Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,622
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/AFX32K148HAT0MLQTNXP SemiconductorsS32K148 ARM CORTEX-M4F, 80 MHZ,MicrocontrollersN/AN/AN/A

N/A

1,216
N/AFX32K148UJT0VLLTNXP SemiconductorsS32K148 ARM CORTEX-M4F, 112 MHZ,MicrocontrollersN/AN/AN/A

N/A

281
N/AFX32K148UJT0VLQTNXP SemiconductorsS32K148 ARM CORTEX-M4F, 112 MHZ,MicrocontrollersN/AN/AN/A

N/A

821
N/AFX32K148UJT0VMHRNXP SemiconductorsS32K148 ARM CORTEX-M4F, 112 MHZ,MicrocontrollersN/AN/AN/A

N/A

309
N/AFXLA102L8X-F106Fairchild SemiconductorOTHER INTERFACE ICSControllersN/AN/AN/A

N/A

1,459
FYMD4470CSCBN/AFYMD4470CSCBIntelIC 5V 4470 CONTROLLER 128-SQFPControllers-N/AN/A

N/A

1,151
N/AN/AG4860NSE7QUMDNXP SemiconductorsIC MPU QORIQ 1.6GHZ 1020FCPBGAMicroprocessors1020-FCPBGA (33x33)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e6500
Number of Cores/Bus Width:
4 Core, 64-Bit
Speed:
1.6GHz
Co-Processors/DSP:
Signal Processing; SC3900FP FVP – 6 Core
RAM Controllers:
DDR3, DDR3L
Graphics Acceleration:
No
Ethernet:
1/2.5Gbps (4), 1/2.5/10Gbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
Mounting Type:
Surface Mount
Package / Case:
1020-BBGA, FCBGA
Supplier Device Package:
1020-FCPBGA (33×33)
Additional Interfaces:
I2C, MMC/SD, RapidIO, SPI, UART
129
N/AN/AG4860NSN7QUMDNXP SemiconductorsIC MPU QORIQ 1.6GHZ 1020FCPBGAMicroprocessors1020-FCPBGA (33x33)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e6500
Number of Cores/Bus Width:
4 Core, 64-Bit
Speed:
1.6GHz
Co-Processors/DSP:
Signal Processing; SC3900FP FVP – 6 Core
RAM Controllers:
DDR3, DDR3L
Graphics Acceleration:
No
Ethernet:
1/2.5Gbps (4), 1/2.5/10Gbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
Mounting Type:
Surface Mount
Package / Case:
1020-BBGA, FCBGA
Supplier Device Package:
1020-FCPBGA (33×33)
Additional Interfaces:
I2C, MMC/SD, RapidIO, SPI, UART
1,875
N/AN/AG4860NXE7QUMDNXP SemiconductorsIC MPU QORIQ 1.6GHZ 1020FCPBGAMicroprocessors1020-FCPBGA (33x33)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e6500
Number of Cores/Bus Width:
4 Core, 64-Bit
Speed:
1.6GHz
Co-Processors/DSP:
Signal Processing; SC3900FP FVP – 6 Core
RAM Controllers:
DDR3, DDR3L
Graphics Acceleration:
No
Ethernet:
1/2.5Gbps (4), 1/2.5/10Gbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
Mounting Type:
Surface Mount
Package / Case:
1020-BBGA, FCBGA
Supplier Device Package:
1020-FCPBGA (33×33)
Additional Interfaces:
I2C, MMC/SD, RapidIO, SPI, UART
1,356
N/AN/AG4860NXN7QUMDNXP SemiconductorsIC MPU QORIQ 1.6GHZ 1020FCPBGAMicroprocessors1020-FCPBGA (33x33)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e6500
Number of Cores/Bus Width:
4 Core, 64-Bit
Speed:
1.6GHz
Co-Processors/DSP:
Signal Processing; SC3900FP FVP – 6 Core
RAM Controllers:
DDR3, DDR3L
Graphics Acceleration:
No
Ethernet:
1/2.5Gbps (4), 1/2.5/10Gbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
Mounting Type:
Surface Mount
Package / Case:
1020-BBGA, FCBGA
Supplier Device Package:
1020-FCPBGA (33×33)
Additional Interfaces:
I2C, MMC/SD, RapidIO, SPI, UART
145
N/AG9S08EL32F1MTLRNXP SemiconductorsS9S08EL32F1MS908EMICROCONTROLLERMicrocontrollersN/AN/AN/A

N/A

695
N/AG9S08SG16E1MTLRNXP SemiconductorsS9S08SG16E1MS908SMICROCONTROLLERMicrocontrollersN/AN/AN/A

N/A

1,545
GCIXF440ACGCIXF440ACIntelLAN CONTROLLER, 8 CHANNEL(S), 12Controllers-3V ~ 3.6V0°C ~ 70°C
Protocol:
Ethernet
Function:
Controller
Voltage – Supply:
3V ~ 3.6V
Current – Supply:
830mA
Operating Temperature:
0°C ~ 70°C
Package / Case:
352-BGA
431
GCIXF440ACTGCIXF440ACTIntelLAN CONTROLLERControllers352-BGA (35x35)3V ~ 3.6V0°C ~ 70°C (TA)
Protocol:
Ethernet
Function:
Controller
Interface:
FIFO, MII
Standards:
IEEE 802.3, 10/100 Base-T/TX
Voltage – Supply:
3V ~ 3.6V
Current – Supply:
830mA
Operating Temperature:
0°C ~ 70°C (TA)
Package / Case:
352-LBGA
Supplier Device Package:
352-BGA (35×35)
346
GCIXP1200GAGCIXP1200GAIntelIC MPU STRONGARM 166MHZ 432BGAMicroprocessors432-BGA (40x40)N/A0°C ~ 70°C (TA)
Core Processor:
StrongARM
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
166MHz
Co-Processors/DSP:
Data; Microengine
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
432-LBGA
Supplier Device Package:
432-BGA (40×40)
1,702
GCIXP1200GBGCIXP1200GBIntelIC MPU 200MHZ 432BGAMicroprocessors432-BGA (40x40)N/A0°C ~ 70°C
Core Processor:
StrongARM
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
200MHz
Co-Processors/DSP:
Data; Microengine
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 70°C
Mounting Type:
Surface Mount
Package / Case:
432-LBGA
Supplier Device Package:
432-BGA (40×40)
58
N/AGCIXP1200GCIntelINTEL IXP1200 NETWORK PROCESSORMicroprocessorsN/AN/AN/A

N/A

1,126
GCIXP1240AAGCIXP1240AAIntelIC MPU STRONGARM 166MHZ 432BGAMicroprocessors432-BGA (40x40)N/A0°C ~ 70°C (TA)
Core Processor:
StrongARM
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
166MHz
Co-Processors/DSP:
Data; Microengine
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
432-LBGA
Supplier Device Package:
432-BGA (40×40)
507
GCIXP1240ABGCIXP1240ABIntelIC MPU STRONGARM 200MHZ 432BGAMicroprocessors432-BGA (40x40)N/A0°C ~ 70°C (TA)
Core Processor:
StrongARM
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
200MHz
Co-Processors/DSP:
Data; Microengine
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
432-LBGA
Supplier Device Package:
432-BGA (40×40)
608
GCIXP1240ACGCIXP1240ACIntelIC MPU 232MHZ 432BGAMicroprocessors432-BGA (40x40)N/A0°C ~ 70°C (TA)
Core Processor:
StrongARM
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
232MHz
Co-Processors/DSP:
Data; Microengine
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
432-LBGA
Supplier Device Package:
432-BGA (40×40)
1,917

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