Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,622
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
GD75232PWRE4GD75232PWRE4Texas InstrumentsIC TRANSCEIVER FULL 3/5 20TSSOPDrivers, Receivers, Transceivers20-TSSOP5V, ±7.5V ~ 15V0°C ~ 70°C
Type:
Transceiver
Protocol:
RS232
Number of Drivers/Receivers:
3/5
Duplex:
Full
Receiver Hysteresis:
500 mV
Data Rate:
120Kbps
Voltage – Supply:
5V, ±7.5V ~ 15V
Operating Temperature:
0°C ~ 70°C
Mounting Type:
Surface Mount
Package / Case:
20-TSSOP (0.173″”, 4.40mm Width)
Supplier Device Package:
20-TSSOP
437
GD75232PWRG4GD75232PWRG4Texas InstrumentsIC TRANSCEIVER FULL 3/5 20TSSOPDrivers, Receivers, Transceivers20-TSSOP5V, ±7.5V ~ 15V0°C ~ 70°C
Type:
Transceiver
Protocol:
RS232
Number of Drivers/Receivers:
3/5
Duplex:
Full
Receiver Hysteresis:
500 mV
Data Rate:
120Kbps
Voltage – Supply:
5V, ±7.5V ~ 15V
Operating Temperature:
0°C ~ 70°C
Mounting Type:
Surface Mount
Package / Case:
20-TSSOP (0.173″”, 4.40mm Width)
Supplier Device Package:
20-TSSOP
234
GD75323DWGD75323DWTexas InstrumentsIC TRANSCEIVER FULL 5/3 20SOICDrivers, Receivers, Transceivers20-SOIC4.5V ~ 5.5V0°C ~ 70°C
Type:
Transceiver
Protocol:
RS232
Number of Drivers/Receivers:
5/3
Duplex:
Full
Receiver Hysteresis:
500 mV
Data Rate:
120Kbps
Voltage – Supply:
4.5V ~ 5.5V
Operating Temperature:
0°C ~ 70°C
Mounting Type:
Surface Mount
Package / Case:
20-SOIC (0.295″”, 7.50mm Width)
Supplier Device Package:
20-SOIC
927
GD75323DWRGD75323DWRTexas InstrumentsIC TRANSCEIVER FULL 5/3 20SOICDrivers, Receivers, Transceivers20-SOIC4.5V ~ 5.5V0°C ~ 70°C
Type:
Transceiver
Protocol:
RS232
Number of Drivers/Receivers:
5/3
Duplex:
Full
Receiver Hysteresis:
500 mV
Data Rate:
120Kbps
Voltage – Supply:
4.5V ~ 5.5V
Operating Temperature:
0°C ~ 70°C
Mounting Type:
Surface Mount
Package / Case:
20-SOIC (0.295″”, 7.50mm Width)
Supplier Device Package:
20-SOIC
690
GD80960JA25GD80960JA25IntelIC MPU I960 25MHZ 196BGAMicroprocessors196-BGAN/A0°C ~ 100°C (TC)
Core Processor:
i960
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 100°C (TC)
Mounting Type:
Surface Mount
Package / Case:
196-BGA
Supplier Device Package:
196-BGA
1,545
GD80960JF33GD80960JF33IntelIC MPU I960 33MHZ 196BGAMicroprocessors196-BGAN/A0°C ~ 100°C (TC)
Core Processor:
i960
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
33MHz
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 100°C (TC)
Mounting Type:
Surface Mount
Package / Case:
196-BGA
Supplier Device Package:
196-BGA
841
GD82550ELSL4MKGD82550ELSL4MKIntelIC ETH PCI/CARDBUS CTRL 196-BGAControllers196-BGA (15x15)-
Protocol:
Ethernet
Function:
MAC Controller
Interface:
PCI
Standards:
100 Base-TX PHY
Package / Case:
196-BGA
Supplier Device Package:
196-BGA (15×15)
128
GD82550EYSL4MJGD82550EYSL4MJIntelIC ETH PCI/CARDBUS CTRL 196BGAControllers196-BGA (15x15)-
Protocol:
Ethernet
Function:
MAC Controller
Interface:
PCI
Standards:
100 Base-TX PHY
Package / Case:
196-BGA
Supplier Device Package:
196-BGA (15×15)
1,176
GD82550GYSL4Y5GD82550GYSL4Y5IntelIC CTRL ETH PCI/CARD BUS 196BGAControllers196-BGA (15x15)-
Protocol:
Ethernet
Function:
MAC Controller
Interface:
PCI
Standards:
100 Base-TX PHY
Package / Case:
196-BGA
Supplier Device Package:
196-BGA (15×15)
1,247
GL7101SDGL7101SDTAEJIN TechnologyEARTH LEAKAGE DETECTORPower Management - SpecializedSOP-8N/A-30°C ~ 85°C (TA)
Operating Temperature:
-30°C ~ 85°C (TA)
Supplier Device Package:
SOP-8
Packaging:
Tape & Reel
833
GL7101SNGL7101SNTAEJIN TechnologyEARTH LEAKAGE DETECTORPower Management - SpecializedDIP-8N/A-30°C ~ 85°C (TA)
Operating Temperature:
-30°C ~ 85°C (TA)
Supplier Device Package:
DIP-8
Packaging:
Tube
1,296
N/AGWIXP425ABBTIntelIC MPU INTEL 266MHZ PBGA492Microprocessors492-PBGA (35x35)N/A-40°C ~ 85°C (TA)
Core Processor:
Intel® IXP42X
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (2)
USB:
USB 1.1 (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
3DES, AES, DES, MD5, SHA-1
Mounting Type:
Surface Mount
Package / Case:
492-BBGA
Supplier Device Package:
492-PBGA (35×35)
Additional Interfaces:
HDLC, HSS, PCI, UART, UTOPIA 2
