Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,622
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
GX1-233B-85-1.8GX1-233B-85-1.8Advanced Micro DevicesIC MPU 233MHZ 352EBGAMicroprocessors352-EBGA (35x35)N/A0°C ~ 85°C (TC)
Core Processor:
AMD Geode™ GX1
Number of Cores/Bus Width:
1 Core
Speed:
233MHz
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
USB:
USB (2)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 85°C (TC)
Mounting Type:
Surface Mount
Package / Case:
352-BGA Exposed Pad
Supplier Device Package:
352-EBGA (35×35)
Additional Interfaces:
AC’97, DMA, GPIO, PCI
1,482
N/AGX72170-DNTRenesasIC DRIVERDrivers, Receivers, TransceiversN/AN/AN/A

N/A

768
N/AN/AGX72472-GNURenesasIC MODULE REQUIRES WAFERDrivers, Receivers, TransceiversN/AN/AN/A

N/A

1,337
N/AN/AGX72472B-GNURenesasIC MODULE REQUIRES WAFERDrivers, Receivers, TransceiversN/AN/AN/A

N/A

326
N/AN/AGX74870-JIURenesasIC MODULE REQUIRES WAFERDrivers, Receivers, TransceiversN/AN/AN/A
Protocol:
SPI
597
N/AGX76470-DNTRenesasIC DRIVER 4/4Drivers, Receivers, TransceiversN/A-
Type:
Driver
Number of Drivers/Receivers:
4/4
Data Rate:
64Gps
769
N/AGX76471-DNTRenesasIC DRIVER 4/4Drivers, Receivers, TransceiversN/A-
Type:
Driver
Number of Drivers/Receivers:
4/4
Data Rate:
64Gps
914
N/AGX76472-DNTRenesasIC DRIVER 4/4Drivers, Receivers, TransceiversN/A-
Type:
Driver
Number of Drivers/Receivers:
4/4
Data Rate:
64Gps
813
N/AGX76473-DNTRenesasIC DRIVER 4/4Drivers, Receivers, TransceiversN/A-
Type:
Driver
Number of Drivers/Receivers:
4/4
Data Rate:
64Gps
1,387
N/AGX76474-F-DNTRenesasIC DRIVER 4/0 DIEDrivers, Receivers, TransceiversDie-
Type:
Driver
Number of Drivers/Receivers:
4/0
Data Rate:
64Gbps
Mounting Type:
Surface Mount
Package / Case:
Die
Supplier Device Package:
Die
540
N/AGX76476-DNTRenesasIC LINEAR DIFFDrivers, Receivers, TransceiversN/AN/AN/A

N/A

718
H54G46CYRBX267H54G46CYRBX267SK Hynix2GB LPDDR4/LPDDR4X 4266Mbps CommercialMemory200-FBGA (10×15)0.57V ~ 1.95V−25°C – 85°C
Memory Size:
2 GB
Clock Frequency:
2133 MHz
Write Cycle Time Word Page:
18 ns
Access Time:
3.5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
LPDDR4/LPDDR4X
Memory Organization:
2 × 512M × 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
200-FBGA
8,834
H54G46CYRVX267H54G46CYRVX267SK Hynix2GB LPDDR4X 4266Mbps AutomotiveMemory200-FBGA (10×15)0.57V ~ 1.95V−40°C – 95°C
Memory Size:
2 GB
Clock Frequency:
2133 MHz
Write Cycle Time Word Page:
18 ns
Access Time:
3.5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
LPDDR4X
Memory Organization:
2 × 512M × 16
Memory Interface:
Parallel
Grade:
Automotive
Qualification:
AEC-Q100
Packaging:
200-FBGA
3,952
N/AN/AHA13721FPK-ERenesasIC TRANSCEIVER 1/1 8PSOPDrivers, Receivers, Transceivers8-PSOP4.5V ~ 5.5V-40°C ~ 125°C
Type:
Transceiver
Protocol:
CANbus
Number of Drivers/Receivers:
1/1
Receiver Hysteresis:
200 mV
Data Rate:
1Mbps
Voltage – Supply:
4.5V ~ 5.5V
Operating Temperature:
-40°C ~ 125°C
Mounting Type:
Surface Mount
Package / Case:
8-SOIC (0.173″”, 4.40mm Width)
Supplier Device Package:
8-PSOP
211
N/AN/AHA13721FPKEL-ERenesasIC TRANSCEIVER 1/1 8PSOPDrivers, Receivers, Transceivers8-PSOP4.5V ~ 5.5V-40°C ~ 125°C
Type:
Transceiver
Protocol:
CANbus
Number of Drivers/Receivers:
1/1
Receiver Hysteresis:
200 mV
Data Rate:
1Mbps
Voltage – Supply:
4.5V ~ 5.5V
Operating Temperature:
-40°C ~ 125°C
Mounting Type:
Surface Mount
Package / Case:
8-SOIC (0.173″”, 4.40mm Width)
Supplier Device Package:
8-PSOP
501
N/AN/AHA13721RPJEEL-ERenesasICDrivers, Receivers, Transceivers8-SOP4.5V ~ 5.5V-40°C ~ 105°C
Type:
Transceiver
Protocol:
CANbus
Number of Drivers/Receivers:
1/1
Receiver Hysteresis:
200 mV
Data Rate:
1Mbps
Voltage – Supply:
4.5V ~ 5.5V
Operating Temperature:
-40°C ~ 105°C
Mounting Type:
Surface Mount
Package / Case:
8-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
8-SOP
549
N/AHAT1111C-EL-ERenesasMICROCONTROLLERMicrocontrollersN/AN/AN/A

N/A

1,192
HC1S30F780NAEHC1S30F780NAEIntelIC FPGA 597 I/O 780FBGAFPGAs780-FBGA (29x29)1.425V ~ 1.575VN/A
Number of LABs/CLBs:
3247
Number of Logic Elements/Cells:
32470
Total RAM Bits:
2137536
Number of I/O:
597
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Package / Case:
780-BBGA, FCBGA
Supplier Device Package:
780-FBGA (29×29)
996
HC1S60F1020AGHC1S60F1020AGIntelIC FPGA 782 I/O 1020FBGAFPGAs1020-FBGA (33x33)1.425 V - 1.575 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
782
Number of LABs/CLBs:
5712
Number of Logic Elements/Cells:
57120
Qualification:
N/A
Total RAM Bits:
5215104
653
HC1S60F1020BQHC1S60F1020BQIntelIC FPGA 782 I/O 1020FBGAFPGAs1020-FBGA (33x33)1.425V ~ 1.575VN/A
Number of LABs/CLBs:
5712
Number of Logic Elements/Cells:
57120
Total RAM Bits:
5215104
Number of I/O:
782
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Package / Case:
1020-BBGA
Supplier Device Package:
1020-FBGA (33×33)
38

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