| N/A | | FS32R294JAK0MJDR | NXP Semiconductors | S32R29 MULTICORE POWER ARCHITECT | Microcontrollers | 269-LFBGA (14x14) | N/A | N/A | Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14×14) | 482 | |
| N/A | | FS32R294JAK0MJDT | NXP Semiconductors | S32R29 MULTICORE POWER ARCHITECT | Microcontrollers | 269-LFBGA (14x14) | N/A | N/A | Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14×14) | 671 | |
| N/A | | FS32R294JCK0MJDR | NXP Semiconductors | S32R29 MULTICORE POWER ARCHITECT | Microcontrollers | N/A | N/A | N/A | N/A | 230 | |
| N/A | | FS32R294JCK0MJDT | NXP Semiconductors | S32R29 MULTICORE POWER ARCHITECT | Microcontrollers | 269-LFBGA (14x14) | N/A | – | Core Processor: e200z4, e200z7 Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FlexRay, QSPI, SPI Program Memory Type: ROMless Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14×14) | 1,048 | |
| N/A | | FS32R294KAK0MJDR | NXP Semiconductors | S32R29 MULTICORE POWER ARCHITECT | Microcontrollers | 269-LFBGA (14x14) | N/A | N/A | Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14×14) | 286 | |
| N/A | | FS32R294KAK0MJDT | NXP Semiconductors | S32R29 MULTICORE POWER ARCHITECT | Microcontrollers | 269-LFBGA (14x14) | N/A | N/A | Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14×14) | 50 | |
| N/A | | FS32R294KCK0MJDR | NXP Semiconductors | S32R29 MULTICORE POWER ARCHITECT | Microcontrollers | 269-LFBGA (14x14) | N/A | N/A | Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14×14) | 956 | |
| N/A | | FS32R294KCK0MJDT | NXP Semiconductors | S32R29 MULTICORE POWER ARCHITECT | Microcontrollers | 269-LFBGA (14x14) | N/A | N/A | Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14×14) | 1,156 | |
| N/A | | FS32R294LAK0MJDR | NXP Semiconductors | S32R29 MULTICORE POWER ARCHITECT | Microcontrollers | 269-LFBGA (14x14) | N/A | N/A | Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14×14) | 645 | |
| N/A | | FS32R294LAK0MJDT | NXP Semiconductors | S32R29 MULTICORE POWER ARCHITECT | Microcontrollers | 269-LFBGA (14x14) | N/A | – | Core Processor: e200z4, e200z7 (2) Speed: 250MHz, 500MHz, 430MHz Connectivity: CAN, Ethernet, FlexRay Program Memory Size: 3MB (3M x 8) Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14×14) | 1,334 | |
| N/A | | FS32R294LBK0MJDR | NXP Semiconductors | S32R29 MULTICORE POWER ARCHITECT | Microcontrollers | 269-LFBGA (14x14) | N/A | – | Core Processor: e200z4, e200z7 (2) Speed: 250MHz, 500MHz, 430MHz Connectivity: CAN, Ethernet, FlexRay Program Memory Size: 3MB (3M x 8) Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14×14) | 1,319 | |
| N/A | | FS32R294LBK0MJDT | NXP Semiconductors | S32R29 MULTICORE POWER ARCHITECT | Microcontrollers | 269-LFBGA (14x14) | N/A | – | Core Processor: e200z4, e200z7 (2) Speed: 250MHz, 500MHz, 430MHz Connectivity: CAN, Ethernet, FlexRay Program Memory Size: 3MB (3M x 8) Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14×14) | 828 | |
| N/A | | FS32R294LCK0MJDR | NXP Semiconductors | IC MCU 32BIT 2MB CRAM 269LFBGA | Microcontrollers | N/A | N/A | N/A | N/A | 889 | |
| N/A | | FS32R294LCK0MJDT | NXP Semiconductors | IC MCU 32BIT 2MB CRAM 269LFBGA | Microcontrollers | N/A | N/A | N/A | N/A | 609 | |
| N/A | | FS32R294LDK0MJDR | NXP Semiconductors | IC MCU 32BIT 2MB CRAM 269LFBGA | Microcontrollers | N/A | N/A | N/A | N/A | 64 | |
| N/A | | FS32R294LDK0MJDT | NXP Semiconductors | IC MCU 32BIT 2MB CRAM 269LFBGA | Microcontrollers | N/A | N/A | N/A | N/A | 1,707 | |
| N/A | | FS32R372SBK0MMMT | NXP Semiconductors | IC MCU 32B 1.3MB FLASH 257MAPBGA | Microcontrollers | 257-LFBGA (14x14) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, I2C, LINbus, SPI Peripherals: POR, PWM, WDT Program Memory Size: 1.3MB (1.3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.19V ~ 5.5V Data Converters: A/D 16x12b SAR Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 257-LFBGA (14×14) | 1,741 | |
| N/A | | FS32R372SBK0MMVT | NXP Semiconductors | IC MCU 32B 1.3MB FLASH 141MAPBGA | Microcontrollers | 141-MAPBGA (10x10) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, I2C, LINbus, SPI Peripherals: POR, PWM, WDT Program Memory Size: 1.3MB (1.3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.19V ~ 5.5V Data Converters: A/D 16x12b SAR Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 141-MAPBGA (10×10) | 598 | |
| N/A | | FS32R372SCK0MMMT | NXP Semiconductors | IC MCU 32B 1.3MB FLASH 257MAPBGA | Microcontrollers | 257-LFBGA (14x14) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, I2C, LINbus, SPI Peripherals: POR, PWM, WDT Program Memory Size: 1.3MB (1.3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.19V ~ 5.5V Data Converters: A/D 16x12b SAR Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 257-LFBGA (14×14) | 685 | |
| N/A | | FS32R372SDK0MMVT | NXP Semiconductors | IC MCU 32B 1.3MB FLASH 141MAPBGA | Microcontrollers | 141-MAPBGA (10x10) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, I2C, LINbus, SPI Peripherals: POR, PWM, WDT Program Memory Size: 1.3MB (1.3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.19V ~ 5.5V Data Converters: A/D 16x12b SAR Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 141-MAPBGA (10×10) | 380 | |