181
N/AGWIXP425ABCTIntelIC MPU INTEL 400MHZ PBGA492Microprocessors492-PBGA (35x35)N/A-40°C ~ 85°C (TA)
Core Processor:
Intel® IXP42X
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (2)
USB:
USB 1.1 (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
3DES, AES, DES, MD5, SHA-1
Mounting Type:
Surface Mount
Package / Case:
492-BBGA
Supplier Device Package:
492-PBGA (35×35)
Additional Interfaces:
HDLC, HSS, PCI, UART, UTOPIA 2
1,083
N/AGWIXP425BCTIntelIC MPU INTEL 400MHZ PBGA492Microprocessors492-PBGA (35x35)N/A-40°C ~ 85°C (TA)
Core Processor:
Intel® IXP42X
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (2)
USB:
USB 1.1 (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
3DES, AES, DES, MD5, SHA-1
Mounting Type:
Surface Mount
Package / Case:
492-BBGA
Supplier Device Package:
492-PBGA (35×35)
Additional Interfaces:
HDLC, HSS, PCI, UART, UTOPIA 2
787
N/AGWIXP455BABIntelIC MPU INTEL 266MHZ PBGA544Microprocessors544-PBGA (35x35)N/A0°C ~ 70°C (TA)
Core Processor:
Intel® IXP45x
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
Mll (3), SMII (3)
USB:
USB 1.1 (1), USB 2.0 (1)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Security Features:
3DES, AES, DES, MD5, RNG, SHA1
Mounting Type:
Surface Mount
Package / Case:
544-BBGA
Supplier Device Package:
544-PBGA (35×35)
Additional Interfaces:
I2C, PCI, SPI, SSP, UART, UTOPIA 2
228
N/AGWIXP455BACIntelIC MPU INTEL 400MHZ PBGA544Microprocessors544-PBGA (35x35)N/A0°C ~ 70°C (TA)
Core Processor:
Intel® IXP45x
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
Mll (3), SMII (3)
USB:
USB 1.1 (1), USB 2.0 (1)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Security Features:
3DES, AES, DES, MD5, RNG, SHA1
Mounting Type:
Surface Mount
Package / Case:
544-BBGA
Supplier Device Package:
544-PBGA (35×35)
Additional Interfaces:
I2C, PCI, SPI, SSP, UART, UTOPIA 2
1,034
N/AGWIXP455BADIntelIC MPU IXP455 533MHZ PBGA544Microprocessors544-PBGA (35x35)N/A0°C ~ 70°C (TA)
Core Processor:
Intel® IXP45x
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
533MHz
Co-Processors/DSP:
Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
Mll (3), SMII (3)
USB:
USB 1.1 (1), USB 2.0 (1)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Security Features:
3DES, AES, MD5, RNG, SHA1
Mounting Type:
Surface Mount
Package / Case:
544-BBGA
Supplier Device Package:
544-PBGA (35×35)
Additional Interfaces:
I2C, PCI, SPI, SSP, UART, UTOPIA 2
940
N/AGWIXP460BABIntelIC MPU INTEL 266MHZ PBGA544Microprocessors544-PBGA (35x35)N/A-40°C ~ 85°C (TA)
Core Processor:
Intel® IXP45X
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
Mll (3), SMII (3)
USB:
USB 1.1 (1), USB 2.0 (1)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
3DES, AES, DES, MD5, RNG, SHA1
Mounting Type:
Surface Mount
Package / Case:
544-BBGA
Supplier Device Package:
544-PBGA (35×35)
Additional Interfaces:
I2C, PCI, SPI, SSP, UART, UTOPIA 2
302
N/AGWIXP460BADIntelIC MPU INTEL 533MHZ PBGA544Microprocessors544-PBGA (35x35)N/A-40°C ~ 85°C (TA)
Core Processor:
Intel® IXP45X
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
533MHz
Co-Processors/DSP:
Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
Mll (3), SMII (3)
USB:
USB 1.1 (1), USB 2.0 (1)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
3DES, AES, DES, MD5, RNG, SHA1
Mounting Type:
Surface Mount
Package / Case:
544-BBGA
Supplier Device Package:
544-PBGA (35×35)
Additional Interfaces:
I2C, PCI, SPI, SSP, UART, UTOPIA 2
919
N/AGWIXP460BADTIntelIC MPU INTEL 533MHZ PBGA544Microprocessors544-PBGA (35x35)N/A-40°C ~ 85°C (TA)
Core Processor:
Intel® IXP45X
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
533MHz
Co-Processors/DSP:
Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
Mll (3), SMII (3)
USB:
USB 1.1 (1), USB 2.0 (1)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
3DES, AES, DES, MD5, RNG, SHA1
Mounting Type:
Surface Mount
Package / Case:
544-BBGA
Supplier Device Package:
544-PBGA (35×35)
Additional Interfaces:
I2C, PCI, SPI, SSP, UART, UTOPIA 2
1,001

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