10x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
128-LQFP (14×20)
Package / Case:
128-LQFP
442
DSPIC30F1010-20E/MM
DSPIC30F1010-20E/MMMicrochip TechnologyIC MCU 16BIT 6KB FLASH 28QFNMicrocontrollers28-QFN-S (6x6)N/A-40°C ~ 125°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
20 MIPS
Connectivity:
I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
21
Program Memory Size:
6KB (2K x 24)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 6x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-QFN-S (6×6)
Package / Case:
28-VQFN Exposed Pad
288
DSPIC30F1010-20E/SO
DSPIC30F1010-20E/SOMicrochip TechnologyIC MCU 16BIT 6KB FLASH 28SOICMicrocontrollers28-SOICN/A-40°C ~ 125°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
20 MIPS
Connectivity:
I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
21
Program Memory Size:
6KB (2K x 24)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 6x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-SOIC
Package / Case:
28-SOIC (0.295″”, 7.50mm Width)
635
DSPIC30F1010-20E/SP
DSPIC30F1010-20E/SPMicrochip TechnologyIC MCU 16BIT 6KB FLASH 28SPDIPMicrocontrollers28-SPDIPN/A-40°C ~ 125°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
20 MIPS
Connectivity:
I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
21
Program Memory Size:
6KB (2K x 24)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 6x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
28-SPDIP
Package / Case:
28-DIP (0.300″”, 7.62mm)
1,035
DSPIC30F1010-30I/MM
DSPIC30F1010-30I/MMMicrochip TechnologyIC MCU 16BIT 6KB FLASH 28QFNMicrocontrollers28-QFN-S (6x6)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
30 MIPs
Connectivity:
I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
21
Program Memory Size:
6KB (2K x 24)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 6x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-QFN-S (6×6)
Package / Case:
28-VQFN Exposed Pad
1,338
DSPIC30F1010-30I/SO
DSPIC30F1010-30I/SOMicrochip TechnologyIC MCU 16BIT 6KB FLASH 28SOICMicrocontrollers28-SOICN/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
30 MIPs
Connectivity:
I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
21
Program Memory Size:
6KB (2K x 24)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 6x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-SOIC
Package / Case:
28-SOIC (0.295″”, 7.50mm Width)
1,760
DSPIC30F1010-30I/SP
DSPIC30F1010-30I/SPMicrochip TechnologyIC MCU 16BIT 6KB FLASH 28SPDIPMicrocontrollers28-SPDIPN/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
30 MIPs
Connectivity:
I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
21
Program Memory Size:
6KB (2K x 24)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 6x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
28-SPDIP
Package / Case:
28-DIP (0.300″”, 7.62mm)
476
DSPIC30F1010T-30I/MM
DSPIC30F1010T-30I/MMMicrochip TechnologyIC MCU 16BIT 6KB FLASH 28QFNMicrocontrollers28-QFN-S (6x6)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
30 MIPs
Connectivity:
I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
21
Program Memory Size:
6KB (2K x 24)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 6x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-QFN-S (6×6)
Package / Case:
28-VQFN Exposed Pad
1,310
DSPIC30F1010T-30I/SO
DSPIC30F1010T-30I/SOMicrochip TechnologyIC MCU 16BIT 6KB FLASH 28SOICMicrocontrollers28-SOICN/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
30 MIPs
Connectivity:
I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
21
Program Memory Size:
6KB (2K x 24)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 6x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-SOIC
Package / Case:
28-SOIC (0.295″”, 7.50mm Width)
904

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