 | | FS32R274KBK2MMM | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 257MAPBGA | Microcontrollers | 257-LFBGA (14x14) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z4, e200z7 (2) Core Size: 32-Bit Tri-Core Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.19V ~ 5.5V Data Converters: A/D 16x12b SAR, 4×12 Sigma; D/A 1x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 257-LFBGA (14×14) | 56 | |
 | | FS32R274KBK2MMMR | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 257MAPBGA | Microcontrollers | 257-LFBGA (14x14) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z4, e200z7 (2) Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI, ZipWire Peripherals: POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.19V ~ 5.5V Data Converters: A/D 16x12b SAR, 4×12 Sigma; D/A 1x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 257-LFBGA (14×14) | 1,541 | |
 | | FS32R274KBK2VMM | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 257MAPBGA | Microcontrollers | 257-LFBGA (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: e200z4, e200z7 (2) Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI, ZipWire Peripherals: POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.19V ~ 5.5V Data Converters: A/D 16x12b SAR, 4×12 Sigma; D/A 1x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 257-LFBGA (14×14) | 568 | |
 | | FS32R274KCK2MMM | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 257MAPBGA | Microcontrollers | 257-LFBGA (14x14) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z4, e200z7 (2) Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI, ZipWire Peripherals: POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.19V ~ 5.5V Data Converters: A/D 16x12b SAR, 4×12 Sigma; D/A 1x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 257-LFBGA (14×14) | 1,501 | |
 | | FS32R274KCK2VMM | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 257MAPBGA | Microcontrollers | 257-LFBGA (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: e200z4, e200z7 (2) Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI, ZipWire Peripherals: POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.19V ~ 5.5V Data Converters: A/D 16x12b SAR, 4×12 Sigma; D/A 1x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 257-LFBGA (14×14) | 75 | |
 | | FS32R274KSK2MMM | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 257MAPBGA | Microcontrollers | 257-LFBGA (14x14) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z4, e200z7 (2) Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI, ZipWire Peripherals: POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.19V ~ 5.5V Data Converters: A/D 16x12b SAR, 4×12 Sigma; D/A 1x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 257-LFBGA (14×14) | 618 | |
 | | FS32R274KSK2MMMR | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 257MAPBGA | Microcontrollers | 257-LFBGA (14x14) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z4, e200z7 (2) Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI, ZipWire Peripherals: POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.19V ~ 5.5V Data Converters: A/D 16x12b SAR, 4×12 Sigma; D/A 1x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 257-LFBGA (14×14) | 159 | |
 | | FS32R274KSK2VMM | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 257MAPBGA | Microcontrollers | 257-LFBGA (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: e200z4, e200z7 (2) Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI, ZipWire Peripherals: POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.19V ~ 5.5V Data Converters: A/D 16x12b SAR, 4×12 Sigma; D/A 1x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 257-LFBGA (14×14) | 301 | |
 | | FS32R274VBK2MMM | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 257MAPBGA | Microcontrollers | 257-LFBGA (14x14) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z4, e200z7 (2) Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI, ZipWire Peripherals: POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.19V ~ 5.5V Data Converters: A/D 16x12b SAR, 4×12 Sigma; D/A 1x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 257-LFBGA (14×14) | 9 | |
 | | FS32R274VBK2VMM | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 257MAPBGA | Microcontrollers | 257-LFBGA (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: e200z4, e200z7 (2) Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI, ZipWire Peripherals: POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.19V ~ 5.5V Data Converters: A/D 16x12b SAR, 4×12 Sigma; D/A 1x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 257-LFBGA (14×14) | 7 | |
 | | FS32R274VCK2MMM | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 257MAPBGA | Microcontrollers | 257-LFBGA (14x14) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z4, e200z7 (2) Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI, ZipWire Peripherals: POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.19V ~ 5.5V Data Converters: A/D 16x12b SAR, 4×12 Sigma; D/A 1x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 257-LFBGA (14×14) | 1,253 | |
 | | FS32R274VCK2VMM | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 257MAPBGA | Microcontrollers | 257-LFBGA (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: e200z4, e200z7 (2) Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI, ZipWire Peripherals: POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.19V ~ 5.5V Data Converters: A/D 16x12b SAR, 4×12 Sigma; D/A 1x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 257-LFBGA (14×14) | 759 | |
| N/A | | FS32R294HAK0MJDR | NXP Semiconductors | IC MCU 32BIT 2MB CRAM 269LFBGA | Microcontrollers | 269-LFBGA (14x14) | N/A | N/A | Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14×14) | 215 | |
| N/A | | FS32R294HAK0MJDT | NXP Semiconductors | IC MCU 32BIT 2MB CRAM 269LFBGA | Microcontrollers | 269-LFBGA (14x14) | N/A | N/A | Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14×14) | 1,367 | |
| N/A | | FS32R294HBK0MJDR | NXP Semiconductors | S32R29 MULTICORE POWER ARCHITECT | Microcontrollers | 269-LFBGA (14x14) | N/A | N/A | Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14×14) | 37 | |
| N/A | | FS32R294HBK0MJDT | NXP Semiconductors | S32R29 MULTICORE POWER ARCHITECT | Microcontrollers | 269-LFBGA (14x14) | N/A | N/A | Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14×14) | 869 | |
| N/A | | FS32R294HEK0MJDR | NXP Semiconductors | IC MCU 32BIT 2.5MB CRAM 269LFBGA | Microcontrollers | 269-LFBGA (14x14) | N/A | N/A | Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14×14) | 64 | |
| N/A | | FS32R294HEK0MJDT | NXP Semiconductors | IC MCU 32BIT 2.5MB CRAM 269LFBGA | Microcontrollers | 269-LFBGA (14x14) | N/A | N/A | Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14×14) | 243 | |
| N/A | | FS32R294HFK0MJDR | NXP Semiconductors | IC MCU 32BIT 2.5MB CRAM 269LFBGA | Microcontrollers | N/A | N/A | N/A | N/A | 698 | |
| N/A | | FS32R294HFK0MJDT | NXP Semiconductors | IC MCU 32BIT 2.5MB CRAM 269LFBGA | Microcontrollers | N/A | N/A | N/A | N/A | 306 | |