| N/A | | FX32K148HAT0MLQT | NXP Semiconductors | S32K148 ARM CORTEX-M4F, 80 MHZ, | Microcontrollers | N/A | N/A | N/A | N/A | 1,216 | |
| N/A | | FX32K148UJT0VLLT | NXP Semiconductors | S32K148 ARM CORTEX-M4F, 112 MHZ, | Microcontrollers | N/A | N/A | N/A | N/A | 281 | |
| N/A | | FX32K148UJT0VLQT | NXP Semiconductors | S32K148 ARM CORTEX-M4F, 112 MHZ, | Microcontrollers | N/A | N/A | N/A | N/A | 821 | |
| N/A | | FX32K148UJT0VMHR | NXP Semiconductors | S32K148 ARM CORTEX-M4F, 112 MHZ, | Microcontrollers | N/A | N/A | N/A | N/A | 309 | |
| N/A | | FXLA102L8X-F106 | Fairchild Semiconductor | OTHER INTERFACE ICS | Controllers | N/A | N/A | N/A | N/A | 1,459 | |
 | N/A | FYMD4470CSCB | Intel | IC 5V 4470 CONTROLLER 128-SQFP | Controllers | - | N/A | N/A | N/A | 1,151 | |
| N/A | N/A | G4860NSE7QUMD | NXP Semiconductors | IC MPU QORIQ 1.6GHZ 1020FCPBGA | Microprocessors | 1020-FCPBGA (33x33) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e6500 Number of Cores/Bus Width: 4 Core, 64-Bit Co-Processors/DSP: Signal Processing; SC3900FP FVP – 6 Core RAM Controllers: DDR3, DDR3L Ethernet: 1/2.5Gbps (4), 1/2.5/10Gbps (2) Voltage – I/O: 1V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C (TA) Security Features: AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC Mounting Type: Surface Mount Package / Case: 1020-BBGA, FCBGA Supplier Device Package: 1020-FCPBGA (33×33) Additional Interfaces: I2C, MMC/SD, RapidIO, SPI, UART | 129 | |
| N/A | N/A | G4860NSN7QUMD | NXP Semiconductors | IC MPU QORIQ 1.6GHZ 1020FCPBGA | Microprocessors | 1020-FCPBGA (33x33) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e6500 Number of Cores/Bus Width: 4 Core, 64-Bit Co-Processors/DSP: Signal Processing; SC3900FP FVP – 6 Core RAM Controllers: DDR3, DDR3L Ethernet: 1/2.5Gbps (4), 1/2.5/10Gbps (2) Voltage – I/O: 1V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C (TA) Security Features: AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC Mounting Type: Surface Mount Package / Case: 1020-BBGA, FCBGA Supplier Device Package: 1020-FCPBGA (33×33) Additional Interfaces: I2C, MMC/SD, RapidIO, SPI, UART | 1,875 | |
| N/A | N/A | G4860NXE7QUMD | NXP Semiconductors | IC MPU QORIQ 1.6GHZ 1020FCPBGA | Microprocessors | 1020-FCPBGA (33x33) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e6500 Number of Cores/Bus Width: 4 Core, 64-Bit Co-Processors/DSP: Signal Processing; SC3900FP FVP – 6 Core RAM Controllers: DDR3, DDR3L Ethernet: 1/2.5Gbps (4), 1/2.5/10Gbps (2) Voltage – I/O: 1V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V Operating Temperature: -40°C ~ 105°C (TA) Security Features: AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC Mounting Type: Surface Mount Package / Case: 1020-BBGA, FCBGA Supplier Device Package: 1020-FCPBGA (33×33) Additional Interfaces: I2C, MMC/SD, RapidIO, SPI, UART | 1,356 | |
| N/A | N/A | G4860NXN7QUMD | NXP Semiconductors | IC MPU QORIQ 1.6GHZ 1020FCPBGA | Microprocessors | 1020-FCPBGA (33x33) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e6500 Number of Cores/Bus Width: 4 Core, 64-Bit Co-Processors/DSP: Signal Processing; SC3900FP FVP – 6 Core RAM Controllers: DDR3, DDR3L Ethernet: 1/2.5Gbps (4), 1/2.5/10Gbps (2) Voltage – I/O: 1V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V Operating Temperature: -40°C ~ 105°C (TA) Security Features: AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC Mounting Type: Surface Mount Package / Case: 1020-BBGA, FCBGA Supplier Device Package: 1020-FCPBGA (33×33) Additional Interfaces: I2C, MMC/SD, RapidIO, SPI, UART | 145 | |
| N/A | | G9S08EL32F1MTLR | NXP Semiconductors | S9S08EL32F1MS908EMICROCONTROLLER | Microcontrollers | N/A | N/A | N/A | N/A | 695 | |
| N/A | | G9S08SG16E1MTLR | NXP Semiconductors | S9S08SG16E1MS908SMICROCONTROLLER | Microcontrollers | N/A | N/A | N/A | N/A | 1,545 | |
 | | GCIXF440AC | Intel | LAN CONTROLLER, 8 CHANNEL(S), 12 | Controllers | - | 3V ~ 3.6V | 0°C ~ 70°C | Voltage – Supply: 3V ~ 3.6V Operating Temperature: 0°C ~ 70°C | 431 | |
 | | GCIXF440ACT | Intel | LAN CONTROLLER | Controllers | 352-BGA (35x35) | 3V ~ 3.6V | 0°C ~ 70°C (TA) | Standards: IEEE 802.3, 10/100 Base-T/TX Voltage – Supply: 3V ~ 3.6V Operating Temperature: 0°C ~ 70°C (TA) Supplier Device Package: 352-BGA (35×35) | 346 | |
 | | GCIXP1200GA | Intel | IC MPU STRONGARM 166MHZ 432BGA | Microprocessors | 432-BGA (40x40) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Data; Microengine Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 432-BGA (40×40) | 1,702 | |
 | | GCIXP1200GB | Intel | IC MPU 200MHZ 432BGA | Microprocessors | 432-BGA (40x40) | N/A | 0°C ~ 70°C | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Data; Microengine Operating Temperature: 0°C ~ 70°C Mounting Type: Surface Mount Supplier Device Package: 432-BGA (40×40) | 58 | |
| N/A | | GCIXP1200GC | Intel | INTEL IXP1200 NETWORK PROCESSOR | Microprocessors | N/A | N/A | N/A | N/A | 1,126 | |
 | | GCIXP1240AA | Intel | IC MPU STRONGARM 166MHZ 432BGA | Microprocessors | 432-BGA (40x40) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Data; Microengine Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 432-BGA (40×40) | 507 | |
 | | GCIXP1240AB | Intel | IC MPU STRONGARM 200MHZ 432BGA | Microprocessors | 432-BGA (40x40) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Data; Microengine Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 432-BGA (40×40) | 608 | |
 | | GCIXP1240AC | Intel | IC MPU 232MHZ 432BGA | Microprocessors | 432-BGA (40x40) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Data; Microengine Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 432-BGA (40×40) | 1,917 | |